Abstract: There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

Abstract: There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

Abstract: The present invention relates to a thermosetting resin composition used in a printed circuit board for a semiconductor package, and a prepreg and a metal clad laminate using the same. More particularly, the present invention provides a thermosetting resin composition that includes a mixture of a BT or cyanate resin and an epoxy resin and a specific content of a novolac resin as a curing agent so as to inhibit separation of the resin and an inorganic filler during a process of laminating a prepreg on a metal foil, thereby providing a printed circuit board having a uniform insulation layer, and a prepreg and a metal clad laminate for a double-sided or multilayer printed circuit board that are manufactured by using the same.

Abstract: The present invention relates to a thermosetting resin composition used in a printed circuit board for a semiconductor package, and a prepreg and a metal clad laminate using the same. More particularly, the present invention provides a thermosetting resin composition that includes a mixture of a BT or cyanate resin and an epoxy resin and a specific content of a novolac resin as a curing agent so as to inhibit separation of the resin and an inorganic filler during a process of laminating a prepreg on a metal foil, thereby providing a printed circuit board having a uniform insulation layer, and a prepreg and a metal clad laminate for a double-sided or multilayer printed circuit board that are manufactured by using the same.

Abstract: The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate—based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus—based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.

Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polymide resin layer. The polymide resin layer has a modulus of elasticity of 70 Mpa at 400° C.

Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polymide resin layer. The polymide resin layer has a modulus of elasticity of 70 Mpa at 400° C.

Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polyimide resin layer. The polyimide resin layer has a modulus of elasticity of 70 Mpa at 400° C.

Abstract: The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.

Abstract: The present invention relates to a polyamic acid or polyimide comprising a heat-polymerizable or photo-polymerizable functional group, a photosensitive resin composition comprising the polyamic acid or the polyimide, a photosensitive resin composition being capable of providing a cured film that can be used for patterning at a high resolution and that has an excellent developing property in an alkaline aqueous solution, flexibility, adhesion strength, resistance to welding heat, and pressure cooker test (PCT) resistance, and a dry film prepared from the composition.

Abstract: The present invention relates to a polyimide photosensitive resin composition that is capable of being developed by an alkali aqueous solution, and a dry film that is produced by the same, and more particularly to a photosensitive resin composition which comprises a) a polyamic acid, b) two or more (meth)acrylate-based compounds that include one or more double bonds between carbons, c) a photopolymerization initiator, d) a phosphorus-based flame retardant, and e) an organic solvent, and a dry film that is produced by the same.

Abstract: The present invention relates to a copper clad laminate for chip on film, specifically to a copper clad laminate for a chip on film comprising a copper clad and at least one polyimide layer laminated on the copper clad, wherein the polyimide layer in contact with the copper clad comprises at least one additive selected from the group consisting of an azole-based compound, a polysiloxane-based compound, and a polyphosphate-based compound. The copper clad laminate for a chip on a film according to the present invention, upon tin plating the copper clad at high temperature, prevents delamination between the copper clad and the polyimide layer, and has excellent adhesiveness under the temperature and pressure on IC chip bonding.

Abstract: The present invention provides a metallic laminate and a method for preparing the same. The metallic laminate includes a metal layer, and at least one polyimide resin layer The polyimide resin layer has a modulus of elasticity of 70 Mpa at 400° C.