Abstract: A host device includes: a data management module for receiving exercise data from an electronic device; a group management module for generating a group requiring preset conditions and determining whether to include the electronic device in the group based on whether the exercise data of the electronic device received from the data management module meets the conditions; and a league management module for, when the number of generated groups is two or more, controlling a configuration of the two or more groups based on a result of the determination on whether one or more electronic devices included in each of the two or more groups meet conditions required by the group whenever a preset period elapses.

Abstract: A host device includes: a data management module for receiving exercise data from an electronic device; a group management module for generating a group requiring preset conditions and determining whether to include the electronic device in the group based on whether the exercise data of the electronic device received from the data management module meets the conditions; and a league management module for, when the number of generated groups is two or more, controlling a configuration of the two or more groups based on a result of the determination on whether one or more electronic devices included in each of the two or more groups meet conditions required by the group whenever a preset period elapses.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming layers having non-horizontal strip patterns and non-vertical strip patterns over the substrate; mounting an integrated circuit device on the substrate adjacent the non-horizontal strip patterns and the non-vertical strip patterns; and applying an encapsulation over the integrated circuit device, the encapsulation restricted by the layers to prevent the encapsulation from reaching an edge of the substrate.

Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; forming layers having non-horizontal strip patterns and non-vertical strip patterns over the substrate; mounting an integrated circuit device on the substrate adjacent the non-horizontal strip patterns and the non-vertical strip patterns; and applying an encapsulation over the integrated circuit device, the encapsulation restricted by the layers to prevent the encapsulation from reaching an edge of the substrate.