Patents by Inventor Jung-Hua Huang

Jung-Hua Huang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11948876
    Abstract: A package structure is provided. The package structure includes a conductive structure having a first portion and a second portion, and the second portion is wider than the first portion. The package structure also includes a semiconductor chip laterally separated from the conductive structure. The package structure further includes a protective layer laterally surrounding the conductive structure and the semiconductor chip. The first portion of the conductive structure has a sidewall extending from the second portion to a surface of the protective layer. The protective layer laterally surrounds an entirety of the sidewall of the first portion.
    Type: Grant
    Filed: January 20, 2023
    Date of Patent: April 2, 2024
    Inventors: Ling-Wei Li, Jung-Hua Chang, Cheng-Lin Huang
  • Patent number: 11935826
    Abstract: A method includes depositing a first passivation layer over a conductive feature, wherein the first passivation layer has a first dielectric constant, forming a capacitor over the first passivation layer, and depositing a second passivation layer over the capacitor, wherein the second passivation layer has a second dielectric constant greater than the first dielectric constant. The method further includes forming a redistribution line over and electrically connecting to the capacitor, depositing a third passivation layer over the redistribution line, and forming an Under-Bump-Metallurgy (UBM) penetrating through the third passivation layer to electrically connect to the redistribution line.
    Type: Grant
    Filed: March 10, 2021
    Date of Patent: March 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chia-Ming Huang, Ming-Da Cheng, Songbor Lee, Jung-You Chen, Ching-Hua Kuan, Tzy-Kuang Lee
  • Publication number: 20240088090
    Abstract: A chip package structure is provided. The chip package structure includes a first substrate. The chip package structure includes a conductive via structure passing through the first substrate. The chip package structure includes a barrier layer over a surface of the first substrate. The chip package structure includes an insulating layer over the barrier layer. The chip package structure includes a conductive pad over the insulating layer. The conductive pad has a first portion passing through the insulating layer and the barrier layer and connected to the conductive via structure. The chip package structure includes a conductive bump over the conductive pad. The chip package structure includes a second substrate. The chip package structure includes an underfill layer between the first substrate and the second substrate.
    Type: Application
    Filed: November 24, 2023
    Publication date: March 14, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ling-Wei LI, Jung-Hua CHANG, Cheng-Lin HUANG
  • Patent number: 5722168
    Abstract: A saw includes a slot formed in one end of a handle. A saw blade is engaged in the slot and rotatably secured to the handle at a rod. The rod includes a projection of smaller size. The saw blade includes a groove of smaller size for engaging with the projection and includes an aperture for engaging with the rod so as to prevent the rod from disengaging from the saw blade when the rod is engaged in the aperture of the saw blade. The saw blade includes a number of notches for engaging with a latch so as to be adjusted to different angular position relative to the handle.
    Type: Grant
    Filed: July 29, 1996
    Date of Patent: March 3, 1998
    Inventor: Jung Hua Huang
  • Patent number: D301962
    Type: Grant
    Filed: March 25, 1986
    Date of Patent: July 4, 1989
    Inventor: Jung-Hua Huang
  • Patent number: D307383
    Type: Grant
    Filed: May 19, 1987
    Date of Patent: April 24, 1990
    Inventor: Jung-Hua Huang