Abstract: Disclosed is a method for controlling a hot water circulation system associated with a heat pump. The present invention gives a freezing burst prevention operation function to a water-refrigerant heat-exchanger which performs heat exchange between a refrigerant and water, making it possible to remove a phenomenon that the water-refrigerant heat-exchanger installed out of the space where a user lives is frozen to be damaged.

Abstract: A single stacked semiconductor package has at least two semiconductor chips densely mounted via a lead on chip method for attaching leads of a lead frame by alternately arranging the leads over or under the semiconductor chips. A tape automated bonding method using thin metal leads formed on insulating tapes, and an adhesive coated on the lower portions of the leads to mount at least two semiconductor chips can also be used. A stacked semiconductor device manufacturing method and the semiconductor package according thereto are suitable for use in large scale integration circuits.