Patents by Inventor Jung-Jie Liou

Jung-Jie Liou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BOTTLE CAP HAVING ANTI-COUNTERFEIT FUNCTION AND BOTTLE USING THE SAME
    Publication number: 20100141384
    Abstract: A bottle cap having anti-counterfeit function comprises a cap body and an RFID tag. The cap body has a cap portion, a ring neck portion and at least one joint portion, there is an interval between the cap portion and the ring neck portion, and the joint portion crosses through the interval and couples the cap portion and the ring neck portion. The RFID tag is disposed at the cap body and has an antenna and a chip electrically connected with the antenna. The antenna has a first antenna portion, a second antenna portion and a third antenna portion, the first antenna portion and the chip are disposed at the cap portion of the cap body, the second antenna portion is disposed at the ring neck portion of the cap body, and the third antenna portion crosses through the interval and bridge connects the first antenna portion and the second antenna portion.
    Type: Application
    Filed: December 4, 2008
    Publication date: June 10, 2010
    Inventors: Yeh-Shun CHEN, Jung-Jie Liou, Yung-Jen Chen, Yuan-Li Tai, Kuen-Shiuh Yang
  • Lead frame structure
    Patent number: 6204553
    Abstract: A lead frame for a semiconductor package. The lead frame includes a die pad and a plurality of leads. One surface of the die pad supports a silicon chip while the other surface has a plurality of annular grooves all having the same geometric center. The inner lead portion of the leads surrounds the die pad, but the die pad and the leads are on different planar surfaces.
    Type: Grant
    Filed: August 10, 1999
    Date of Patent: March 20, 2001
    Assignee: Walsin Advanced Electronics Ltd.
    Inventors: Wen-Chun Liu, Hui-Ping Liu, Jung-Jie Liou, Yi-Hsiang Pan, Sheng-Tung Tsai
  • Lead frame structure for preventing the warping of semiconductor package body
    Patent number: 6078099
    Abstract: A lead frame structure can prevent the warping of a semiconductor package body. The lead frame has a downset die pad and upset internal leads so that packaging material can be evenly distributed both above and below the lead frame.
    Type: Grant
    Filed: February 16, 1999
    Date of Patent: June 20, 2000
    Assignee: Walsin Advanced Electronics LTD
    Inventors: Wen-Chun Liu, Jung-Jie Liou, Chih-Kung Huang