Abstract: An apparatus may include a heat pipe with a first portion residing in a first plane, a second portion residing in the first plane and a third portion positioned between the first portion and the second portion, the third portion residing in a second plane spaced-apart from the first plane. The apparatus further includes a base plate including an opening and a clip plate having a first region, a second region and a third region positioned between the first and the second regions. The third portion of the heat pipe is positioned within the opening, and the clip plate is coupled to the base plate such that i) the third region of the clip plate is in superimposition with the third portion of the heat pipe and ii) third region of the clip plate resides in the first plane.

Abstract: A method for forming semiconductor devices includes providing a substrate with a conductive pad formed thereon; forming a transparent structure over the substrate, wherein the transparent structure includes a plurality of collimating pillars adjacent to the conductive pad; forming a light-shielding structure over the plurality of collimating pillars and the conductive pad; performing a cutting process to remove one or more materials directly above the conductive pad, while leaving remaining material to cover the conductive pad, wherein the material includes a portion of the light-shielding structure; and performing an etching process to remove the remaining material to expose the conductive pad.

Abstract: A method for silicon carbide ingot peeling includes the steps of: placing the silicon carbide ingot between first and second suckers; having a pressing head disposed on a top surface of the first sucker to apply mechanical oscillatory energy to both the silicon carbide ingot and the second sucker through the first sucker; and, having an elastic element disposed under the second sucker to absorb part of the mechanical oscillatory energy to transmit longitudinal waves thereof to a modified layer of the silicon carbide ingot for propagating individually intermittent invisible cracks at the modified layer to break silicon carbide chains at different levels. Till the cracks connect together for forming a continuous crack across the silicon carbide ingot, a top portion of the silicon carbide ingot is then separable therefrom to form a wafer. In addition, an apparatus for silicon carbide ingot peeling is also provided.

Abstract: A device includes first and second gate structures respectively extending across the first and second fins, and a gate isolation plug between a longitudinal end of the first gate structure and a longitudinal end of the second gate structure. The gate isolation plug comprises a first dielectric layer and a second dielectric layer over the first dielectric layer. The first dielectric layer has an upper portion and a lower portion below the upper portion. The upper portion has a thickness smaller than a thickness of the lower portion of the first dielectric layer.

Abstract: Techniques for providing suggested content is described. For example, a social networking system may receive, from an account of a social networking system, an indication of a selection of a first content item. The social networking system may determine that the first content item is associated with a first topic and may receive a request from the account to access a second content item associated with the first topic. The social networking system may then cause presentation of the second content item and may determine that the request meets or exceeds a threshold number of requests for content items associated with the first topic. Based on determining that the request meets or exceeds the threshold, the social networking system may cause presentation of a suggested content item associated with a second topic.

Abstract: A semiconductor device includes a first semiconductor die and a second semiconductor die connected to the first semiconductor die. Each of the first semiconductor die and the second semiconductor die includes a substrate, a conductive bump formed on the substrate and a conductive contact formed on the conductive bump. The conductive contact has an outer lateral sidewall, there is an inner acute angle included between the outer lateral sidewall and the substrate is smaller than 85°, and the conductive contact of the first semiconductor die is connected opposite to the conductive contact of the second semiconductor die.

Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a semiconductor substrate, active devices and transparent conductive patterns. The active devices are formed on the semiconductor substrate. The transparent conductive patterns are formed over the active devices and electrically connected to the active devices. The transparent conductive patterns are made of a metal oxide material. The metal oxide material has a first crystalline phase with a prefer growth plane rich in oxygen vacancy, and has a second crystalline phase with a prefer growth plane poor in oxygen vacancy.

Abstract: A user equipment (UE) and a method are provided. The UE includes a memory and a processor configured to receive data from at least one neighboring UE; determine, based at least partially on the received data, whether to send an assistance report including assistance information providing an indication related to communication; and transmit the assistance report including the assistance information in response to determining to send the assistance report.

Abstract: In an embodiment, a device bonding apparatus is provided. The device bonding apparatus includes a first process station configured to receive a wafer; a first bond head configured to carry a die to the wafer, wherein the first bonding head includes a first rigid body and a vacuum channel in the first rigid body for providing an attaching force for carrying the die to the wafer; and a second bond head configured to press the die against the wafer, the second bond head including a second rigid body and an elastic head disposed over the second rigid body for pressing the die, the elastic head having a center portion and an edge portion surrounding the center portion, the center portion of the elastic head having a first thickness, the edge portion of the elastic head having a second thickness, the second thickness being greater than the second thickness.

Abstract: Systems and methods of determining vehicle travel routes taken by vehicles traveling between a plurality of starting and ending locations may: Identify as Trips pathways previously followed by the vehicles between various starting and ending locations; group into Groups of Trips those Trips having common pairs of starting and ending locations; separate into different Collections of Trips those Groups of Trips having Trips that followed different pathways between the common pairs of starting and ending locations; determine a Common Route for each Collection of Trips based on a number of times each road segment was traversed by the vehicles; form Current Routes by combining Common Routes having similar road segments; and select a Current Route between a defined starting location and a defined ending location, the Current Route representing the most commonly followed route previously taken by the vehicles between the defined starting and ending location.

Abstract: A method for preparing a bifunctional film, including: (a) drying a first polymer solution to form a film to form an anti-adhesion layer, and (b) drying a second polymer solution over the anti-adhesion layer to form a film to form an attachment layer. The first polymer solution includes a first hydrophobic solution and a first hydrophilic solution, and in the first polymer solution, the weight ratio of the solute of the first hydrophobic solution to the solute of the first hydrophilic solution is 1:0.01-1. Moreover, the second polymer solution is composed of a second hydrophilic solution.

