Patents by Inventor Jung Hwan Cuun

Jung Hwan Cuun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Base cards and IC cards using the same
    Patent number: 6028774
    Abstract: A base card improves the mounting reliability of a COB package particularly when the package has molding by-products such as epoxy burrs or molding flashes. The base card has a COB package receiving part made up of first and second sections. The receiving part is stepped so that the sections thereof have shapes that are complementary to that of and for receiving a peripheral portion of the printed circuit board of the COB package and the package body the COB package, respectively. The second section has a bevel at the transition of the first section into the second section. This bevel helps define a space in which the by-products are accommodated when the COB package is mounted to the base card. Further, the second section of the COB package receiving part may define an opening in the bottom surface of the base card.
    Type: Grant
    Filed: May 19, 1998
    Date of Patent: February 22, 2000
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Bo Hyun Shin, Jung Hwan Cuun, Min Cheol An