Patents by Inventor Jung Hye Chae

Jung Hye Chae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230391957
    Abstract: The present invention relates to a photocurable silicone composition comprising: at least one organopolysiloxane having at least two alkenyl groups per molecule; (B) at least one mercapto functional compound having at least two thiol groups per molecule; (C) at least one photopolymerization initiator selected from acylphosphine oxide-type photopolymerization initiators and oxime ester-type photopolymerization initiators; and (D) at least one black pigment.
    Type: Application
    Filed: May 26, 2023
    Publication date: December 7, 2023
    Inventors: Jung Hye Chae, Misoon Jung, Shunya Takeuchi
  • Publication number: 20230348721
    Abstract: A UV curable silicone composition has exceptional curability by ultraviolet irradiation.
    Type: Application
    Filed: July 10, 2023
    Publication date: November 2, 2023
    Inventors: Shunya Takeuchi, Anna Ya Ching Feng, Yutaka Oka, Jung Hye Chae
  • Patent number: 11781016
    Abstract: A UV curable silicone composition has exceptional curability by ultraviolet irradiation.
    Type: Grant
    Filed: February 12, 2021
    Date of Patent: October 10, 2023
    Assignees: DuPont Toray Specialty Materials Kabushiki Kaisha, Rohm and Haas Electronic Materials LLC, Rohm and Haas Electronic Materials Korea Ltd.
    Inventors: Shunya Takeuchi, Anna Ya Ching Feng, Yutaka Oka, Jung Hye Chae
  • Publication number: 20230174722
    Abstract: The present invention relates to a curable silicone composition comprising: (A) at least one organopolysiloxane having at least two alkenyl groups per molecule; (B) at least one mercapto functional organopolysiloxane having at least two thiol groups per molecule; (C) at least one photopolymerization initiator; and, (D) 2,6-di-tert-butyl-4-methylphenol (BHT), wherein the composition has a viscosity of less than 200 mPa·s at 25° C.
    Type: Application
    Filed: November 23, 2022
    Publication date: June 8, 2023
    Inventors: Jung Hye Chae, Shunya Takeuchi, Kasumi Takeuchi
  • Publication number: 20220403115
    Abstract: The present invention relates to a UV curable silicone composition comprising at least one organopolysiloxane having at least two alkenyl groups per molecule; at least one mercapto functional organic compound having at least two thiol groups per molecule; at least one photopolymerization initiator; and at least one polymerization inhibitor comprising at least one alkoxylated polyol derived (meth)acrylate or at least one quinone derivative compound, and/or at least one antioxidant, wherein the composition comprises the photopolymerization initiator selected from intramolecular hydrogen abstraction type photopolymerization initiators, or the composition comprises the polymerization inhibitor.
    Type: Application
    Filed: June 10, 2022
    Publication date: December 22, 2022
    Inventors: Jung Hye Chae, Shunya TAKEUCHI, Rikuto OTSUKA
  • Publication number: 20210269642
    Abstract: A UV curable silicone composition has exceptional curability by ultraviolet irradiation.
    Type: Application
    Filed: February 12, 2021
    Publication date: September 2, 2021
    Inventors: Shunya Takeuchi, Anna Ya Ching Feng, Yutaka Oka, Jung Hye Chae
  • Publication number: 20210054265
    Abstract: A curable silicone composition is provided. The curable silicone composition comprises a cadmium-free quantum dot in an amount of from about 0.01 to about 10 mass % of the composition, wherein the composition can be cured by a hydrosilylation reaction and has at least about 10 mol % of aryl groups in all silicon atom-bonded organic groups. The curable silicone composition exhibits excellent dispersibility of the quantum dot, and cures to form a cured product exhibiting excellent color conversion efficiency.
    Type: Application
    Filed: March 11, 2019
    Publication date: February 25, 2021
    Inventors: Jung Hye CHAE, Myun Hwa CHUNG, Eun Kyung JANG
  • Patent number: 9450159
    Abstract: Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.
    Type: Grant
    Filed: October 9, 2012
    Date of Patent: September 20, 2016
    Assignee: Seoul Viosys Co., Ltd.
