Patents by Inventor Jung-Kuei Chung

Jung-Kuei Chung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160089741
    Abstract: The present invention discloses a gas cooling device and a reflow oven using thereof. The gas cooling device comprises a liquid cooling machine, a plurality condensers and a plurality of outer sleeves. The condensers are disposed in parallel and connected to the liquid cooling machine, in which two ends of all the condensers are separately connected with valves. The outer sleeves are sleeved out of the condensers and communicatively connected in order, in which the outer sleeves disposed at two ends are provided, respectively, with a gas inlet and a gas outlet and each of the condensers is provided with a water outlet. Each of the condensers is formed a circulation with the cooling device. Even though any of the condensers is detached, other condensers are able to continue operating as long as the valves disposed at the two ends of the detached condenser are closed.
    Type: Application
    Filed: September 25, 2015
    Publication date: March 31, 2016
    Inventors: De-Qaing XU, JUNG-KUEI CHUNG
  • Patent number: 8049115
    Abstract: A printed circuit board (PCB) adapted for mounting different kinds of light sensing modules thereon includes a lighting sensing area and a plurality of pads. The pads are disposed around the lighting sensing area, for configuring one light sensing module thereon. In the present invention, the PCB is suitable for different kinds of light sensing modules without redesign, which lowers the manufacturing cost of the PCB.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: November 1, 2011
    Assignee: Hon Hai Precision Co., Ltd.
    Inventors: Jung-Kuei Chung, Chi-Hsiung Lee, Tsung-Liang Hung
  • Publication number: 20090101397
    Abstract: A printed circuit board (100) includes a plurality of through-holes (140) defined therein, a plurality of first solder pads (110) defined to surround the through-holes respectively, and a second solder pad (190). Each of the first solder pads includes a first soldering zone (112) for accommodating solder used in a soldering process and a second soldering zone (114) for receiving excess solder overflowing from the first soldering zone. The second soldering zone is in communication with and extends outward from the first soldering zone. The second solder pad is located on a tail end of the printed circuit board for receiving excess solder of the tail end during the soldering process.
    Type: Application
    Filed: July 7, 2008
    Publication date: April 23, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Nan-Sheng Kuo, Jung-Kuei Chung, Chu-Lung Chien
  • Publication number: 20080149367
    Abstract: A printed circuit board (PCB) adapted for mounting different kinds of light sensing modules thereon includes a lighting sensing area and a plurality of pads. The pads are disposed around the lighting sensing area, for configuring one light sensing module thereon. In the present invention, the PCB is suitable for different kinds of light sensing modules without redesign, which lowers the manufacturing cost of the PCB.
    Type: Application
    Filed: December 20, 2007
    Publication date: June 26, 2008
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: JUNG-KUEI CHUNG, CHI-HSIUNG LEE, TSUNG-LIANG HUNG