Abstract: A lock structure. The lock structure includes a first element, a second element, a guiding element and a fixing pin. The first element has a guide hole and a first through hole located under the guide hole. The second element is deposed under the first element and has a second through hole that is co-axially aligned with the first through hole. The guiding element rotates and is movably disposed in the guide hole. The guiding element has a third through hole aligned with the first through hole. The fixing pin is inserted through the third through hole, guide hole, first through hole and second through hole and has a first retaining portion. The first retaining portion is formed on the lower portion of the fixing pin and located under the second element.

Abstract: A lock structure. The lock structure includes a first element, a second element, a guiding element and a fixing pin. The first element has a guide hole and a first through hole located under the guide hole. The second element is deposed under the first element and has a second through hole that is co-axially aligned with the first through hole. The guiding element rotates and is movably disposed in the guide hole. The guiding element has a third through hole aligned with the first through hole. The fixing pin is inserted through the third through hole, guide hole, first through hole and second through hole and has a first retaining portion. The first retaining portion is formed on the lower portion of the fixing pin and located under the second element.

Abstract: A wafer/loadport assembly that has a built-in, self-identification system and a method for operating the assembly are described. The wafer cassette is equipped with recessed holes provided with electrically conductive plates for contacting locating pins on a loadport wherein the locating pins are provided with electrically conductive tips for allowing a current to flow through the plate. By different combinations of the electrically conductive tips and the electrically conductive plates provided in the recess holes, the type of wafer cassette can be determined and identified by the process controller.

Abstract: A wafer/loadport assembly that has a built-in, self-identification system and a method for operating the assembly are described. The wafer cassette is equipped with recessed holes provided with electrically conductive plates for contacting locating pins on a loadport wherein the locating pins are provided with electrically conductive tips for allowing a current to flow through the plate. By different combinations of the electrically conductive tips and the electrically conductive plates provided in the recess holes, the type of wafer cassette can be determined and identified by the process controller.

Abstract: An apparatus for the real-time monitoring and control of a wafer temperature in a semiconductor process chamber, such as a plasma assisted deposition chamber or etch chamber, is provided. The apparatus is constructed by a wafer platform, a heat exchanger for flowing a heat exchanging medium into the wafer platform, an optical sensor for sensing the temperature of a wafer positioned on the wafer platform, and a controller for receiving a signal from the optical sensor, comparing to a pre-stored value and sending a signal to the heat exchanger to increase or decrease a flow of the heat exchanging medium. In another embodiment, a plurality of thermoelectric cooling modules is utilized for enhancing the temperature control capability of the heat exchanger by embedding the modules in the wafer platform, such as an electrostatic chuck.

Abstract: An apparatus for the real-time monitoring and control of a wafer temperature in a semiconductor process chamber, such as a plasma assisted deposition chamber or etch chamber, is provided. The apparatus is constructed by a wafer platform, a heat exchanger for flowing a heat exchanging medium into the wafer platform, an optical sensor for sensing the temperature of a wafer positioned on the wafer platform, and a controller for receiving a signal from the optical sensor, comparing to a pre-stored value and sending a signal to the heat exchanger to increase or decrease a flow of the heat exchanging medium. In another embodiment, a plurality of thermoelectric cooling modules is utilized for enhancing the temperature control capability of the heat exchanger by embedding the modules in the wafer platform, such as an electrostatic chuck.