Patents by Inventor Jung-Kai Chang

Jung-Kai Chang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MODIFIED POLYPHENYLENE ETHER RESIN, PREPARATION METHOD THEREOF, AND RESIN COMPOSITION INCLUDING THEREOF
    Publication number: 20250043075
    Abstract: A modified polyphenylene ether resin having a structure represented by [Formula 1] is provided.
    Type: Application
    Filed: November 7, 2023
    Publication date: February 6, 2025
    Applicant: NAN YA PLASTICS CORPORATION
    Inventors: Cheng-Chung Lee, Chen Hua Wu, Jung Kai Chang, Yun-Chia Tsai, Hung-Wen Hsu
  • Heat dissipation device
    Patent number: 12181224
    Abstract: A heat dissipation device including a heat dissipation fin group, a plurality of heat pipes, and a vapor chamber is provided. The heat dissipation fin group includes a plurality of fins arranged along an extension direction and is divided into a first fin group, a second fin group, and a third fin group. The third fin group is disposed between the first fin group and the second fin group. Each fin of the first fin group and the second group includes a plurality of through holes. Each fin of the third fin group includes a plurality of notches. The heat pipes are disposed through the first fin group and the second fin group by the through holes. The vapor chamber is correspondingly disposed on the third fin group and includes a plurality of grooves. The vapor chamber is in contact with the heat pipes exposed from the notches.
    Type: Grant
    Filed: October 2, 2022
    Date of Patent: December 31, 2024
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Jung-Kai Chang, Chi-Yeh Chen
  • PCI-E expansion card module
    Patent number: 12167553
    Abstract: A PCI-E expansion card module is configured to insert in a slot with a rotation switch. The PCI-E expansion card module includes a PCI-E expansion card body and an unlock mechanism. The PCI-E expansion card body includes an inserting portion and a positioning hook. The unlock mechanism is disposed beside the PCI-E expansion card body, and the unlock mechanism includes a pushing member. When the PCI-E expansion card body is inserted into the slot, the rotation switch is on a moving path of the pushing member. The pushing member moves and pushes the rotation switch to release a limitation of the PCI-E expansion card body.
    Type: Grant
    Filed: October 26, 2022
    Date of Patent: December 10, 2024
    Assignee: ASUSTeK COMPUTER INC.
    Inventors: Xu Wang, Hui He, Wei Tang, Jung-Kai Chang, Yuan-Yu Lin
  • PCI-E EXPANSION CARD MODULE
    Publication number: 20230354534
    Abstract: A PCI-E expansion card module is configured to insert in a slot with a rotation switch. The PCI-E expansion card module includes a PCI-E expansion card body and an unlock mechanism. The PCI-E expansion card body includes an inserting portion and a positioning hook. The unlock mechanism is disposed beside the PCI-E expansion card body, and the unlock mechanism includes a pushing member. When the PCI-E expansion card body is inserted into the slot, the rotation switch is on a moving path of the pushing member. The pushing member moves and pushes the rotation switch to release a limitation of the PCI-E expansion card body.
    Type: Application
    Filed: October 26, 2022
    Publication date: November 2, 2023
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Xu Wang, Hui He, Wei Tang, Jung-Kai Chang, Yuan-Yu Lin
  • HEAT DISSIPATION DEVICE
    Publication number: 20230221078
    Abstract: A heat dissipation device including a heat dissipation fin group, a plurality of heat pipes, and a vapor chamber is provided. The heat dissipation fin group includes a plurality of fins arranged along an extension direction and is divided into a first fin group, a second fin group, and a third fin group. The third fin group is disposed between the first fin group and the second fin group. Each fin of the first fin group and the second group includes a plurality of through holes. Each fin of the third fin group includes a plurality of notches. The heat pipes are disposed through the first fin group and the second fin group by the through holes. The vapor chamber is correspondingly disposed on the third fin group and includes a plurality of grooves. The vapor chamber is in contact with the heat pipes exposed from the notches.
    Type: Application
    Filed: October 2, 2022
    Publication date: July 13, 2023
    Applicant: ASUSTeK COMPUTER INC.
    Inventors: Jung-Kai Chang, Chi-Yeh Chen