Abstract: A method for manufacturing a semiconductor light emitting device package includes forming a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on a growth substrate, forming a reflective layer on a first surface of the light emitting structure corresponding to a surface of the second conductivity-type semiconductor layer, forming bumps on the first surface, the bumps being electrically connected to the first or second conductivity-type semiconductor layer and protruding from the reflective layer, bonding a support substrate to the bumps on the first surface, removing the growth substrate, bonding a light transmissive substrate coated with a wavelength conversion layer to a second surface of the light emitting structure from which the growth substrate is removed, and removing the support substrate.

Abstract: An electronic device and a method for controlling the electronic device are provided. The electronic device includes a light emitter, an image sensor including a plurality of first pixels controlled based on a first parameter, and a plurality of second pixels controlled based on a second parameter, at least one sensor, and a processor.

Abstract: The present invention relates to a vibrating mouse providing a haptic feedback corresponding to visual information, the vibrating mouse in which: a piezoelectric element layer, which has a piezoelectric effect, and a central electrode plate are integrally formed so as to constitute a piezoelectric vibration body; both ends of the piezoelectric vibration body are fixed so as to generate vibration by vertical bending displacement; one or more actuators, to which a weight piece for increasing vibration in the piezoelectric vibration body is attached and fixed, are provided inside a body of a vibrating mouse so as to respond, with varying vibrations in a high frequency band, thereby transmitting various amounts of vibration corresponding to the visual information, by means of a quick vibration response, and transmit visual information and vibratory tactility with a quick response speed such that the user can have a visual and tactile experience simultaneously.

Abstract: Provided is a solid state drive apparatus having improved reliability. The solid state drive apparatus includes: a substrate on which at least one non-volatile memory device is mounted; a main body case in which the substrate is mounted, wherein an accommodating portion is formed at a corner of the main body case; a bumper case mounted in the accommodating portion of the main body case; and an shock-absorbing member connecting the main body case and the bumper case to each other such that a separation distance is provided between the main body case and the bumper case, wherein the main body case and the bumper case form an exterior of the solid state drive apparatus as adjacent portions of the main body case and the bumper case are located on a same plane with the separation distance therebetween.

Abstract: A flat panel lighting apparatus, which makes it easy to replace a circuit board with LEDs thereon, is provided. The flat panel lighting apparatus includes a backplate, a driving unit, a light guide plate, a frame, a bracket, a circuit board, a connector and a cable connecting the driving unit and the circuit board. The frame with an opening portion is disposed at an outer periphery of the backplate and the light guide plate. The bracket is detachably coupled to the opening portion of the frame. The circuit board with light sources, is disposed in a space between the frame and the light guide plate, and is replaceable in a sliding type through the opening portion of the frame when the bracket is decoupled from the frame. The connector has a female terminal attached to the circuit board and a male terminal detachably coupled to the female terminal.

Abstract: A light-emitting element mounting substrate is provided.

Abstract: A source drive integrated circuit includes a source driving circuit, output buffers, and voltage protection circuits. The source driving circuit generates data voltages according to a source timing control signal and digital video data. The output buffers output the data voltages from the source driving circuit to output terminals. The voltage protection circuits are connected between the output buffers and the output terminals. A voltage supplied to at least one of the voltage protection circuits is different from a voltage supplied to remaining ones of the voltage protection circuits.

Abstract: A method for manufacturing a semiconductor light emitting device package includes forming a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on a growth substrate, forming a reflective layer on a first surface of the light emitting structure corresponding to a surface of the second conductivity-type semiconductor layer, forming bumps on the first surface, the bumps being electrically connected to the first or second conductivity-type semiconductor layer and protruding from the reflective layer, bonding a support substrate to the bumps on the first surface, removing the growth substrate, bonding a light transmissive substrate coated with a wavelength conversion layer to a second surface of the light emitting structure from which the growth substrate is removed, and removing the support substrate.

Abstract: A secondary memory device includes: a substrate and a housing configured to accommodate at least a part of the substrate. The substrate has upper and lower opposed surfaces and includes a first region in which a first semiconductor device is mounted on the upper surface and a second region in which a second semiconductor device is mounted on the upper surface. The housing includes a first sub-housing covering the upper surface of the substrate at the first region and the first semiconductor device. The first sub-housing does not extend to cover the upper surface of the substrate at the second region.

Abstract: A receptacle assembly is disclosed having a plurality of contact pins, a contact aligning block, a block receiving body, a housing, and a retaining plate. The contact aligning block is formed to retain the contact pins, and into which a portion of the contact pins is inserted. The block receiving body is overmolded to cover the contact aligning block. The block receiving body is positioned in the housing. The retaining plate is positioned against the block receiving body, applying a force against the block receiving body, and compressively holding and retaining the block receiving body in the housing.

Abstract: A method of manufacturing a fine metal mask is provided. The method of manufacturing a fine metal mask includes: forming a first recessed portion in a first surface of a base member; forming an edge portion of the first recessed portion in a uniform depth; forming a second recessed portion in a second surface of the base member, the second surface being opposite to the first surface; and communicating the first recessed portion and the second recessed portion of the base member. A fine metal mask produced by the inventive method is also described and may be used to fabricate OLEDs having better resolution and an increased aperture ratio in comparison with OLEDs prepared using the fine metal masks of the conventional art.

