Abstract: Embodiments relate to a polymer film. The polymer film comprises a polymer resin selected from the group consisting of a polyamide-based resin and a polyimide-based resin and has a haze (HZ0) before autoclave treatment of 3% or less and a ?HZ24 represented by Equation 1a of 500% or less.

Abstract: An atomic layer deposition method for manufacturing a platinum-based alloy catalyst includes applying a support in a reactor and depositing an alloy of platinum and a non-platinum metal on the support through a super cycle comprising a first sub-cycle and a second sub-cycle.

Abstract: The present invention relates to a compound capable of lowering the flammability of a non-aqueous electrolyte when included in the non-aqueous electrolyte and improving the life properties of a battery by forming an electrode-electrolyte interface which is stable at high temperatures and low in resistance, and relates to a compound represented by Formula I descried herein, a non-aqueous electrolyte solution and a lithium secondary battery both including the compound, n, m, Ak, and X are described herein.

Abstract: An apparatus for sensing voltage information of a fuel cell includes: a sensing unit configured to sense voltages of each cell and all cells included in a fuel cell; a controller configured to control the sensing unit to sense the voltages of each cell and all the cells of the fuel cell according to a command of an upper controller, or to transmit information of the sensed voltages of each cell and all the cells to the upper controller; and the upper controller configured to detect an error cell by calculating output power of the fuel cell based on the information of the voltages received from the controller, to substantially prevent damage to a surrounding cell by stopping an operation of the error cell, and to control the output power in real time in correspondence with a state of the fuel cell.

Abstract: A coil member according to an embodiment comprises: a substrate having a first surface and a second surface opposite to the first surface; a first circuit pattern disposed on the first surface; and a plurality of bridge portions protruding from an end of the substrate, wherein the bridge portions are integrally formed with the substrate, and a shield layer is disposed on the bridge portions.

Abstract: A coil member, according to an embodiment, comprises: a substrate comprising a first surface and a second surface that is opposite to the first surface; a wiring pattern disposed on the substrate; and a metal coating pattern which is connected to the wiring pattern, the metal coating pattern being thinner than the wiring pattern.

Abstract: Disclosed herein are a flexible thermoelectric module cell for a touch sensor, a touch sensor including the same, and a method of manufacturing the flexible thermoelectric module cell for a touch sensor. The flexible thermoelectric module cell is applicable to cells for touch sensors of various designs, without the need for a person to go directly to an industrially dangerous place.

Abstract: An embodiment discloses a semiconductor device package comprising: a substrate; an electrode disposed on the substrate; a semiconductor device and a protective device which are disposed on the electrode; a dummy electrode disposed on the substrate and spaced apart from the electrode along the edge of the substrate; a reflective member disposed on the dummy electrode and having an outer surface, an inner surface surrounding the semiconductor device and forming a cavity, and a bottom surface facing the substrate; and a light-transmitting member disposed on the reflective member and covering the cavity, wherein the inner surface includes a first surface adjacent to the substrate and a second surface extending from the first surface to the light-transmitting member and having a parabolic shape, and the bottom surface of the reflective member has a first recess disposed on the protective device between the dummy electrode and the inner surface.

Abstract: An embodiment discloses a semiconductor element package and a light-emitting device comprising same. The semiconductor element package comprises: a body comprising a cavity; a first electrode and a second electrode arranged on the bottom surface of the cavity; a semiconductor element arranged on the first electrode; a protective element arranged on the first electrode and spaced apart from the semiconductor element; a first wire electrically connecting the semiconductor element and the second electrode; and a second wire electrically connecting the protective element and the second electrode. The second electrode is arranged to be spaced apart from the first electrode in a first direction. The second electrode overlaps the semiconductor element in the first direction. The protective element is arranged to deviate from the semiconductor element in a second direction that is perpendicular to the first direction.

Abstract: An embodiment provides a semiconductor device package and a light emitting device comprising same, the semiconductor device package comprising: a body including a first cavity; and a semiconductor device disposed within the first cavity, wherein: the first cavity includes a first surface inclined such that the area of the cavity gradually increases as going away from the semiconductor device, and a plurality of second surfaces perpendicular to the upper surface of the semiconductor device; the body includes a first outer surface and a third outer surface that are opposite to each other, a second outer surface and a fourth surface that are opposite to each other, a first corner portion disposed in a region where the first and second outer surfaces meet each other, a second corner portion disposed in a region where the second and third outer surfaces meet each other, a third corner portion disposed in a region where the third and fourth outer surfaces meet each other, and a fourth corner portion disposed in a r

Abstract: Disclosed herein are a flexible thermoelectric module cell for a touch sensor, a touch sensor including the same, and a method of manufacturing the flexible thermoelectric module cell for a touch sensor. The flexible thermoelectric module cell is applicable to cells for touch sensors of various designs, without the need for a person to go directly to an industrially dangerous place.