    Inventors: Hee Cheul Jung, Jung Hye Chae, Bo Ram I Jang, Jun Yong Park, Dae Woong Suh
  • Patent number: 9166120
    Abstract: There are provided a light emitting diode (LED) device including an LED chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the LED chip, and a color conversion layer formed to be spaced apart from the LED chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the LED chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 K.
    Type: Grant
    Filed: August 16, 2011
    Date of Patent: October 20, 2015
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Mi Moon, Jung Hye Chae, Hyung Kun Kim, Se Hwan An
  • Publication number: 20140284650
    Abstract: Disclosed are a light-emitting diode package and a method for manufacturing same. The method for manufacturing a light-emitting diode package comprises: preparing a package main body having a cavity and an air vent passageway which extends from the cavity; installing a light-emitting diode inside the cavity of the package main body; attaching a transparent member by means of an adhesive so as to cover the upper part of the cavity; and blocking the air vent passageway by forming a sealing member. As the air vent passageway is blocked after the transparent member is attached, the transparent member may be prevented from peeling off from the air pressure inside the cavity.
    Type: Application
    Filed: October 9, 2012
    Publication date: September 25, 2014
    Inventors: Hee Cheul Jung, Jung Hye Chae, Bo Ram I Jang, Jun Yong Park, Dae Woong Suh
  • Publication number: 20140197443
    Abstract: There are provided a light emitting diode (LED) device including an LED chip emitting light within a specific wavelength region, a transparent resin layer covering a light emission surface of the LED chip, and a color conversion layer formed to be spaced apart from the LED chip by the transparent resin layer to cover the transparent resin layer and including at least one type of phosphor converting light emitted from the LED chip into light within a different wavelength region, wherein a mean free path of phosphor particles included in the color conversion layer is 0.8 mm or more at a temperature of 5500 K.
    Type: Application
    Filed: August 16, 2011
    Publication date: July 17, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Mi Moon, Jung Hye Chae, Hyung Kun Kim, Se Hwan An
  • Publication number: 20140168965
    Abstract: An LED device according to an embodiment of the present invention may include a first LED light source unit including at least one first white LED and emitting white light of a first color temperature; a second LED light source unit including at least one second white LED and emitting white light of a second color temperature different from the first color temperature; and a variable resistor connected to at least one of the first LED light source unit and the second LED light source unit, being configured to control a current supplied to the at least one of the first LED light source unit and the second LED light source unit.
    Type: Application
    Filed: August 16, 2011
    Publication date: June 19, 2014
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Kyung Mi Moon, Young Jin Lee, Jung Hye Chae, Hyung Kun Kim
  • Patent number: 7693200
    Abstract: A semiconductor laser diode including a substrate, and a first semiconductor layer, an active layer, a second semiconductor layer and an electrode sequentially formed on the substrate is provided. In the semiconductor laser diode, the second semiconductor layer has a ridge and the electrode is formed on the ridge of the second semiconductor layer at a width which is less than the width of the ridge.
    Type: Grant
    Filed: January 25, 2007
    Date of Patent: April 6, 2010
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-hye Chae, Jong-in Shim, Kyoung-ho Ha, Kyu-sang Kim, Han-youl Ryu
  • Publication number: 20080111139
    Abstract: Provided is a vertical light emitting device having improved light extraction efficiency and a method of manufacturing the same. The vertical light emitting device may include a p type electrode, a p type semiconductor layer, an active layer, and an n type semiconductor layer which may be sequentially formed on the p type electrode, and an n type electrode on a portion of a surface of the n type semiconductor layer, wherein the portion of the surface of the n type semiconductor layer may be at an inclined plane inclined from an area near a circumference of the n type electrode towards the active layer. The p type electrode may include a current blocking layer which is made of an insulating material and on the p type electrode directly under the n type electrode. Accordingly, a voltage increase may be minimized or reduced, and light extraction efficiency may be improved.
