Abstract: According to an embodiment of the present disclosure, an electronic device may comprise a first housing including a first surface and a second surface facing in a direction opposite the first surface, a second housing including a third surface and a fourth surface facing in a direction opposite the third surface, a hinge disposed between the first housing and the second housing configured to provide rotational motion between the first housing and the second housing, and a flexible display disposed from the first surface of the first housing across the hinge to the third surface of the second housing, at least part of the flexible display configured to form a curved surface as the hinge structure is folded, wherein the hinge may include dual-axis hinges configured to provide a first rotational axis allowing the first housing to rotate about the second housing and a second rotational axis allowing the second housing to rotate about the first housing and slides coupled with the first housing and the second housi

Abstract: A local high-resolution imaging method and apparatus for a three-dimensional (3D) skeletal image is provided. The method includes determining a volume of interest (VOI) to perform high-resolution imaging from the 3D skeletal image in which an object to be inspected is captured, localizing the VOI based on a finite element method (FEM), and setting a multi-resolution constraint based on a bone mineral density (BMD) between the 3D skeletal image and the localized VOI and reconstructing a skeletal image in which high-resolution imaging is performed on the localized VOI.

Abstract: Provided is a pouch-type secondary battery that includes an electrode assembly equipped with an electrode tab, an electrode lead connected to the electrode tab, a pouch housing accommodating and sealing the electrode assembly such that the electrode lead is partially exposed, and first and second sealants within the pouch housing. The electrode lead includes a joint portion joined to the electrode tab, a terminal portion exposed to an outside of the pouch housing and a fuse portion between the joint portion and the terminal portion. The fuse portion includes a separating groove and a breaking portion connected to the separating groove for separating the terminal portion from the joint portion. The first sealant and the second sealant have shapes that are different from each other such that, when the pressure inside the secondary battery is increased, a stress applied to the pouch housing causes the breaking portion to break.

Abstract: A semiconductor light emitting device may include a light emitting package. A light emitting package may include a light emitting stack including a sequential stack of a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. An encapsulation layer may at least partially surround the second conductivity type semiconductor layer, and a wavelength conversion layer may cover the first conductivity type semiconductor layer. One or more of the encapsulation layer and the wavelength conversion layer may have a greater coefficient of thermal expansion (CTE) than a GaN-based compound semiconductor. The semiconductor light emitting device may include a stress applying structure that may apply a tensile stress to the light emitting stack. The light emitting stack may have reduced thermal droop at an operation temperature and improved luminous efficiency.

Abstract: A local high-resolution imaging method and apparatus for a three-dimensional (3D) skeletal image is provided. The method includes determining a volume of interest (VOI) to perform high-resolution imaging from the 3D skeletal image in which an object to be inspected is captured, localizing the VOI based on a finite element method (FEM), and setting a multi-resolution constraint based on a bone mineral density (BMD) between the 3D skeletal image and the localized VOI and reconstructing a skeletal image in which high-resolution imaging is performed on the localized VOI.

Abstract: The present disclosure relates to a cathode active material, and more particularly, to a cathode active material doped with a trivalent metal (Me) and a lithium secondary battery comprising the same. According to one aspect, there is provided the cathode active material doped with the trivalent metal (Me), represented by the formula LixMn2MeyO4 (here, x is from 0.5 to 1.3, and y is from 0.01 to 0.1). According to the present disclosure, release of manganese ions of the cathode active material greatly reduces, and consequently, capacity and cycle life of the battery may be significantly improved.

Abstract: A broadcast receiving system including a broadcast receiving apparatus and a controlling method thereof are disclosed. The broadcast receiving apparatus includes a tuner configured to receive a broadcast signal including broadcast data from a broadcast transmitting apparatus, a communicator configured to receive an additional signal including broadcast data and header information regarding the broadcast data from a reference apparatus, and a processor configured to determine the broadcast data included in the additional signal based on the header information and align the broadcast data received from the broadcast transmitting apparatus by using the broadcast data included in the additional signal.

Abstract: A semiconductor light emitting device may include a light emitting package. A light emitting package may include a light emitting stack including a sequential stack of a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. An encapsulation layer may at least partially surround the second conductivity type semiconductor layer, and a wavelength conversion layer may cover the first conductivity type semiconductor layer. One or more of the encapsulation layer and the wavelength conversion layer may have a greater coefficient of thermal expansion (CTE) than a GaN-based compound semiconductor. The semiconductor light emitting device may include a stress applying structure that may apply a tensile stress to the light emitting stack. The light emitting stack may have reduced thermal droop at an operation temperature and improved luminous efficiency.

Abstract: The present invention relates to an electrode comprising multi-layered electrode active material layer and a secondary battery comprising the same. According to the embodiments of the present invention comprises electrode having multi-layered electrode active material layer, wherein the content of the active materials which forms the electrode active material layers is equally maintained and the loading amounts at each layer are either the same or different from each other, thereby solving the problem of performance deterioration caused by an increase in battery resistance due to non-uniform dispersion of a binder or the like.

