Patents by Inventor Jung-Hyun Park

Jung-Hyun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9618568
    Abstract: A method of testing a semiconductor device using the test equipment includes loading an undivided printed circuit board (PCB) including unit PCBs in a test equipment. A semiconductor device is mounted in each of the unit PCBs. Product information of the undivided PCB loaded in the test equipment is confirmed. The undivided PCB whose product information has been confirmed is electrically connected to one of a plurality of main testers of the test equipment. Each of the main testers includes a main test interface directly connected to a cloud server in which firmwares for various kinds of tests are stored. The product information of the undivided PCB is transmitted to the main tester electrically connected to the undivided PCB. The main tester to which the product information has been transmitted performs a main test of the undivided PCB using the product information. The undivided PCB on which the main test has been performed by the main tester is unloaded from the test equipment.
    Type: Grant
    Filed: November 12, 2013
    Date of Patent: April 11, 2017
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Young-Chul Lee, Nam-Hong Lee, Kyung-Sook Lee, Jung-Hyun Park, Sang-Youl Lee
  • Publication number: 20170094797
    Abstract: A printed circuit board and a method of manufacturing the same is described herein. The printed circuit board includes a first insulating layer having a first circuit embedded in a first surface thereof, a second insulating layer disposed on a second surface of the first insulating layer, the second insulating layer having a cavity therein, an electronic component mounted inside the cavity with an adhesion member, and a third insulating layer disposed on the second insulating layer to embed the electronic component.
    Type: Application
    Filed: April 20, 2016
    Publication date: March 30, 2017
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Yong-Ho BAEK, Kyung-Hwan KO, Jung-Hyun CHO, Jung-Hyun PARK
  • Publication number: 20170059931
    Abstract: A display apparatus including: a main body having an opening at the front part; a backlight unit configured to generate light; and an image forming unit provided in the front part of the main body, and configured to block or transmit the light generated by the backlight unit to create an image, where the image forming unit includes: a pair of transparent substrates disposed to be opposite to each other; a cable configured to transmit image data to the pair of transparent substrates; and a pair of polarizing films respectively disposed on the outer surfaces of the pair of transparent substrates, and wherein an edge part of at least one transparent substrate of the pair of transparent substrates protrudes to connect to the cable, and at least one polarizing film of the pair of polarizing films extends to the main body in a direction in which the at least one transparent substrate protrudes.
    Type: Application
    Filed: December 8, 2015
    Publication date: March 2, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Sung Min KIM, Jeong Dong NOH, Jung Woo HONG, Jung Hyun PARK, Duk Jin JEON
  • Patent number: 9574753
    Abstract: An illumination device includes a conversion unit that controls an emission direction of light emitted from a light-emitting unit included in the illumination device. The conversion unit includes a ball-shaped main body, and may be formed between an upper body, which includes the light-emitting unit, and a lower body. An assembly unit may be formed in the upper body to couple the conversion unit, and the light emission direction may be appropriately controlled by controlling the shape of the ball-shaped main body.
    Type: Grant
    Filed: March 30, 2015
    Date of Patent: February 21, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Won-chul Hwang, Jung-hyun Park, Jun-ho Jung, Hwan-woong Choi
  • Patent number: 9578749
    Abstract: An element embedded printed circuit board includes: a substrate including an insulation layer, a first circuit layer formed on a first surface of the insulation layer, and a second circuit layer formed on a second surface of the insulation layer; and an element including an electrode part and embedded in the insulation layer, wherein the electrode part is in contact with the first circuit layer.
    Type: Grant
    Filed: November 17, 2015
    Date of Patent: February 21, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jung-Hyun Cho, Yong-Ho Baek, Young-Gwan Ko, Jae-Hoon Choi, Jung-Hyun Park
  • Publication number: 20170047501
    Abstract: A method for driving a piezo actuator includes detecting consumption current by stepwise sweeping the frequency of an actuator driving signal to drive the piezo actuator vibrated in response to first and second vibration modes from a first reference frequency and determining a frequency at which the consumption current is inflected to be a first resonant frequency, detecting consumption current by stepwise sweeping the frequency of the actuator driving signal from a second reference frequency and determining a frequency at which the consumption current is inflected to be a second resonant frequency, and outputting an actuator driving signal in response to the first resonant frequency and the second resonant frequency.
