Patents by Inventor Junglae Jo

Junglae Jo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SOLDER COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
    Publication number: 20170162555
    Abstract: Solder compositions for semiconductor fabrication are provided that include silver (Ag) of 3.0 wt. % to 4.0 wt. %, copper (Cu) of 0.75 wt. % to 1.0 wt. %, nickel (Ni) of 0.08 wt. % to 1.0 wt. %, and tin (Sn) of 94 wt. % to 96.17 wt. %, or that include bismuth (Bi) of 0.3 wt. % to 2.0 wt. % in place of a portion of the tin (Sn) in the solder composition; and, semiconductor packages are also provided that use the solder compositions for bonding one or more components of the semiconductor packages to each other.
    Type: Application
    Filed: November 8, 2016
    Publication date: June 8, 2017
    Inventors: Junglae Jo, Yeo-Hoon Yoon, Hojeong Moon, Taeeun Kim