Abstract: The present invention relates to an electrode assembly including a separator and a lithium secondary battery including the same for improving safety. The electrode assembly including a positive electrode, a negative electrode and a separator further includes a gasification material possibly being electrolyzed at a certain voltage to generate a gas. Since the electrode assembly and the lithium secondary battery including the same include the gasification material possibly being electrolyzed at the certain voltage to generate the gas, the safety of the battery may be increased. Since the gasification material is coated on the surface of the separator not on the electrode, the resistance increase of the battery may be restrained and the capacity lowering of the battery may be remarkably decreased. The lifetime of the battery is good.

Abstract: Method of manufacturing a semiconductor light emitting device package are described. Semiconductor light emitting device packages includes may be formed by forming a plurality of light emitting diode chips having a structure in which a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer are sequentially stacked on a wafer, forming a phosphor layer and an encapsulation layer on the first conductivity-type semiconductor layer, forming a texture on the encapsulation layer by removing a portion of the encapsulation layer from an upper surface thereof; and separating the plurality of light emitting diode chips from each other.

Abstract: An apparatus and method for reconstructing a skeletal image for osteoporotic diagnosis is disclosed. A skeletal image reconstruction method may include separating a region of interest (ROI) corresponding to a skeletal system from an image captured from an inspection target, and reconstructing a high-resolution skeletal image by performing a finite element method (FEM) and topology optimization on the ROI.

Abstract: A method of manufacturing a light emitting device package includes forming a plurality of light emitting devices by growing a plurality of semiconductor layers on a wafer, and measuring color characteristics of light emitted from each of the plurality of light emitting devices. For each of the plurality of light emitting devices, a type and an amount of wavelength conversion material is determined for color compensating the light emitting device based on a difference between the measured color characteristics and target color characteristics. A wavelength conversion layer is formed on at least two light emitting devices among the plurality of light emitting devices, the wavelength conversion layer having the type and the amount of wavelength conversion material determined for the at least two light emitting devices. The plurality of light emitting devices is then divided into individual light emitting device packages.

Abstract: An apparatus and method for reconstructing a skeletal image for osteoporotic diagnosis is disclosed. A skeletal image reconstruction method may include separating a region of interest (ROI) corresponding to a skeletal system from an image captured from an inspection target, and reconstructing a high-resolution skeletal image by performing a finite element method (FEM) and topology optimization on the ROI.

Abstract: A method of manufacturing a semiconductor light emitting device package includes providing a wafer and forming, on the wafer, a semiconductor laminate comprising a plurality of light emitting devices. Electrodes are formed in respective light emitting device regions of the semiconductor laminate. A curable resin is applied to a surface of the semiconductor laminate on which the electrodes are formed. A support structure is formed for supporting the semiconductor laminate by curing the curable resin. Through holes are formed in the support structure to expose the electrodes therethrough. Connection electrodes are formed in the support structure to be connected to the exposed electrodes.

Abstract: A light-emitting diode package includes a light-emitting structure, a first electrode pad and a second electrode pad connected with the light-emitting structure, an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first and second electrode pads, a substrate including via-holes in contact with a bottom surface of the insulating pattern layer and exposing a portion of the first electrode pad and a portion of the second electrode pad, a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and respectively connected with the first and second electrode pads, a fluorescent material layer disposed on the light-emitting structure, a glass disposed on and spaced apart from the light-emitting structure with the fluorescent material layer therebetween.

Abstract: A method of manufacturing a light emitting device package includes forming a plurality of light emitting devices by growing a plurality of semiconductor layers on a wafer, and measuring color characteristics of light emitted from each of the plurality of light emitting devices. For each of the plurality of light emitting devices, a type and an amount of wavelength conversion material is determined for color compensating the light emitting device based on a difference between the measured color characteristics and target color characteristics. A wavelength conversion layer is formed on at least two light emitting devices among the plurality of light emitting devices, the wavelength conversion layer having the type and the amount of wavelength conversion material determined for the at least two light emitting devices. The plurality of light emitting devices is then divided into individual light emitting device packages.

Abstract: A light-emitting diode package includes a light-emitting structure, a first electrode pad and a second electrode pad connected with the light-emitting structure, an insulating pattern layer in contact with a bottom surface of the light-emitting structure and abutting the first and second electrode pads, a substrate including via-holes in contact with a bottom surface of the insulating pattern layer and exposing a portion of the first electrode pad and a portion of the second electrode pad, a first penetrating electrode and a second penetrating electrode that are disposed in the via-holes and respectively connected with the first and second electrode pads, a fluorescent material layer disposed on the light-emitting structure, a glass disposed on and spaced apart from the light-emitting structure with the fluorescent material layer therebetween.