Abstract: Disclosed herein is an optical delay line. The optical delay line includes a body and at least one wing, which constitute a rotating body that rotates around a rotational axis. The rotational wing includes a retroreflective curved surface, which is formed so that light can be vertically reflected by a reflective surface of the rotational wing. The retroreflective curved surface is formed so as to reversely reflect the light while varying an optical path difference at a predetermined speed when the rotating body rotates at a regular angular velocity. Thus, a long time delay value can be effectively generated.

Abstract: Disclosed herein is an optical delay line. The optical delay line includes a body and at least one wing, which constitute a rotating body that rotates around a rotational axis. The rotational wing includes a retroreflective curved surface, which is formed so that light can be vertically reflected by a reflective surface of the rotational wing. The retroreflective curved surface is formed so as to reversely reflect the light while varying an optical path difference at a predetermined speed when the rotating body rotates at a regular angular velocity. Thus, a long time delay value can be effectively generated.

Abstract: A magnetron has a cylindrical cathode portion, an anode portion surrounding the cathode portion concentrically, and a resonator circuit connected to the anode portion. Fine modifying portions are periodically formed on the anode portion in an azimuthal direction to encourage electrons in bunching, thereby reducing a start-oscillation time and noise signals.

Abstract: Provided is a method of producing a semiconductor package including at least two rows of leads in which the leads of each row separately connecting a semiconductor chip to an external substrate. The method includes: forming a lead frame, the lead frame including a die pad and a plurality of leads arranged about the die pad; attaching an adhesive tape to a surface of the lead frame covering at least substantially the die pad and the plurality of leads; removing portions of the leads and the adhesive tape disposed in a dividing region and thereby separating at least some of the plurality of leads to form multiple rows of leads; and mounting a semiconductor chip on the die pad, electrically connecting the semiconductor chip with the lead frame, and molding the lead frame and the semiconductor chip to provide a semiconductor package. The adhesive tape attached at undesirable locations of the lead frame is preferably removed after provision of the semiconductor package.

Abstract: Provided is a method of producing a semiconductor package including at least two rows of leads in which the leads of each row separately connecting a semiconductor chip to an external substrate. The method includes: forming a lead frame, the lead frame including a die pad and a plurality of leads arranged about the die pad; attaching an adhesive tape to a surface of the lead frame covering at least substantially the die pad and the plurality of leads; removing portions of the leads and the adhesive tape disposed in a dividing region and thereby separating at least some of the plurality of leads to form multiple rows of leads; and mounting a semiconductor chip on the die pad, electrically connecting the semiconductor chip with the lead frame, and molding the lead frame and the semiconductor chip to provide a semiconductor package. The adhesive tape attached at undesirable locations of the lead frame is preferably removed after provision of the semiconductor package.

Abstract: A method of manufacturing an LCD device is disclosed, which can improve yield by preventing occurrence of a contact failure between a transparent conductive film and a pad region (gate and data regions). In this method, amorphous transparent conductive films connected to a drain electrode, a gate pad and a data pad are formed of a transparent conductive material.