Abstract: A reaction-type turbine according to the present invention is configured in that a portion of a rotary shaft module which penetrates through a side with an inlet portion of a housing has a diameter larger than the diameters of other portions. Thus, the pressurized area in which a working fluid applies pressure to a rotary shaft in the direction opposite to the working fluid flow direction increases, thus increasing force in the direction opposite to the working fluid flow direction. As a result, axial direction force applied to the rotary shaft in the working fluid flow direction may be reduced. Therefore, the reaction-type turbine of the present invention has the advantages of eliminating the necessity of installing a separate thrust bearing for supporting axial force in the working fluid flow direction.

Abstract: A method of manufacturing a 3D LDS liner includes providing an LDS sheet, forming 3D contoured liners in the LDS sheet, laser structuring circuit patterns on the 3D contoured liners to provide a laser structured circuit pattern, selectively plating the laser structured circuit patterns to form circuits on the 3D contoured liners, and removing the 3D contoured liners from the LDS sheet. A formed LDS liner includes a thin LDS film having a 3D contoured surface vacuum formed from an LDS sheet. The LDS film includes an inner surface and an outer surface. A laser structured circuit pattern is etched into the LDS film, and a conductive layer is selectively plated on the laser structured circuit pattern forming a circuit on the LDS film. The circuit may have a non-planar region.

Abstract: There is provided a light-emitting element mounting substrate which includes: an insulative base plate including a first surface and a second surface opposed to each other; a first conductive pad formed on the first surface of the insulative base plate; a second conductive pad formed on the first surface of the insulative base plate, and being separated from the first conductive pad; a first through hole and a second through hole penetrating through the insulative base plate and being separated from each other; a first through conduit filling the first through hole and being adjoined with the first conductive pad; and a second through conduit filling the second through hole and being adjoined with the second conductive pad, wherein, with reference to the first surface of the insulative base plate, a sum of an area of the first through conduit and an area of the second through conduit is between 20% and 80% of an area of the first surface of the insulative base plate.

Abstract: A universal serial bus (USB) device, an electronic apparatus including the same and a control method thereof are provided. The electronic apparatus includes a signal transceiver configured to transmit and receive a signal to and from an external apparatus; a first processor configured to communicate with the external apparatus; a switching unit configure to selectively supply a signal generating power to a signal transmission line between the signal transceiver and the first processor; a second processor configured to control the switching unit to generate a conversion signal corresponding to a predetermined event signal if the signal received from the external apparatus comprises the predetermined event signal; and a third processor configured to control the first processor to communicate with the external apparatus if the conversion signal is received.

Abstract: A piezoelectric vibration device for a mobile terminal is disclosed. A bimorph piezoelectric vibrator includes a pair of piezoelectric element layers connected to one of positive and negative poles and a middle electrode plate interposed between the piezoelectric element layers and connected to the other pole. The piezoelectric vibrator generates vibration due to up/down bending displacement by fixing both end portions thereof to an inner surface of a casing of a mobile terminal. A voltage-boosting transformer raises a power source voltage of a mobile terminal to a driving voltage. A driving chip receives the raised driving voltage from the voltage-boosting transformer and drives the piezoelectric vibrator. Weights are attached to at least one of both sides of the piezoelectric vibrator to amplify vibration. Insulation members are provided at both end portions of the piezoelectric vibrator to prevent electricity applied to the piezoelectric vibrator from leaking to the casing.

Abstract: A nonvolatile memory device includes an active region extending in a first direction, a first single-layered gate intersecting the active region and extending in a second direction, a second single-layered gate intersecting the, active region and extending in the second direction, and a selection gate intersecting, the active region.

Abstract: Provided is a solid state drive apparatus having improved reliability. The solid state drive apparatus includes: a substrate on which at least one non-volatile memory device is mounted; a main body case in which the substrate is mounted, wherein an accommodating portion is formed at a corner of the main body case; a bumper case mounted in the accommodating portion of the main body case; and an shock-absorbing member connecting the main body case and the bumper case to each other such that a separation distance is provided between the main body case and the bumper case, wherein the main body case and the bumper case form an exterior of the solid state drive apparatus as adjacent portions of the main body case and the bumper case are located on a same plane with the separation distance therebetween.

Abstract: A solid state drive apparatus includes a housing having a first accommodation space and a second accommodation space; a substrate mounted in the first accommodation space, wherein at least one non-volatile memory chip is mounted on the substrate; and a heat dissipation member mounted in the second accommodation space and including an isolation barrier that defines a boundary between the second accommodation space and the first accommodation space and a plurality of fin portions that extend from the isolation barrier away from the first accommodation space, wherein a plurality of through air holes are provided in a side of the housing adjacent the second accommodation space.

Abstract: The present invention provides an LED bulb using heat dissipating LED driver capable of reducing heat influence by disposing an electrolytic capacitor in an output part at a low temperature region through disposing a section receiving an external power close to a light generating module and disposing a section controlling a light emitting diode dose to a power source base.