Patents by Inventor Jung-Lung Hung

Jung-Lung Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Temperature modification for chemical mechanical polishing
    Patent number: 9550270
    Abstract: Among other things, one or more systems and techniques for increasing temperature for chemical mechanical polishing (CMP) are provided. For example, a liquid heater component is configured to supply heated liquid to a polishing pad upon which a semiconductor wafer is to be polished, resulting in a heated polishing pad having a heated polishing pad temperature. The increased temperature of the heated polishing pad increases oxidation of the semiconductor wafer, which improves a CMP removal rate of material from the semiconductor wafer due to a decreased oxidation timespan and a stabilization timespan for reaching a stable CMP removal rate during CMP. In this way, the semiconductor wafer is polished utilizing the heated polishing pad, such as by a tungsten CMP process.
    Type: Grant
    Filed: July 31, 2013
    Date of Patent: January 24, 2017
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Jung-Lung Hung, Rong-June Hsiao, Chi-Hao Huang, Hong-Hsing Chou, Yeh-Chieh Wang
  • Sapphire pad conditioner
    Patent number: 9452509
    Abstract: A sapphire pad conditioner includes a sapphire substrate having multiple protrusions on a surface and a holder arranged to hold the sapphire substrate. The sapphire substrate is used for conditioning a chemical mechanical planarization (CMP) pad.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: September 27, 2016
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Jung-Lung Hung, Chi-Hao Huang, Jaw-Lih Shih, Hong-Hsing Chou, Yeh-Chieh Wang
  • TEMPERATURE MODIFICATION FOR CHEMICAL MECHANICAL POLISHING
    Publication number: 20150038056
    Abstract: Among other things, one or more systems and techniques for increasing temperature for chemical mechanical polishing (CMP) are provided. For example, a liquid heater component is configured to supply heated liquid to a polishing pad upon which a semiconductor wafer is to be polished, resulting in a heated polishing pad having a heated polishing pad temperature. The increased temperature of the heated polishing pad increases oxidation of the semiconductor wafer, which improves a CMP removal rate of material from the semiconductor wafer due to a decreased oxidation timespan and a stabilization timespan for reaching a stable CMP removal rate during CMP. In this way, the semiconductor wafer is polished utilizing the heated polishing pad, such as by a tungsten CMP process.
    Type: Application
    Filed: July 31, 2013
    Publication date: February 5, 2015
    Inventors: Jung-Lung Hung, Rong-June Hsiao, Chi-Hao Huang, Hong-Hsing Chou, Yeh-Chieh Wang
  • Sapphire Pad Conditioner
    Publication number: 20150004787
    Abstract: A sapphire pad conditioner includes a sapphire substrate having multiple protrusions on a surface and a holder arranged to hold the sapphire substrate. The sapphire substrate is used for conditioning a chemical mechanical planarization (CMP) pad.
    Type: Application
    Filed: June 28, 2013
    Publication date: January 1, 2015
    Inventors: Jung-Lung Hung, Chi-Hao Huang, Jaw-Lih Shih, Hong-Hsing Chou, Yeh-Chieh Wang