Patents by Inventor Jung Hoo Lim

Jung Hoo Lim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240105694
    Abstract: A semiconductor package includes a semiconductor chip including a first area and a second area around the first area, and a substrate including a second surface, the second surface facing a first surface of the semiconductor chip, a first trench defined on the second surface, and the first trench at least partially overlapping the second area of the semiconductor chip. The semiconductor package includes a bump structure including first bumps on the first area of the semiconductor chip, and second bumps on the second area of the semiconductor chip, the bump structure between the substrate and the semiconductor chip, and a first passive device in the first trench. The second bumps are in contact with the first surface of the semiconductor chip and the first passive device.
    Type: Application
    Filed: September 11, 2023
    Publication date: March 28, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Jung Hoo YUN, Jae Moon LIM
  • Publication number: 20230242196
    Abstract: A vehicle body assembly system each forming a pre-buck section and a main-buck section set along a transport path of the floor assembly according to an exemplary embodiment of the present disclosure includes a pre-buck unit configured in the pre-buck section to regulate the seal side and the front and rear sides of side assemblies that are different for each vehicle type, and to assemble the side assembly and the floor assembly, and a main-buck unit configured in the main-buck section to regulates the roof portion and the quarter portion of the side assembly assembled to the floor assembly in the pre-buck section, assemble the roof portion, cowl, roof rail and package tray and assemble the quarter portion and the floor assembly.
    Type: Application
    Filed: March 30, 2023
    Publication date: August 3, 2023
    Inventors: Yongcheol Jeong, Sekyu Kang, Eun Sik Yoon, Seon Woo Kweon, Haejung Kang, Suwhan Kim, Jung Hoo Lim, Keonyong Kim
  • Patent number: 11643158
    Abstract: A vehicle body assembly system each forming a pre-buck section and a main-buck section set along a transport path of the floor assembly according to an exemplary embodiment of the present disclosure includes a pre-buck unit configured in the pre-buck section to regulate the seal side and the front and rear sides of side assemblies that are different for each vehicle type, and to assemble the side assembly and the floor assembly, and a main-buck unit configured in the main-buck section to regulates the roof portion and the quarter portion of the side assembly assembled to the floor assembly in the pre-buck section, assemble the roof portion, cowl, roof rail and package tray and assemble the quarter portion and the floor assembly.
    Type: Grant
    Filed: January 4, 2021
    Date of Patent: May 9, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Yongcheol Jeong, Sekyu Kang, Eun Sik Yoon, Seon Woo Kweon, Haejung Kang, Suwhan Kim, Jung Hoo Lim, Keonyong Kim
  • Publication number: 20220024533
    Abstract: A vehicle body assembly system each forming a pre-buck section and a main-buck section set along a transport path of the floor assembly according to an exemplary embodiment of the present disclosure includes a pre-buck unit configured in the pre-buck section to regulate the seal side and the front and rear sides of side assemblies that are different for each vehicle type, and to assemble the side assembly and the floor assembly, and a main-buck unit configured in the main-buck section to regulates the roof portion and the quarter portion of the side assembly assembled to the floor assembly in the pre-buck section, assemble the roof portion, cowl, roof rail and package tray and assemble the quarter portion and the floor assembly.
    Type: Application
    Filed: January 4, 2021
    Publication date: January 27, 2022
    Inventors: Yongcheol Jeong, Sekyu Kang, Eun Sik Yoon, Seon Woo Kweon, Haejung Kang, Suwhan Kim, Jung Hoo Lim, Keonyong Kim
  • Patent number: 9483828
    Abstract: A system for recognizing a vehicle identification number includes a three dimensional scanner configured to scan, in a direction in which the vehicle identification number is engraved, a vehicle identification number engraved in a vehicle body to obtain an image. The system further includes an image processor configured to convert the image obtained by the three dimensional scanner into a gray image, divide the gray image according to a gray scale to extract a symbol in the image corresponding to a symbol engraved in the vehicle body, and compare the symbol with standard symbols to determine the vehicle identification number.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: November 1, 2016
    Assignee: HYUNDAI MOTOR COMPANY
    Inventors: Yoon Jang, Jung Hoo Lim
  • Publication number: 20150294471
    Abstract: A system for recognizing a vehicle identification number includes a three dimensional scanner configured to scan, in a direction in which the vehicle identification number is engraved, a vehicle identification number engraved in a vehicle body to obtain an image. The system further includes an image processor configured to convert the image obtained by the three dimensional scanner into a gray image, divide the gray image according to a gray scale to extract a symbol in the image corresponding to a symbol engraved in the vehicle body, and compare the symbol with standard symbols to determine the vehicle identification number.
    Type: Application
    Filed: November 13, 2014
    Publication date: October 15, 2015
    Inventors: Yoon JANG, Jung Hoo Lim