Abstract: A memory device includes a memory block to which a plurality of lines are connected. The memory device also includes a plurality of memory cells respectively connected to word lines among the plurality of lines, wherein the plurality of memory cells are formed as a plurality of plug holes formed in a stack structure between a drain select line among the plurality of lines and a slit. The memory device further includes a plurality of page buffers connected to the plurality of memory cells through a plurality of bit lines among the plurality of lines. The memory device additionally includes a peripheral circuit for performing a read operation on the plurality of memory cells. The peripheral circuit includes a voltage generator configured to control a signal applied to the plurality of page buffers so that the read operation is performed according to positions of the plug holes.

Abstract: A semiconductor device may include a gate structure including a first conductive layer, a second conductive layer, and a third conductive layer, the third conductive layer being disposed between the first conductive layer and the second conductive layer and thicker than the first conductive layer and the second conductive layer, channel structures passing through the gate structure, and an isolation structure including a first portion passing through the second conductive layer and extended into the channel structures and a second portion protruding from the first portion into the third conductive layer and disposed between the channel structures.

Abstract: Provided herein is a semiconductor memory device and a method of manufacturing the semiconductor memory device. The semiconductor memory device includes a gate stacked body including interlayer insulating layers and conductive patterns that are alternately stacked in a vertical direction on a substrate, a channel structure penetrating at least a portion of the gate stacked body, and an upper surface of the channel structure left exposed by the gate stacked body.

Abstract: A memory device includes a memory block to which a plurality of lines are connected. The memory device also includes a plurality of memory cells respectively connected to word lines among the plurality of lines, wherein the plurality of memory cells are formed as a plurality of plug holes formed in a stack structure between a drain select line among the plurality of lines and a slit. The memory device further includes a plurality of page buffers connected to the plurality of memory cells through a plurality of bit lines among the plurality of lines. The memory device additionally includes a peripheral circuit for performing a read operation on the plurality of memory cells. The peripheral circuit includes a voltage generator configured to control a signal applied to the plurality of page buffers so that the read operation is performed according to positions of the plug holes.

Abstract: A semiconductor device includes a plurality of first memory strings each first memory string having a channel with a first length and a plurality of second memory strings each second memory string having a channel with a second length shorter than the first length. A method of operating the semiconductor device includes: performing a first read operation on the first read unit, wherein the first read unit includes the first memory cells sharing the same first word line among first memory cells included in the plurality of the first memory strings; and performing a second read operation on the second read unit, wherein the second read unit includes the second memory cells sharing the same second word line among second memory cells included in the plurality of the second memory strings.