    Type: Application
    Filed: July 24, 2007
    Publication date: May 15, 2008
    Inventors: Jung-hye Chae, Myoung-gyun Suh
  • Publication number: 20070195851
    Abstract: A semiconductor laser diode including a substrate, and a first semiconductor layer, an active layer, a second semiconductor layer and an electrode sequentially formed on the substrate is provided. In the semiconductor laser diode, the second semiconductor layer has a ridge and the electrode is formed on the ridge of the second semiconductor layer at a width which is less than the width of the ridge.
    Type: Application
    Filed: January 25, 2007
    Publication date: August 23, 2007
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-hye Chae, Jong-in Shim, Kyoung-ho Ha, Kyu-sang Kim, Han-youl Ryu
  • Publication number: 20050180475
    Abstract: The provided semiconductor laser device includes a substrate, an active layer, a first cladding layer located between the active layer and the substrate, a second cladding layer located on the active layer, and a first electrode layer including a metal waveguide layer, which is formed of a metal having a smaller refractive index than the second cladding layer, and formed on the second cladding layer, wherein the first electrode layer is formed to operate as a waveguide.
    Type: Application
    Filed: February 18, 2005
    Publication date: August 18, 2005
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Kyoung-ho Ha, Joon-seop Kwak, Sung-nam Lee, Jung-hye Chae
  • Patent number: 6661377
    Abstract: The present invention is about phased array antenna using gain switched multimode Fabry-Perot laser diode (FP-LD) and high-dispersion fiber. More particularly, the invention deals with techniques that allow compact and low-cost system implementation for phased array antenna adopting optical control and also allows continuous time delay for each antenna in the array to induce phase difference.
    Type: Grant
    Filed: February 26, 2002
    Date of Patent: December 9, 2003
    Assignee: Kwangju Institute of Science and Technology
    Inventors: Yong-Tak Lee, Jung Hye Chae
  • Patent number: 6587190
    Abstract: A system for measuring chromatic dispersion in an optical fiber includes a multimode laser diode adapted to generate an optical pulse through gain switching; a highly dispersive optical fiber adapted to allow the optical output pulse to pass therethrough, and then adapted to separate each mode of the multimode laser diode to generate a reference signal; a test optical fiber adapted to allow an optical pulse for each wavelength separated by the highly dispersive optical fiber to pass therethrough to vary a repetition rate of the optical pulse train due to a chromatic dispersion characteristic of the test optical fiber using the optical pulse as the reference signal; and a high speed photodetector and RF spectrum analyzer adapted to detect eh variation of the repetition rate of the optical pulse train due to the chromatic dispersion characteristic of the test optical fiber.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: July 1, 2003
    Assignee: Kwangju Institute of Science & Technology
    Inventors: Jung Hye Chae, Yong Tak Lee
  • Publication number: 20030080899
    Abstract: The present invention is about phased array antenna using gain switched multimode Fabry-Perot laser diode (FP-LD) and high-dispersion fiber. More particularly, the invention deals with techniques that allow compact and low-cost system implementation for phased array antenna adopting optical control and also allows continuous time delay for each antenna in the array to induce phase difference.
    Type: Application
    Filed: February 26, 2002
    Publication date: May 1, 2003
    Applicant: KWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY of Republic of KOREA
    Inventors: Yong-Tak Lee, Jung Hye Chae
  • Publication number: 20020051129
    Abstract: Disclosed is a system for measuring a chromatic dispersion in an optical fiber, comprising: a multimode laser diode adapted to generate an optical pulse through a gain switching; a highly dispersive optical fiber adapted to allow the optical output pulse to pass therethrough, and then adapted to separate each mode of the multimode laser diode to generate a reference signal; a test optical fiber adapted to allow an optical pulse for each wavelength separated by the highly dispersive optical fiber to pass therethrough to vary a repetition rate of the optical pulse train due to a chromatic dispersion characteristic of the test optical fiber using the optical pulse as the reference signal; a high speed photodetector and a RF spectrum analyzer adapted to detect the variation of the repetitions rate of the optical pulse train due to the chromatic dispersion characteristic of the test optical fiber;
    Type: Application
    Filed: February 5, 2001
    Publication date: May 2, 2002
    Inventors: Jung Hye Chae, Yong Tak Lee