Patents by Inventor Jung-Hua Wei

Jung-Hua Wei has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes
    Patent number: 7226531
    Abstract: Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes is disclosed, including electroplating a substrate having a conductive baseline on a surface thereof in an electroplating bath containing a metal ion and carbon nanotubes, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline. Alternatively, a method of the present invention includes preparing a dispersion of carbon nanotubes dispersed in an organic solvent, printing a baseline with the dispersion on a surface of a substrate, evaporating the organic solvent to obtain a conductive baseline, and electroplating the surface in an electroplating bath containing a metal ion, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: June 5, 2007
    Assignee: Industrial Technology Research Institute
    Inventors: Po-Yuan Lo, Jung-Hua Wei, Bae-Horng Chen, Jih-Shun Chiang, Chian-Liang Hwang, Ming-Jer Kao
  • Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes
    Publication number: 20070056855
    Abstract: Method of making an electroplated interconnection wire of a composite of metal and carbon nanotubes is disclosed, including electroplating a substrate having a conductive baseline on a surface thereof in an electroplating bath containing a metal ion and carbon nanotubes, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline. Alternatively, a method of the present invention includes preparing a dispersion of carbon nanotubes dispersed in an organic solvent, printing a baseline with the dispersion on a surface of a substrate, evaporating the organic solvent to obtain a conductive baseline, and electroplating the surface in an electroplating bath containing a metal ion, so that an electroplated interconnection wire of a composite of the metal and carbon nanotubes is formed on the conductive baseline.
    Type: Application
    Filed: December 12, 2005
    Publication date: March 15, 2007
    Applicant: Industrial Technology Research Institute
    Inventors: Po-Yuan Lo, Jung-Hua Wei, Bae-Horng Chen, Jih-Shun Chiang, Chian-Liang Hwang, Ming-Jer Kao