Patents by Inventor Jung-Hwan Woo

Jung-Hwan Woo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110079361
    Abstract: An apparatus for semiconductor die bonding includes a first bonding head and a second bonding head configured to respectively pickup a first semiconductor chip and a second semiconductor chip located at a pickup point. The apparatus for semiconductor die bonding may also include a first transfer device configured to transfer the first bonding head from the pickup point to a bonding point located on a substrate along a transfer path. The first transfer device may further be configured to return to the pickup point along a first return path after the first semiconductor chip is bonded to the substrate. Also, the apparatus for semiconductor die bonding may include a second transfer device configured to transfer the second bonding head from the pickup point to the bonding point located on the substrate along the transfer path. The second transfer device may further be configured to return to the pickup point along a second return path after the second semiconductor chip is bonded to the substrate.
    Type: Application
    Filed: August 4, 2010
    Publication date: April 7, 2011
    Inventors: Byeong-kuk Park, Seok Goh, Kyoung-bok Cho, Dong-soo Lee, Jung-hwan Woo
  • Publication number: 20100037445
    Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.
    Type: Application
    Filed: October 22, 2009
    Publication date: February 18, 2010
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youn-sung Ko, Hak-kyoon Byun, Jung-hwan Woo, Hyun-jung Song
  • Patent number: 7650687
    Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
    Type: Grant
    Filed: June 16, 2005
    Date of Patent: January 26, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Hwan Woo, Ho-Jae Byon, Jae-Bong Shin, Yong-Kyun Sun, Hyun-Ho Kim, Choo-Ho Kim, Youn-Sung Ko
  • Patent number: 7624498
    Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.
    Type: Grant
    Filed: May 30, 2007
    Date of Patent: December 1, 2009
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Youn-sung Ko, Hak-kyoon Byun, Jung-hwan Woo, Hyun-jung Song
  • Publication number: 20070293022
    Abstract: An apparatus for and a method of detaching a semiconductor chip from a tape minimize the likelihood that the semiconductor chip will crack. The apparatus includes a holder, a first ejector having an upper end, and a second ejector whose upper end is disposed centrally of that of the first ejector. The holder has an upper portion and a through-hole extending through the upper portion. The ejectors have upper ends that are extendable and retractable out of and back into the holder via the through-hole in the upper portion of the holder. A tape to which at least one semiconductor chip is attached is set against the upper portion of the holder. The first ejector is extended a first distance from the holder to push the semiconductor chip upward. The second ejector is extended from the holder by a second distance larger than the first distance so as to push the semiconductor chip further upward. Thus, the tape is progressively detached from the semiconductor chip.
    Type: Application
    Filed: May 30, 2007
    Publication date: December 20, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Youn-sung KO, Hak-kyoon BYUN, Jung-hwan WOO, Hyun-jung SONG
  • Publication number: 20070277128
    Abstract: In one embodiment of a system for sensing the shape of a chip, a support plate is provided that preferably includes at least one chip mounted thereon. A lower lighting unit is preferably disposed below the support plate to emit light through the support plate and around or between the chip(s) toward an optical sensing unit, with a portion of the light emitted being blocked by the opaque chip(s). The optical sensing unit preferably senses the light that passes through the support plate and around or between the chip(s), but not the light that is blocked by the chip(s). In this manner, the shape of the chip can be more accurately determined, even when it is deformed within an acceptable range. A method for using a system constructed according to the principles of the present invention is also provided.
    Type: Application
    Filed: May 22, 2007
    Publication date: November 29, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dong-Chul HAN, Jung-Hwan WOO, Youn-Sung KO
  • Publication number: 20070170569
    Abstract: Provided are in-line semiconductor chip packaging apparatuses that include a buffer assembly in which a reversing unit rotates a lead frame 180° between die attaching and/or wire bonding operations and methods of manufacturing an integrated circuit chip package using such an in-line integrated circuit chip packaging apparatus. Between packaging process operations, the lead frame, which includes first and second surfaces may be rotated, thereby reversing the orientation of the first and second surfaces. The apparatuses will include one or more processing units for attaching semiconductor chips to the leadframe, or a previously mounted semiconductor chip, or for forming wire bonds between the attached semiconductor chip(s) and the corresponding lead fingers of the lead frame, attached to and/or separated by an in-line buffer assembly that includes a reversing unit.
