Patents by Inventor Jung-Liang YEH

Jung-Liang YEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fan-out ball grid array package structure and process for manufacturing the same
    Patent number: 10242940
    Abstract: A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.
    Type: Grant
    Filed: July 20, 2017
    Date of Patent: March 26, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jung-Liang Yeh, Meng-Jen Wang, Tsung-Yueh Tsai, Chih-Ming Hung
  • FAN-OUT BALL GRID ARRAY PACKAGE STRUCTURE AND PROCESS FOR MANUFACTURING THE SAME
    Publication number: 20180108602
    Abstract: A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.
    Type: Application
    Filed: July 20, 2017
    Publication date: April 19, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jung-Liang YEH, Meng-Jen WANG, Tsung-Yueh TSAI, Chih-Ming HUNG