Patents by Inventor Jung-Kai Hung

Jung-Kai Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9142583
    Abstract: Provided is a light sensor including a substrate, a dielectric layer, a plurality of pixels, a plurality of spacers, and a plurality of metal interconnects. The dielectric layer is located on the substrate. The pixels are located in the dielectric layer. The spacers are located on the sidewall of openings between adjacent pixels. The metal interconnects are located in the openings and cover the spacers so as to be electrically connected to the corresponding pixels.
    Type: Grant
    Filed: November 26, 2013
    Date of Patent: September 22, 2015
    Assignee: Maxchip Electronics Corp.
    Inventors: Jin-Wei Chang, Hung-Lung Wang, Jung-Kai Hung, Wei-Chi Su
  • Patent number: 9136301
    Abstract: Provided is a multi-wave band light sensor combined with a function of infrared ray (IR) sensing including a substrate, an IR sensing structure, a dielectric layer, and a multi-wave band light sensing structure. The substrate includes a first region and a second region. The IR sensing structure is in the substrate for sensing IR. The dielectric layer is on the IR sensing structure. The multi-wave band light sensing structure includes a first wave band light sensor, a second wave band light sensor, and a third wave band light sensor. The second wave band light sensor and the first wave band light sensor are overlapped and disposed on the IR sensing structure on the first region of the substrate from the bottom up. The third wave band light sensor is in the dielectric layer of the second region.
    Type: Grant
    Filed: September 9, 2013
    Date of Patent: September 15, 2015
    Assignee: Maxchip Electronics Corp.
    Inventors: Jin-Wei Chang, Hung-Lung Wang, Jung-Kai Hung
  • Publication number: 20150091123
    Abstract: Provided is a light sensor including a substrate, a dielectric layer, a plurality of pixels, a plurality of spacers, and a plurality of metal interconnects. The dielectric layer is located on the substrate. The pixels are located in the dielectric layer. The spacers are located on the sidewall of openings between adjacent pixels. The metal interconnects are located in the openings and cover the spacers so as to be electrically connected to the corresponding pixels.
    Type: Application
    Filed: November 26, 2013
    Publication date: April 2, 2015
    Applicant: Maxchip Electronics Corp.
    Inventors: Jin-Wei Chang, Hung-Lung Wang, Jung-Kai Hung, Wei-Chi Su
  • Publication number: 20140008653
    Abstract: Provided is a multi-wave band light sensor combined with a function of infrared ray (IR) sensing including a substrate, an IR sensing structure, a dielectric layer, and a multi-wave band light sensing structure. The substrate includes a first region and a second region. The IR sensing structure is in the substrate for sensing IR. The dielectric layer is on the IR sensing structure. The multi-wave band light sensing structure includes a first wave band light sensor, a second wave band light sensor, and a third wave band light sensor. The second wave band light sensor and the first wave band light sensor are overlapped and disposed on the IR sensing structure on the first region of the substrate from the bottom up. The third wave band light sensor is in the dielectric layer of the second region.
    Type: Application
    Filed: September 9, 2013
    Publication date: January 9, 2014
    Applicant: Maxchip Electronics Corp.
    Inventors: Jin-Wei Chang, Hung-Lung Wang, Jung-Kai Hung