Abstract: A die ejector includes a supporter configured to support a film on which a die is attached in a vertical direction, an elevation device in a hole of the supporter and configured to move the film with the die attached thereon in the vertical direction and in relation to the supporter, a driver configured to move the elevation device in the vertical direction, an air conduit guide in an enclosure region at least partially defined by an inner surface of the elevation device and having an inner surface defining an air flow conduit, a pressure adjuster device configured to induce air flow through the air flow conduit based on inducing a pressure gradient between the air flow conduit and the pressure adjuster device, and a flow guide in the air flow conduit and configured to control a flow of air through at least a portion of the air flow conduit.

Abstract: A mold test apparatus includes a mold support plate having a top surface on which a mold is mounted, wherein the mold support plate includes a plurality of test suction pipes communicating with paths in the mold, vacuum pipes each having one end connected to one of the plurality of test suction pipes, a pump connected to the other end of the pipe, and at least one pressure sensor configured to measure a pressure of the vacuum pipe, wherein the paths communicate with adsorption holes provided in a top surface of the mold, and wherein the at least one pressure sensor includes a determining unit configured to determine whether the adsorption holes are clogged by using the measured pressure.

Abstract: A stack tool comprises a lower jig having a plurality of package seating regions configured to seat a semiconductor package, an intermediate jig configured to be seated on top of the lower jig, and having a package support hole into which the semiconductor package is configured to be inserted, the intermediate jig having a shape corresponding to the plurality of package seating regions, and an upper dumbbell. The upper dumbbell includes a dumbbell main body on top of the intermediate jig, an upper recess stepped downward from an upper surface of the dumbbell main body on only a region corresponding to an upper surface of the semiconductor package, and a protruding support configured to protrude downward from a lower surface of the upper recess and configured to be brought into contact with an upper surface of the semiconductor package.

Abstract: A method of fabricating a semiconductor package using a laminating device is provided. The method includes placing a substrate on a substrate stand; providing a pressurizing unit which is expandable and includes a convex surface facing an upper surface of the substrate stand, on the substrate stand; injecting air into the pressurizing unit using a plate which is connected to the pressurizing unit; and supplying a film by a film supply unit which supplies the film between the substrate stand and the pressurizing unit, wherein the pressurizing unit attaches the film onto the substrate, while expanding.

Abstract: A stack boat tool includes a boat including a stack hole configured to accommodate first and second semiconductor packages; and a weight bar configured to be placed on the second semiconductor package during a reflow process for combining the first and second semiconductor packages, wherein the weight bar includes: a base configured to contact an upper surface of the second semiconductor package; a sidewall on the base; and a balance weight arranged on the base configured to lower a weight center of the weight bar.

Abstract: A die ejector includes a supporter configured to support a film on which a die is attached in a vertical direction, an elevation device in a hole of the supporter and configured to move the film with the die attached thereon in the vertical direction and in relation to the supporter, a driver configured to move the elevation device in the vertical direction, an air conduit guide in an enclosure region at least partially defined by an inner surface of the elevation device and having an inner surface defining an air flow conduit, a pressure adjuster device configured to induce air flow through the air flow conduit based on inducing a pressure gradient between the air flow conduit and the pressure adjuster device, and a flow guide in the air flow conduit and configured to control a flow of air through at least a portion of the air flow conduit.

Abstract: A jig for bonding a semiconductor chip may include a pressurizing portion and at least one opening. The pressuring portion may be configured to pressurize an upper surface of the semiconductor chip bonded to a package substrate via a bump and a flux using a laser. The opening may be surrounded by the pressurizing portion. The laser irradiated to the bump and the flux may be transmitted through the opening. A vapor generated from the flux by the laser may be discharged through the opening. Thus, the contamination of the jig caused by the vapor may be prevented so that a transmissivity of the laser through the jig may be maintained.

Abstract: A mold test apparatus includes a mold support plate having a top surface on which a mold is mounted, wherein the mold support plate includes a plurality of test suction pipes communicating with paths in the mold, vacuum pipes each having one end connected to one of the plurality of test suction pipes, a pump connected to the other end of the pipe, and at least one pressure sensor configured to measure a pressure of the vacuum pipe, wherein the paths communicate with adsorption holes provided in a top surface of the mold, and wherein the at least one pressure sensor includes a determining unit configured to determine whether the adsorption holes are clogged by using the measured pressure.

Abstract: A stack tool comprises a lower jig having a plurality of package seating regions configured to seat a semiconductor package, an intermediate jig configured to be seated on top of the lower jig, and having a package support hole into which the semiconductor package is configured to be inserted, the intermediate jig having a shape corresponding to the plurality of package seating regions, and an upper dumbbell. The upper dumbbell includes a dumbbell main body on top of the intermediate jig, an upper recess stepped downward from an upper surface of the dumbbell main body on only a region corresponding to an upper surface of the semiconductor package, and a protruding support configured to protrude downward from a lower surface of the upper recess and configured to be brought into contact with an upper surface of the semiconductor package.

Abstract: A jig for bonding a semiconductor chip may include a pressurizing portion and at least one opening. The pressuring portion may be configured to pressurize an upper surface of the semiconductor chip bonded to a package substrate via a bump and a flux using a laser. The opening may be surrounded by the pressurizing portion. The laser irradiated to the bump and the flux may be transmitted through the opening. A vapor generated from the flux by the laser may be discharged through the opening. Thus, the contamination of the jig caused by the vapor may be prevented so that a transmissivity of the laser through the jig may be maintained.

Abstract: A stack boat tool includes a boat including a stack hole configured to accommodate first and second semiconductor packages; and a weight bar configured to be placed on the second semiconductor package during a reflow process for combining the first and second semiconductor packages, wherein the weight bar includes: a base configured to contact an upper surface of the second semiconductor package; a sidewall on the base; and a balance weight arranged on the base configured to lower a weight center of the weight bar.

Abstract: A method of fabricating a semiconductor package using a laminating device is provided. The method includes placing a substrate on a substrate stand; providing a pressurizing unit which is expandable and includes a convex surface facing an upper surface of the substrate stand, on the substrate stand; injecting air into the pressurizing unit using a plate which is connected to the pressurizing unit; and supplying a film by a film supply unit which supplies the film between the substrate stand and the pressurizing unit, wherein the pressurizing unit attaches the film onto the substrate, while expanding.