Abstract: Methods and systems determine at least one production constraint for a material loading system and a material processing system; estimate an effect of entropy on a cycle time of a material conveying system to produce a future cycle time estimate; estimate an effect of entropy on a material processing time to produce a future material processing time estimate; predict whether a delay will occur during the operation of the material loading, material conveying, and material processing systems; estimate a duration of the predicted delay; determine a loading system capacity and a conveying system capacity required to meet the defined production target based on the production constraint and estimates of the future cycle time, the future material processing time, and the duration of the predicted delay; and deploy one or more material loading and conveying systems to meet the determined loading and conveying system capacities.

Abstract: A system includes a processor, and a display, a reader, a switch, a scale, a memory device, intake-type buttons and output-type buttons that are connected to the processor. The processor controls the display to display an identification number obtained by using the reader to read an identifier. The switch is operated to enable the processor to operate in an intake mode or an output mode. When operating in the intake (output) mode, the processor controls the display to display a symbol corresponding to one of the intake-type (output-type) buttons that is determined to be pressed, and in response to receipt of weight data from the scale, controls the display to display a value of pre-intake (post-output) weight obtained based on the weight data, and stores the value of pre-intake (post-output) weight in the memory device.

Abstract: Methods of deploying shovels and haul trucks to meet a defined production target may include: Determining at least one production constraint for a shovel and a material processing system; estimating an effect of entropy on a cycle time of the haul trucks to produce a future cycle time estimate; estimating an effect of entropy on a material processing time of the material processing system to produce a future material processing time estimate; predicting whether a delay will occur during the operation of the shovel, the haul trucks, and the material processing system; estimating a duration of the predicted delay; determining a number of shovels and a number of haul trucks required to meet the defined production target based on the determined production constraint, the future cycle time estimate, the future material processing time estimate, and the duration of the predicted delay; and deploying the determined number of shovels and the determined number of haul trucks.

Abstract: A resonance counterweight structure for audio effect article includes a hollow counterweight main body and an assembling section connected with the counterweight main body. The assembling section can be mounted in a predetermined position of a musical instrument. The counterweight main body at least includes an upper wall, a lower wall and a peripheral wall connected between the upper and lower walls. The upper wall, the lower wall and the peripheral wall define a chamber of the counterweight main body. At least one counterweight fine-adjustment unit is received in the chamber. The counterweight main body and the counterweight fine-adjustment unit help the audio effect article to modify the music so as to achieve more idealistic timbre effect. A player can more diversely select or replace the counterweight structure, whereby one single musical instrument can selectively output different timbre effects according to the requirements of different playing situations.

Abstract: Methods and systems determine at least one production constraint for a material loading system and a material processing system; estimate an effect of entropy on a cycle time of a material conveying system to produce a future cycle time estimate; estimate an effect of entropy on a material processing time to produce a future material processing time estimate; predict whether a delay will occur during the operation of the material loading, material conveying, and material processing systems; estimate a duration of the predicted delay; determine a loading system capacity and a conveying system capacity required to meet the defined production target based on the production constraint and estimates of the future cycle time, the future material processing time, and the duration of the predicted delay; and deploy one or more material loading and conveying systems to meet the determined loading and conveying system capacities.

Abstract: Methods of deploying shovels and haul trucks to meet a defined production target may include: Determining at least one production constraint for a shovel and a material processing system; estimating an effect of entropy on a cycle time of the haul trucks to produce a future cycle time estimate; estimating an effect of entropy on a material processing time of the material processing system to produce a future material processing time estimate; predicting whether a delay will occur during the operation of the shovel, the haul trucks, and the material processing system; estimating a duration of the predicted delay; determining a number of shovels and a number of haul trucks required to meet the defined production target based on the determined production constraint, the future cycle time estimate, the future material processing time estimate, and the duration of the predicted delay; and deploying the determined number of shovels and the determined number of haul trucks.

Abstract: Methods and systems of correlating sensed position data with terrestrial features receive sensed position data from a position sensing system operatively associated with a moveable object; select a reduced set of snap point candidates from terrestrial data based on a sensed position point; choose a best snap point candidate from among the reduced set of snap point candidates based on a plurality of predictive variables and corresponding weighting factors for each snap point candidate in the reduced set of snap point candidates; and snap the sensed position point to the best snap point candidate to produce a snapped position point. The selecting, choosing, and snapping processes are performed in substantially real time so that the systems and methods correlate the sensed position data from the moveable object with terrestrial features in substantially real time.

Abstract: A head of a tag device having a body, at least one row of negative-pressure through holes and at least one row of positive-pressure through holes. The body has a first surface and a second surface. The rows of negative and positive-pressure through holes are formed through the first and second surfaces of the body and arranged along a long-axis direction. Two negative and positive-pressure through holes at both ends of the corresponding row of negative and positive-pressure through holes are respectively close to the short sides of the body. Therefore, an effective labeling area is distributed between two short sides. The head of the tag device of the present invention provides a stable labeling operation for different products where different components are mounted and increases units per hour (UPH).

Abstract: A formaldehyde detecting device includes a formaldehyde detecting unit which includes a formaldehyde detecting layer, a diffusion restricting member and a concentration indicator. The formaldehyde detecting layer includes a formaldehyde detecting material that develops color when reacting with formaldehyde. The diffusion restricting member is disposed on the formaldehyde detecting layer and permits a restricted amount of formaldehyde to pass therethrough to react with the formaldehyde detecting material. Concentration of formaldehyde is determined based on a color change on the formaldehyde detecting layer, and is indicated by the concentration indicator.