    Type: Application
    Filed: July 13, 2016
    Publication date: February 16, 2017
    Inventors: Yeon Ho SON, Dong Su MOON, Kyung Su PARK, Joon CHOI, Jung Hyun PARK
  • Patent number: 9565044
    Abstract: A transmitting apparatus, a receiving apparatus and methods of controlling these apparatuses are provided. The transmitting apparatus includes: an input processor configured to process a plurality of input streams to generate a plurality of base band frames; a bit interleaved and coded modulation (BICM) processor configured to perform forward error correction (FEC) coding, constellation mapping, and interleaving on the plurality of baseband frames; a symbol generator configured to add signaling data to the plurality of baseband frames output from the BICM processor to generate an orthogonal frequency division multiplexing (OFDM) symbol; and a transmitter configured to select at least one of a plurality of pilot patterns based on a fast Fourier transform (FFT) size and a guard interval fraction, insert a pilot in the OFDM symbol according to the selected pilot pattern, and transmit a stream including the pilot-inserted OFDM symbol.
    Type: Grant
    Filed: September 26, 2014
    Date of Patent: February 7, 2017
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hak-ju Lee, Soon-chan Kwon, Se-ho Myung, Jung-hyun Park, Joo-sung Park, Hyun-koo Yang, Jung-pil Yu, Sung-ryul Yun, Hong-sil Jeong, Jung-Il Han
  • Publication number: 20170025595
    Abstract: A piezoelectric vibration module includes external electrodes arranged in a stack direction on the outside surface of a piezoelectric device so that the state in which the piezoelectric device is coupled to the terminals of an FPCB can be reliably maintained even in a piezoelectric device bending phenomenon dependent on the repetition of contraction and/or expansion of the piezoelectric device. A portion in which the external electrodes of the piezoelectric device come in contact with the FPCB may be placed in a portion having small displacement.
    Type: Application
    Filed: June 17, 2016
    Publication date: January 26, 2017
    Inventors: Jung Hyun PARK, Yeon Ho SON
  • Publication number: 20170026432
    Abstract: A transmitting apparatus is provided. The transmitting apparatus includes: an L1 signaling generator configured to generate L1 signaling including first information and second information; a frame generator configured to generate a frame including a payload including a plurality of sub frames; and a signal processor configured to insert a preamble including the L1 signaling in the frame and transmit the frame. The first information includes information required for decoding a first sub frame among the plurality of sub frames. Therefore, a processing delay in a receiving apparatus is reduced.
    Type: Application
    Filed: July 22, 2016
    Publication date: January 26, 2017
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-hyun PARK, Min-ho KIM, Sung-woo PARK, Sung-kyu JUNG, Chang-hoon CHOI, Doo-chan HWANG
  • Publication number: 20170003338
    Abstract: A threshold voltage measuring device may include a metal-oxide-semiconductor (MOS) transistor, a drain voltage clamping circuit configured to control a drain voltage of the MOS transistor wherein the drain voltage having a substantially constant level, and a constant current supply circuit configured to cause a drain-source current to flow through the MOS transistor wherein the drain-source current having a substantially constant magnitude.
    Type: Application
    Filed: January 25, 2016
    Publication date: January 5, 2017
    Inventors: Youngjae AN, Jung-Hyun PARK, Kiryong KIM, Seong-Ook JUNG, Hyucksang YIM
  • Publication number: 20160381781
    Abstract: A circuit board including a core layer having a first surface and a second surface opposite to the first surface; a first build-up layer and a second build-up layer formed on the first surface and the second surface of the core layer, respectively, and including a conductive pattern and a conductive via; and an outer layer formed on the surface of the first build-up layer and the second build-up layer, wherein at least one build-up layer of the first build-up layer and the second build-up layer comprises a photosensitive insulating layer in which a cavity is disposed and a thermal dissipation unit disposed in the cavity.
    Type: Application
    Filed: January 20, 2016
    Publication date: December 29, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventor: Jung-Hyun Park
  • Publication number: 20160381792
    Abstract: A printed circuit board in accordance with an embodiment includes a core layer, a photo imagable dielectric layer, and an inner circuit layer. The core layer includes a core stiffener layer, a first metal layer formed on an upper surface of the core stiffener layer, and a second metal layer formed on a lower surface of the core stiffener layer. The photo imagable dielectric layer is formed on an upper surface and a lower surface of the core layer. The inner circuit layer is formed on the photo imagable dielectric layer.
    Type: Application
    Filed: June 6, 2016
    Publication date: December 29, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jee-Soo MOK, Young-Gwan KO, Jung-Hyun PARK, Jae-Ean LEE, Young Kuk KO, Going-Sik KIM
  • Publication number: 20160358896
    Abstract: Disclosed herein is a light emitting device package and a light emitting device package module.
    Type: Application
    Filed: May 31, 2016
    Publication date: December 8, 2016
    Applicant: LUMENS CO., LTD.
