Abstract: A heat dissipating system of a multi-media computer includes a computer case, a first heat dissipating area, and a second heat dissipating area. The first heat dissipating area is formed on an inner side of the computer case, wherein a hard disk driver, a video graphics card, and a TV tuner card are installed therein. The second heat dissipating area is formed on the other inner side of the computer case, wherein a power supply module is installed therein. Heat flows are formed in the first heat dissipating area and the second heat dissipating area respectively.

Abstract: A thermal structure includes a fin module, a heat sink base, a heat pipe, a fan housing, and a fan. One end of the heat pipe is connected with the fin module and the other end of the heat pipe is installed on the heat sink base. The fan housing is fixed on the fin module. Blades are installed inside the fan housing. The fan includes inlets on an upper surface and a lower surface of the fan housing and a outlet on a side surface of the fan housing, so as to absorb heat through the inlet and eliminate the heat through the outlet. Therefore, the heat dissipating efficiency is improved.

Abstract: A thermal structure includes a fin module, a heat sink base, a heat pipe, a fan housing, and a fan. One end of the heat pipe is connected with the fin module and the other end of the heat pipe is installed on the heat sink base. The fan housing is fixed on the fin module. Blades are installed inside the fan housing. The fan includes inlets on an upper surface and a lower surface of the fan housing and a outlet on a side surface of the fan housing, so as to absorb heat through the inlet and eliminate the heat through the outlet. Therefore, the heat dissipating efficiency is improved.

Abstract: A cooling device having a slanted heat pipe. The cooling device includes a cooling fin set, a cooling substrate and at least a heat pipe. The cooling substrate is disposed at one side of the cooling fin set. The heat pipe includes an absorption region and a dissipation region. The dissipation region is disposed on the cooling fin set, while the absorption region is affixed to the cooling substrate. The heat pipe is slanted between the cooling substrate and the cooling fin set with an altitude difference. Consequently, the dissipation region of the heat pipe is located higher than the absorption region. In this manner, both the vaporized working fluid and the condensed working fluid can transfer rapidly between one end of the heat pipe to the other end. Thus, an enhanced cooling rate is obtained.

Abstract: A heat dissipating system of a multi-media computer includes a computer case, a first heat dissipating area, and a second heat dissipating area. The first heat dissipating area is formed on an inner side of the computer case, wherein a hard disk driver, a video graphics card, and a TV tuner card are installed therein. The second heat dissipating area is formed on the other inner side of the computer case, wherein a power supply module is installed therein. Heat flows are formed in the first heat dissipating area and the second heat dissipating area respectively.

Abstract: The present invention provides a method for reducing the thermal resistance of a heat dissipating base, which comprises the steps of: providing a base, having at least one guide slot that is not penetrating inside said base; coupling at least one heat conduction pipe to an outlet of said guide slot; sintering some copper powder on a inner wall of said guide slot and said heat conduction pipe respectively for conducting heat; injecting some liquid into said heat conduction pipe for heat exchanging; extracting the air of said guide slot and said heat conduction pipe to make them to become a vacuum status; and sealing another outlet of said heat conduction pipe. Furthermore, the present invention also provides a heat dissipating base.