Patents by Inventor Jung-I Ku

Jung-I Ku has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240097403
    Abstract: A laser device is provided. The laser device includes a stack of epitaxial layers, a first conductive layer, an intermediate layer, and a first electrode. The stack of epitaxial layers has a central region and an edge region. The stack of epitaxial layers includes a first reflective structure, an active region disposed on the first reflective structure, a second reflective structure disposed on the active region. The first conductive layer disposes on the stack of epitaxial layers and covers the central region and at least a part of the edge region. The intermediate layer has a first opening that corresponding to the central region of the stack of epitaxial layers, wherein the intermediate layer comprises insulating material or metal. The first electrode disposes on the first conductive layer.
    Type: Application
    Filed: September 14, 2023
    Publication date: March 21, 2024
    Inventors: Jung-Jen Li, Ching-En Huang, Hao-Ming Ku, Shih-I Chen
  • Patent number: 6742693
    Abstract: A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mounted on the two terminal sidewalls thereof is put around the nozzle base. Besides, a nozzle manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars is put around the enclosing frame. Thus, the nozzle can rotate about the axial pillars for adjusting the outlet direction thereof.
    Type: Grant
    Filed: August 27, 2002
    Date of Patent: June 1, 2004
    Assignee: Asustek Computer, Inc.
    Inventors: Po-Hung Wang, Chun-Hsiung Chiu, Peng-Wei Wang, Jung-I Ku, Chia-Hao Wu
  • Patent number: 6732903
    Abstract: An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward area inside the nozzle tank to form an opening of the nozzle such that a liquid tin within the stannic tank passes through the nozzle tank and produces a tin wave at the opening of the nozzle. The feature of the adjustable nozzle lies in that the rear backflow stopper is mounted at the backward area inside the nozzle tank by means of a rear combining means which adjusts the altitude of the rear backflow stopper with an altitudinal opening and fixes the rear backflow stopper by a fixing means so as to control the waveform of the tin wave produced by the nozzle of the stannic furnace.
    Type: Grant
    Filed: October 1, 2002
    Date of Patent: May 11, 2004
    Assignee: Asustek Computer, Inc.
    Inventors: Po-Hung Wang, Chun-Hsiung Chiu, Peng-Wei Wang, Jung-I Ku, Chia-Hao Wu
  • Publication number: 20030116607
    Abstract: An adjustable nozzle of a stannic furnace comprises a nozzle tank which is mounted at the upper portion of a stannic tank of the stannic furnace, a front backflow stopper and a rear backflow stopper which are respectively mounted at the forward area and the backward area inside the nozzle tank to form an opening of the nozzle such that a liquid tin within the stannic tank passes through the nozzle tank and produces a tin wave at the opening of the nozzle. The feature of the adjustable nozzle lies in that the rear backflow stopper is mounted at the backward area inside the nozzle tank by means of a rear combining means which adjusts the altitude of the rear backflow stopper with an altitudinal opening and fixes the rear backflow stopper by a fixing means so as to control the waveform of the tin wave produced by the nozzle of the stannic furnace.
    Type: Application
    Filed: October 1, 2002
    Publication date: June 26, 2003
    Inventors: Po-Hung Wang, Chun-Hsiung Chiu, Peng-Wei Wang, Jung-I Ku, Chia-Hao Wu
  • Publication number: 20030116606
    Abstract: A new solder bath apparatus applied to the soldering furnace is disclosed herein. The solder bath is used for containing molten solder. And a nozzle base is located in the solder bath to flow molten solder upwards. An enclosing frame with axial horizontal pillars mounted on the two terminal sidewalls thereof is put around the nozzle base. Besides, a nozzle manufactured with two bearing pedestals on two terminal sidewalls responsive to the pillars is put around the enclosing frame. Thus, the nozzle can rotate about the axial pillars for adjusting the outlet direction thereof.
    Type: Application
    Filed: August 27, 2002
    Publication date: June 26, 2003
    Inventors: Po-Hung Wang, Chun-Hsiung Chiu, Peng-Wei Wang, Jung-I Ku, Chia-Hao Wu