Abstract: An electronic device is disclosed. The electronic device includes an electronic component, an input/output (I/O) signal delivery circuit, and a power delivery circuit. The electronic component has a first surface and a second surface opposite to the first surface. The I/O signal delivery circuit is disposed under the first surface of the electronic component. The power delivery circuit is disposed over the second surface of the electronic component and configured to balance a warpage of the electronic device.

Abstract: An electronic device is disclosed. The electronic device includes a carrier, a computing element disposed over the carrier, and a first data storage element disposed over the carrier and electrically connected with the computing element through the carrier. The computing element is configured to receive a first power provided from the first data storage element.

Abstract: The present disclosure provides an electronic device, which includes a circuit structure, a processing component, a first storage unit, and a second storage unit. The processing component is disposed over the circuit structure. The first storage unit is supported by the circuit structure, and electrically connected to the processing component. The second storage unit is disposed under the circuit structure and electrically connected to the processing component via the circuit structure.

Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.

Abstract: An electronic device is provided. The electronic device includes a package structure and a power regulating element. The package structure includes an electronic component, a plurality of first conductive structures, and an encapsulant. The plurality of first conductive structures are connected to the electronic component. The encapsulant encapsulates the electronic component and exposes a portion of the plurality of first conductive structures. The power regulating component includes a plurality of second conductive structures directly bonded with the plurality of first conductive structures and configured to provide the electronic component with a power signal.

Abstract: An electronic device is disclosed. The electronic device includes a carrier including a first portion, a second portion over the first portion, and a third portion connecting the first portion and the second portion. The electronic device also includes a first electronic component disposed between the first portion and the second portion. An active surface of the first electronic component faces the second portion. The electronic device also includes a second electronic component disposed over the second portion. The first portion is configured to transmit a first power signal to a backside surface of the first electronic component opposite to the active surface.

Abstract: A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to dissipate heat from the first die and a second region of the first through via structure is configured to transmit an optical signal to or from the first optical I/O.

Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic structure, an alignment component and a light transmission element. The photonic structure includes an optical I/O. The alignment component includes a through hole extending through the alignment component and aligned with the optical I/O of the photonic structure. The light transmission element entirely fills the through hole of the alignment component.

Abstract: A package structure is provided. The package structure includes a bridge component, a photonic processing unit, and an electrical device. The photonic processing unit is disposed over the bridge component. The electrical device is disposed over the bridge component. The bridge component is configured to optically couple with the photonic processing unit and electrically connect with the electronic component.

Abstract: A package device and an electronic device are provided. The package device includes a carrier and a die. The die is disposed over the carrier and has a first surface facing the carrier and a second surface opposite to the first surface. The first surface of the die is configured to electrically connect to the carrier and the second surface of the die is configured to optically connect to the carrier.

Abstract: Semiconductor packages and methods for manufacturing the semiconductor packages are provided. The semiconductor package includes a first electronic element disposed over a first substrate; a second electronic element disposed over a second substrate spaced apart from the first substrate; and a first interconnection element connected to the first electronic element and the second electronic element. The first electronic element extends beyond an edge of the first substrate. The second electronic element extends beyond an edge of the second substrate and towards the first electronic element. The first interconnection element is configured to optically transmit a signal between the first electronic element and the second electronic element.

Abstract: A semiconductor package and a method for manufacturing a semiconductor package are provided. The semiconductor package includes a first processing element, a first I/O element, a second processing element, and a second I/O element. The first processing element is on a substrate. The first I/O element is on the substrate and electrically connected to the first processing element. The second processing element is on the substrate. The second I/O element is on the substrate and electrically connected to the second processing element. The first I/O element is electrically connected to and physically separated from the second I/O element.

Abstract: An optoelectronic device is provided. The optoelectronic device includes a plurality of first waveguides and a plurality of second waveguides. The plurality of first waveguides are configured to receive a first plurality of optical signals. The plurality of second waveguides are configured to transmit a second plurality of optical signals. The plurality of first waveguides extend substantially along a first direction and the plurality of second waveguides extend substantially along a second direction different from and non-parallel with the first direction.

Abstract: A package is provided. The package includes a carrier, a component, and a first protective element. The component is disposed over the carrier and having a side surface configured for optically coupling. The first protective element is disposed between the carrier and the component. The side surface of the component is free from being in contact with the first protective element.

Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.

Abstract: An electronic package is provided. The electronic package includes a semiconductor substrate. The semiconductor substrate includes a first active region and a first passive region separated from the first active region. The first active region is configured to regulate a power signal. The first passive region is configured to transmit a data signal.

Abstract: An electronic device is disclosed. The electronic device includes a system board and a first set of electronic devices disposed over the system board. Each of the first set of electronic devices comprises a processing unit and a carrier carrying the processing unit. The electronic device also includes a first interconnection structure electrically connected with the processing unit through the carrier and configured to receive a first power from a first power supply unit and to transmit the first power to the processing unit.

Abstract: An electronic module is disclosed. The electronic module includes an electronic component and an interconnection structure disposed over the electronic component. The interconnection structure comprises a first region and a second region different from the first region. The first region is configured to transmit a power from outside of the electronic module to the electronic component. The second region is configured to dissipate heat from the electronic component.

Abstract: An electronic device is disclosed. The electronic device includes a first interconnection structure, and a first electronic component disposed over the first interconnection structure and having an active surface and a lateral surface. The electronic device also includes a power connection disposed between the first interconnection structure and the active surface of the first electronic component, and a first non-power connection extending along the lateral surface of the first electronic component and electrically connected to the first interconnection structure. The electronic device also includes a second non-power connection disposed between the first interconnection structure and the active surface of the first electronic component. The second non-power connection is configured to block an electromagnetic interference (EMI) between the power connection and the first non-power connection.

Abstract: The present disclosure provides an electronic device. The electronic device includes a first electronic component, a first conductive element, and a voltage regulator. The voltage regulator is disposed adjacent to the first electronic component. The voltage regulator is configured to regulate a first voltage from the first EMI shielding layer and to provide the first electronic component with a second voltage.