Patents by Inventor Jung Hoon Kwon

Jung Hoon Kwon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10241617
    Abstract: An electronic device is provided. The electronic device includes a display, a first sensor, a second sensor, and a processor configured to obtain, using the first sensor, location information corresponding to an active area of the display, in response to contact between an external object and the display, obtain, using the second sensor, pressure information corresponding to a pressure applied to the display resulting from the contact between the external object and the display, and determine a validity of the location information based on whether the pressure information satisfies a designated condition.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: March 26, 2019
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sung Jun Lee, Jun Ik Lee, Jung Hoon Kwon, Gyu Won Moon, Bo Kyung Moon, Jae Min Lee
  • Publication number: 20170108992
    Abstract: An electronic device is provided. The electronic device includes a display, a first sensor, a second sensor, and a processor configured to obtain, using the first sensor, location information corresponding to an active area of the display, in response to contact between an external object and the display, obtain, using the second sensor, pressure information corresponding to a pressure applied to the display resulting from the contact between the external object and the display, and determine a validity of the location information based on whether the pressure information satisfies a designated condition.
    Type: Application
    Filed: October 14, 2016
    Publication date: April 20, 2017
    Inventors: Sung Jun LEE, Jun lk LEE, Jung Hoon KWON, Gyu Won MOON, Bo Kyung MOON, Jae Min LEE
  • Patent number: 7643026
    Abstract: Disclosed herein is an apparatus and method for deforming a curved surface using a three-dimensional target curve. The curved surface deformation apparatus of the present invention includes object curved surface selection means, sample vertex extraction means, basis function calculation means, target curve input means, control point variation calculation means, and object curved surface deformation means. The object curved surface selection means selects all or part of the curved surface of the NURBS model. The sample vertex extraction means extracts a plurality of vertexes from the object curved surface. The basis function calculation means calculates a basis function of the object curved surface. The target curve input means inputs a target curve, composed of a plurality of target. The target curve projection means projects the target curve onto the object curved surface.
    Type: Grant
    Filed: January 12, 2007
    Date of Patent: January 5, 2010
    Assignee: Chung-Ang University Industry-Academic Cooperation Foundation
    Inventors: Young Ho Chai, Jung Hoon Kwon, Jeong In Lee
  • Publication number: 20070229544
    Abstract: Disclosed herein is an apparatus and method for deforming a curved surface using a three-dimensional target curve. The curved surface deformation apparatus of the present invention includes object curved surface selection means, sample vertex extraction means, basis function calculation means, target curve input means, control point variation calculation means, and object curved surface deformation means. The object curved surface selection means selects all or part of the curved surface of the NURBS model. The sample vertex extraction means extracts a plurality of vertexes from the object curved surface. The basis function calculation means calculates a basis function of the object curved surface. The target curve input means inputs a target curve, composed of a plurality of target. The target curve projection means projects the target curve onto the object curved surface.
    Type: Application
    Filed: January 12, 2007
    Publication date: October 4, 2007
    Applicant: CHUNG-ANG UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Young Ho Chai, Jung Hoon Kwon, Jeong In Lee
  • Publication number: 20040232526
    Abstract: A lead frame for stacked semiconductor package is provided, which comprises a plurality of lead pins having same length, thickness, pitch and arranged to correspond to exterior leads of a semiconductor package, and a frame holding the lead pins, wherein at least one lead pin is integrally formed with an adjacent lead pin to be electrically connected and a part of the end of the lead pin is cut to be shorter that other lead pins. Additionally and/or alternatively, at least one lead pin is electrically connected with a remote lead pin through an additional lead or a lead line.
    Type: Application
    Filed: April 29, 2003
    Publication date: November 25, 2004
    Inventors: Rak-Hyun Ryoo, Jung-Hoon Kwon