Abstract: A semiconductor device of an embodiment includes first and second semiconductor layers having different conductivity types; a third semiconductor layer interposed between the first and second semiconductor layers; and a fourth semiconductor layer interposed between the second and third semiconductor layers, having a lower doping concentration than that of the first semiconductor layer and the same conductivity type as the first semiconductor layer, wherein the difference in doping concentration between the first semiconductor layer and the fourth semiconductor layer may be greater than 4×E18 atoms/cm3.

Abstract: A semiconductor device includes a substrate; first and second semiconductor layers arranged on the substrate and having different conductive types; a third semiconductor layer arranged between the first semiconductor layer and the second semiconductor layer; a first electrode arranged on the first semiconductor layer so as to be electrically connected to the first semiconductor layer; a second electrode arranged on the second semiconductor layer so as to be electrically connected to the second semiconductor layer; and a first insulating layer arranged, between the first electrode and the second electrode, on the exposed first, second and third semiconductor layers, wherein a first end part, close to the second electrode, among both end parts of the first electrode, and/or a second end part, which is both end parts of the second electrode, has an electric field dispersion part.

Abstract: Disclosed in an embodiment is a semiconductor device comprising: a substrate; first and second semiconductor layers arranged on the substrate and having different conductive types; a third semiconductor layer arranged between the first semiconductor layer and the second semiconductor layer; a first electrode arranged on the first semiconductor layer so as to be electrically connected to the first semiconductor layer; a second electrode arranged on the second semiconductor layer so as to be electrically connected to the second semiconductor layer; and a first insulating layer arranged, between the first electrode and the second electrode, on the exposed first, second and third semiconductor layers, wherein a first end part, close to the second electrode, among both end parts of the first electrode, and/or a second end part, which is both end parts of the second electrode, has an electric field dispersion part.

Abstract: A light emitting device package may include a package body, a light emitting device on the package body, a first molding member that surrounds the light emitting device, and a second molding member having a hemi-spherical structure to surround the first molding member. The molding member includes a viscous material.

Abstract: A method of tracing a position of a pipeline using a mapping probe includes: inserting and moving the mapping probe in a pipeline; receiving and keeping acceleration information and angular information in real time in a memory; estimating Euler angle (roll and pitch); estimating Euler angle (roll, pitch, and yaw); estimating a system modeling; estimating and applying covariance of system noise and covariance of measured noise; estimating three-dimensional position information modeling; receiving and keeping movement distance information of the mapping probe from an encoder in a memory; estimating and keeping in real time three-dimensional position information of the mapping probe in the memory; receiving the accumulated real-time three-dimensional position information of the mapping probe; mapping the accumulated real-time three-dimensional position information of the mapping probe to geographic information; and displaying the accumulated position information of the mapping probe mapped to the geographic info

Abstract: A semiconductor device of an embodiment includes first and second semiconductor layers having different conductivity types; a third semiconductor layer interposed between the first and second semiconductor layers; and a fourth semiconductor layer interposed between the second and third semiconductor layers, having a lower doping concentration than that of the first semiconductor layer and the same conductivity type as the first semiconductor layer, wherein the difference in doping concentration between the first semiconductor layer and the fourth semiconductor layer may be greater than 4×E18 atoms/cm3.

Abstract: A Pipe Mapping Probe Apparatus for Searching Pipe Route Position includes: a first disc fitted and fastened on a shaft member thread-fastened to the inner side of a connection shaft at a first side of an internal body of a first pig; a cap coupled to a side of the shaft member outside the first disc; a first pig coupled to the shaft member; elastic members composed of three flexible springs coupled to a second side of an external body of the first pig; a cable that electrically connects a battery, a sensor unit, and a control board of the first pig and an encoder of a second pig, is connected with the battery through a first cable socket coupled to the external body of the first pig, and is connected to an encoder through a second cable socket disposed at the center of the second plate coupled to a first side of the second pig and through an encoder socket on the top of the encoder disposed in an internal body of the second pig; the second pig coupled to second sides of the elastic members at the first side o

Abstract: A light emitting device includes a body having a cavity and a step difference structure around the cavity, a plurality of electrodes in the cavity, a light emitting chip in the cavity, a transparent window having an outer portion provided on the step difference structure to cover the cavity, and an adhesive member between the transparent window and the body. The adhesive member includes a first adhesive member between an outer bottom surface of the transparent window and a bottom of the step difference structure and a second adhesive member between the outer portion of the transparent window and the body.

Abstract: Disclosed are a light emitting device and a light emitting device package. The light emitting device includes a light emitting structure including a first conductive semiconductor layer, an active layer on the first conductive semiconductor layer and a second conductive semiconductor layer on the active layer; a first electrode pad on the first conductive semiconductor layer; a second electrode pad on the second conductive semiconductor layer; and a current blocking pattern overlapping an edge of at least one of the first and second electrode pads.