    Inventors: Hyo Gu JEON, Jung Hyun PARK, Dae Gil JUNG, Seung Hyun OH, Yun Geon CHO, Bo Gyun KIM, Suk Min HAN, Jun Hyeok HAN
  • Publication number: 20160313498
    Abstract: Disclosed herein are a light emitting device package, a backlight unit, and a method of manufacturing a light emitting apparatus capable of being used for a display application or an illumination application. The light emitting device package includes: a substrate, a light emitting, a reflection molding member, an upper cover, and an interval maintaining part.
    Type: Application
    Filed: April 22, 2016
    Publication date: October 27, 2016
    Applicant: LUMENS CO., LTD.
    Inventors: Seung-Hyun OH, Dae-Gil JUNG, Jung-Hyun PARK, Hyo-Gu JEON
  • Publication number: 20160199947
    Abstract: The present invention provide a filler metal for TIG welding capable of stable welding, of which heat flux feeding area is wider than conventional wire filler metal and heat input per unit length is increased.
    Type: Application
    Filed: December 3, 2013
    Publication date: July 14, 2016
    Inventors: Sang-Myung Cho, Dong-Soo Oh, Hyo-Sik Ham, Hyeon-Joo Ha, Hee-Seop Shin, Jae-Ho Jun, Jae-Gyu Byun, Jung-Hyun Park, Hyuk-Yong Kwon
  • Publication number: 20160141710
    Abstract: The present invention discloses a mandrel that can uniformly form a thickness of an electrode assembly and minimize deformation of an electrode plate upon swelling. The mandrel that is configured to wind an electrode of a rechargeable battery includes: a first reel and a second reel with a gap therebetween, wherein the first reel includes a gap surface facing the second reel, a first front surface and a second front surface that are connected by the gap surface, and a first inclined surface and a second inclined surface that connect the first front surface and the second front surface, wherein the first inclined surface is longer than the second inclined surface.
    Type: Application
    Filed: September 25, 2015
    Publication date: May 19, 2016
    Inventors: Jung-Hyun Park, Jae-Yub Kwon
  • Publication number: 20160143142
    Abstract: An element embedded printed circuit board includes: a substrate including an insulation layer, a first circuit layer formed on a first surface of the insulation layer, and a second circuit layer formed on a second surface of the insulation layer; and an element including an electrode part and embedded in the insulation layer, wherein the electrode part is in contact with the first circuit layer.
    Type: Application
    Filed: November 17, 2015
    Publication date: May 19, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung-Hyun CHO, Yong-Ho BAEK, Young-Gwan KO, Jae-Hoon CHOI, Jung-Hyun PARK
  • Publication number: 20160105967
    Abstract: An embedded board includes an insulating layer and an electronic device embedded in the insulating layer. A first circuit pattern is embedded to contact a bottom surface of the insulating layer, and a second circuit pattern protrudes from the bottom surface of the insulating layer. A via is bonded to the device and the second circuit pattern.
    Type: Application
    Filed: July 31, 2015
    Publication date: April 14, 2016
    Inventors: Jae Hoon CHOI, Jung Hyun PARK, Yong Ho BAEK, Hea Sung KIM, Jung Hyun CHO, Il Jong SEO
  • Patent number: 9300376
    Abstract: A signal transmitting apparatus, a signal receiving apparatus and methods thereof are provided. A signal transmitting apparatus which transmits a signal to realize a diversity gain together with a signal transmitted from another transmitting apparatus in a multi input single output (MISO) method includes a first transmitter configured to transmit a first signal, a second transmitter configured to transmit a second signal, and a controller configured to control the first signal and the second signal to be transmitted in a first cooperative communication method, wherein the controller controls the first signal and the second signal to be transmitted together with the signal transmitted from another transmitting apparatus in a second cooperative communication method.
    Type: Grant
    Filed: July 3, 2014
    Date of Patent: March 29, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung-Hyun Park, Jung-Il Han, Joo-sung Park, Jung-pil Yu
  • Patent number: 9276654
    Abstract: A signal transmitter and receiver are provided. The transmitter includes: a Multiple Input Multiple Output (MIMO) precoder configured to, in response to a first input signal and a second input signal, generate a first transmission signal and a second transmission signal by performing MIMO precoding by pre-phase shifting or pre-phase shifting/hopping the second input signal, and superposition encoding the first input signal and the pre-phase shifted or pre-phase shifted/hopped second input signal; and an Orthogonal Frequency Division Multiplexing (OFDM) modulator configured to OFDM modulate the first transmission signal and the second transmission signal.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: March 1, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Joo-sung Park, Jung-Il Han, Jung-Hyun Park, Jung-pil Yu