Abstract: A flexible flat cable according to various embodiments of the disclosure may include a first insulation layer having a plate shape, a first conductive pattern disposed on the first insulation layer, a second conductive pattern disposed on the first insulation layer to be spaced apart from the first conductive pattern at a predetermined interval, a second insulation layer covering at least a portion of the first conductive pattern and disposed on the first insulation layer to cover the first conductive pattern, a first shield member including a first shield layer disposed on the first insulation layer and the second insulation layer to cover the first conductive pattern and the second conductive pattern, and a second shield layer disposed on the first shield layer to cover the first shield layer, and a third insulation layer surrounding the first shield layer such that at least a portion of the first shield layer of the first shield member, which is exposed between the first insulation layer and the second shi

Abstract: A semiconductor device has a substrate and a first light sensitive material formed over the substrate. A plurality of first conductive posts is formed over the substrate by patterning the first light sensitive material and filling the pattern with a conductive material. A plurality of electrical contacts is formed over the substrate and the conductive posts are formed over the electrical contacts. A first electric component is disposed over the substrate between the first conductive posts. A plurality of second conductive posts is formed over the first electrical component by patterning a second light sensitive material and filling the pattern with conductive material. A first encapsulant is deposited over the first electrical component and conductive posts. A portion of the first encapsulant is removed to expose the first conductive posts. A second electrical component is disposed over the first electrical component and covered with a second encapsulant.

Abstract: A flexible flat cable according to various embodiments of the disclosure may include a first insulation layer having a plate shape, a first conductive pattern disposed on the first insulation layer, a second conductive pattern disposed on the first insulation layer to be spaced apart from the first conductive pattern at a predetermined interval, a second insulation layer covering at least a portion of the first conductive pattern and disposed on the first insulation layer to cover the first conductive pattern, a first shield member including a first shield layer disposed on the first insulation layer and the second insulation layer to cover the first conductive pattern and the second conductive pattern, and a second shield layer disposed on the first shield layer to cover the first shield layer, and a third insulation layer surrounding the first shield layer such that at least a portion of the first shield layer of the first shield member, which is exposed between the first insulation layer and the second shi

Abstract: A semiconductor device has a semiconductor die. A first dielectric layer is formed over the semiconductor die. A second dielectric layer is formed over the first dielectric layer. A trench is formed in the second dielectric layer. A via opening is formed to expose a contact pad of the semiconductor die within the trench. A seed layer is formed over the second dielectric layer. The seed layer extends into the trench and via opening. A conductive material is deposited into the via opening and trench. The conductive material is overburdened from the trench. The seed layer around the conductive material is etched in a first etching step. The conductive material is etched in a second etching step.

Abstract: A scroll compressor may include an oil supply passage formed in a main frame. A first end of the oil supply passage may be open toward an orbiting space of the main frame and a second end may be open toward an Oldham ring. With this configuration, even if refrigerant suctioned through a refrigerant suction pipe sweeps away oil, which lubricates a sliding surface between a key and a key groove adjacent to the refrigerant suction pipe while passing through between the key and the key groove, oil may be quickly and smoothly supplied to the sliding surface. This may prevent wear between the key and the key groove so as to enhance efficiency of the compressor.

Abstract: A semiconductor manufacturing device has an outer cup and inner cup with a wafer mount disposed within the outer cup. A semiconductor wafer is disposed on the wafer mount. A dispenser dispenses a photoresist material onto a surface of the semiconductor wafer. A controller controls the dispenser to apply in a single application, the photoresist material to the surface of the semiconductor wafer while rotating at a first speed to form a thickness of the photoresist material up to 12.0 micrometers, or in the range of 3.0 to 12.0 micrometers. The first speed ranges from 400 to 700 RPM. The controller controls the dispenser to discontinue application of the photoresist material while rotating the semiconductor wafer at the first speed. The photoresist material dries while rotating the semiconductor wafer. The controller controls the dispenser to apply a coating to the semiconductor wafer prior to applying the photoresist material.

Abstract: A scroll compressor may include an oil supply passage formed in a main frame. A first end of the oil supply passage may be open toward an orbiting space of the main frame and a second end may be open toward an Oldham ring. With this configuration, even if refrigerant suctioned through a refrigerant suction pipe sweeps away oil, which lubricates a sliding surface between a key and a key groove adjacent to the refrigerant suction pipe while passing through between the key and the key groove, oil may be quickly and smoothly supplied to the sliding surface. This may prevent wear between the key and the key groove so as to enhance efficiency of the compressor.

Abstract: A semiconductor device has a substrate and a first light sensitive material formed over the substrate. A plurality of first conductive posts is formed over the substrate by patterning the first light sensitive material and filling the pattern with a conductive material. A plurality of electrical contacts is formed over the substrate and the conductive posts are formed over the electrical contacts. A first electric component is disposed over the substrate between the first conductive posts. A plurality of second conductive posts is formed over the first electrical component by patterning a second light sensitive material and filling the pattern with conductive material. A first encapsulant is deposited over the first electrical component and conductive posts. A portion of the first encapsulant is removed to expose the first conductive posts. A second electrical component is disposed over the first electrical component and covered with a second encapsulant.

Abstract: A semiconductor manufacturing device has an outer cup and inner cup with a wafer suction mount disposed within the outer cup. A photoresist material is applied to a first surface of a semiconductor wafer disposed on the wafer suction mount while rotating at a first speed. A gas port is disposed on the inner cup for dispensing a gas oriented toward a bottom side of the semiconductor wafer. The gas port purges a second surface of the semiconductor wafer with a gas to remove contamination. The second surface of the semiconductor wafer is rinsed while purging with the gas. The gas can be a stable or inert gas, such as nitrogen. The contamination is removed from the second surface of the semiconductor wafer through an outlet between the inner cup and outer cup. The semiconductor wafer rotates at a second greater speed after discontinuing purge with the gas.

Abstract: A device, system and method of performing real-time communication with an external web browser signals an external web browser to initiate real-time communication over a network, packetizes encoded media data based on a given real-time network protocol after the signaling is performed, depacketizes the packetized media data to obtain the encoded media data, and performs the real-time communication by transporting the encoded media data to an external web browser over the network.

Abstract: A device, system and method of performing real-time communication with an external web browser signals an external web browser to initiate real-time communication over a network, packetizes encoded media data based on a given real-time network protocol after the signaling is performed, depacketizes the packetized media data to obtain the encoded media data, and performs the real-time communication by transporting the encoded media data to an external web browser over the network.

Abstract: An integrated circuit package system having stacked lead frames including providing a first stackable lead frame package having a first integrated circuit therein and a second stackable lead frame package with a second integrated circuit therein. The first stackable lead frame package having a plurality of leads including protrusions is mounted to the second stackable lead frame package having a second plurality of leads including protrusions.