Abstract: A magnet latch applying magnetic force for opening and closing the upper and lower cases is provided. The magnet latch includes a push button, a sliding block, a magnet, a magnetic hook, and an elastic member. To close the upper and lower cases, one moves the push button to slide the sliding block to one side. The magnetic hook is attracted by the magnet to move upwards. Once the magnetic hook attaches to the magnet, the push button is released and the sliding block moves toward and holds the magnetic hook, so as to achieve the purpose of magnetic latching. On the other hand, to open the upper case, one moves the push button to slide the sliding block to the other side, thereby opening up the upper case. Due to the weakened magnetic force and its own gravity, the magnetic hook returns back into the lower case.

Abstract: A magnet latch applying magnetic force for opening and closing the upper and lower cases is provided. The magnet latch includes a push button, a sliding block, a magnet, a magnetic hook, and an elastic member. To close the upper and lower cases, one moves the push button to slide the sliding block to one side. The magnetic hook is attracted by the magnet to move upwards. Once the magnetic hook attaches to the magnet, the push button is released and the sliding block moves toward and holds the magnetic hook, so as to achieve the purpose of magnetic latching. On the other hand, to open the upper case, one moves the push button to slide the sliding block to the other side, thereby opening up the upper case. Due to the weakened magnetic force and its own gravity, the magnetic hook returns back into the lower case.

Abstract: The present invention relates to a multi-layer photoresist and the method for making the same and method for etching a substrate. The multi-layer photoresist comprises a plurality of photoresist layers, wherein the photoresist layers have different photoreceptive areas. Therefore, the multi-layer photoresist itself has different light transmitting effects. Thus, a substrate is etched to form a 3D structure by utilizing the multi-layer photoresist directly. The conventional process of applying the photoresist for a second time is not necessary, and naturally the disadvantage that the conventional second photoresist layer is not easily controlled is eliminated, thus the etching quality is improved and the efficiency is high.