    Type: Application
    Filed: March 30, 2007
    Publication date: July 26, 2007
    Inventors: Tae-Hyun Kim, Young-Kyun Sun, Hyun-Ho Kim, Jung-Hwan Woo
  • Patent number: 7215008
    Abstract: Provided are in-line semiconductor chip packaging apparatuses that include a buffer assembly in which a reversing unit rotates a lead frame 180° between die attaching and/or wire bonding operations and methods of manufacturing an integrated circuit chip package using such an in-line integrated circuit chip packaging apparatus. Between packaging process operations, the lead frame, which includes first and second surfaces may be rotated, thereby reversing the orientation of the first and second surfaces. The apparatuses will include one or more processing units for attaching semiconductor chips to the leadframe, or a previously mounted semiconductor chip, or for forming wire bonds between the attached semiconductor chip(s) and the corresponding lead fingers of the lead frame, attached to and/or separated by an in-line buffer assembly that includes a reversing unit.
    Type: Grant
    Filed: June 24, 2004
    Date of Patent: May 8, 2007
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tae-Hyun Kim, Young-Kyun Sun, Hyun-Ho Kim, Jung-Hwan Woo
  • Publication number: 20060266792
    Abstract: A multi-chip die bonder may include a first substrate conveyor conveying a substrate in a first direction and a second substrate conveyor conveying a substrate in a second direction. A plurality of dies may be stacked onto the substrate while the substrate is circulating the first substrate conveyor and the second substrate conveyor. A first heater may be provided in a die bonding unit and a second heater may be provided in the first substrate conveyor. An adhesive curing process may be performed together with a die attaching process.
    Type: Application
    Filed: October 24, 2005
    Publication date: November 30, 2006
    Inventors: Youn-Sung Ko, Choo-Ho Kim, Hyun-Ho Kim, Yong-Kyun Sun, Byung-Joon Lee, Il-Sup Choi, Jung-Hwan Woo
  • Publication number: 20060048381
    Abstract: Provided are a die attaching apparatus, a cleaning system and a method having components which can be easily replaced with new ones adapted to various packages within a short period of time. Surfaces of a die pressing member and a heat plate are prevented from being contaminated. The die pressing member is detachably attached to a lower end of an attaching unit which may directly apply a pressure to dies. A heat plate grinder on which a grinding apparatus for grinding the heat plate is mounted is spaced a predetermined distance from the die pressing member. A heat plate cleaner is attached to a side wall of the heat plate grinder and removes residues remaining on the heat plate.
    Type: Application
    Filed: June 16, 2005
    Publication date: March 9, 2006
    Inventors: Jung-Hwan Woo, Ho-Jae Byon, Jae-Bong Shin, Yong-Kyun Sun, Hyun-Ho Kim, Choo-Ho Kim, Youn-Sung Ko
  • Publication number: 20050006743
    Abstract: Provided are in-line semiconductor chip packaging apparatuses that include a buffer assembly in which a reversing unit rotates a lead frame 180° between die attaching and/or wire bonding operations and methods of manufacturing an integrated circuit chip package using such an in-line integrated circuit chip packaging apparatus. Between packaging process operations, the lead frame, which includes first and second surfaces may be rotated, thereby reversing the orientation of the first and second surfaces. The apparatuses will include one or more processing units for attaching semiconductor chips to the leadframe, or a previously mounted semiconductor chip, or for forming wire bonds between the attached semiconductor chip(s) and the corresponding lead fingers of the lead frame, attached to and/or separated by an in-line buffer assembly that includes a reversing unit.
    Type: Application
    Filed: June 24, 2004
    Publication date: January 13, 2005
    Inventors: Tae-Hyun Kim, Young-Kyun Sun, Hyun-Ho Kim, Jung-Hwan Woo