Abstract: A semiconductor device may include a gate structure including stacked local lines and a multi-step structure, wherein the multi-step structure defines pads of the local lines, channel patterns respectively disposed over the pads, a block word line disposed over the channel patterns and extending along a profile of the multi-step structure, and first contact plugs passing through the channel patterns and respectively connecting the channel patterns and the local lines.

Abstract: A battery module including a cell stack structure in which a plurality of battery cells including a first battery cell and a second battery cell neighboring each other are stacked. A bus bar frame assembly includes a plurality of lead drawing holes from which electrode leads included in the plurality of battery cells are drawn out. An electrode lead of a first polarity included in the first battery cell and an electrode lead of the first polarity included in the second battery cell are externally drawn out through a same lead drawing hole. The electrode lead of the first battery cell and the electrode lead of the second battery cell are bent in a same direction at a same location and each includes a first bent portion formed on a terrace portion and a second bent portion formed in a region where a lead film is formed.

Abstract: An impeller includes a hub, and a vain unit provided radially at a position spaced apart by a predetermined distance based on the hub. The vane unit is configured to begin at a position spaced apart by a predetermined radius based on the hub and to end to be formed into a streamlined shape in which a beginning portion becomes narrower in width than an end portion. The vane unit includes “n” first vanes radially configured at positions spaced apart by a radius r1 based on the hub and having a first length, where “n” is a natural number equal to or greater than 3; and “n” second vanes disposed between the first vanes, the second vanes having a second length that is less than the first length of the first vanes.

Abstract: A semiconductor device may include a source structure, a support structure positioned on the source structure and including a first inclined surface extending in a second direction crossing the first direction, a gate structure positioned on the source structure and the support structure and including conductive layers and insulating layers alternately stacked, channel structures extending through the gate structure and connected to the source structure, and a slit structure extending in the first direction through the gate structure, wherein each of the conductive layers includes a second inclined surface extending in the second direction.

Abstract: The present technology relates to a semiconductor memory device and a method of manufacturing the same. The semiconductor memory device includes a first stack structure, a plurality of first slits passing through the first stack structure in a vertical direction and extending in a first horizontal direction orthogonal to the vertical direction, a first source line layer contacting an a top portion of the first stack structure, a second source line layer directly contacting the first source line layer, a second stack structure contacting the second source line layer and overlapping with the first stack structure in the vertical direction, and a plurality of second slits passing through the second stack structure in the vertical direction and extending in a second horizontal direction orthogonal to the vertical direction.

Abstract: A memory device includes a first peripheral circuit having first page buffers is functionally divided into a cell region and a connection region. A first memory cell array positioned on the first peripheral circuit includes first bit lines that are electrically connected to the first page buffers. A second memory cell array positioned on the first memory cell array includes second bit lines, which are electrically connected to the first bit lines, respectively. The first peripheral circuit is able to make use of both memory arrays using connections between the two memory arrays.

Abstract: A battery module according to an embodiment of the present disclosure includes a plurality of battery cells, a busbar frame assembly supporting the plurality of battery cells and including a plurality of busbars electrically connected to electrode leads of the plurality of battery cells, and a plurality of fixing jig holes provided in top and bottom surfaces of the busbar frame assembly, and into which welding jigs for fixing the busbar frame assembly are configured to be inserted in a welding process for electrically connecting the electrode leads of the plurality of battery cells to the plurality of busbars.

Abstract: A memory device may include a stack structure including a plurality of conductive layers and a plurality of interlayer insulating layers, which are alternately stacked along a first direction, an opening extending in the first direction from at least one conductive layer, among the plurality of conductive layers, in the stack structure, and a contact plug in the opening. The opening may include a protrusion portion protruding in a second direction intersecting the first direction.

Abstract: A battery module includes a cell stack formed by stacking a plurality of battery cells; a bus bar frame assembly including a bus bar frame configured to cover one longitudinal end and the other longitudinal end of the cell stack and a plurality of bus bars fixed on the bus bar frame and electrically connected to the battery cells; and a FPCB assembly including a first FPCB extending along a longitudinal direction of the cell stack to cover at least a portion of an upper surface of the cell stack, a second FPCB extending from both longitudinal ends of the first FPCB and electrically connected to the bus bars, and a pair of temperature sensors mounted to both longitudinal ends of the first FPCB.

Abstract: A battery module according to an embodiment of the present disclosure includes a plurality of battery cells, a module case accommodating the plurality of battery cells therein, a busbar frame assembly slidably inserted into the module case to support the plurality of battery cells, the busbar frame assembly including a plurality of busbars electrically connected to electrode leads of the plurality of battery cells, and a fuse unit connected to at least one pair of busbars of the plurality of busbars, the fuse unit being provided between the at least one pair of busbars.

Abstract: A battery module includes a cell stack formed by stacking a plurality of battery cells; a bus bar frame assembly; and an outer terminal. The bus bar frame assembly includes a bus bar frame and a plurality of bus bars fixed on the bus bar frame and electrically connected to the battery cells, the bus bar frame being configured to cover first and second opposing longitudinal ends of the cell stack, and the outer terminal is connected to the plurality of bus bars. A pair of electrode leads of each of the battery cells are formed at locations offset downwardly from a center of the cell stack in a height direction, and the outer terminal is disposed in the space formed above the electrode leads due to the offsetting of the electrode leads.

Abstract: A battery module and a battery pack comprising the same are provided. The battery module includes a cell stack including a plurality of unit cell stacks, each unit cell stack including stacked battery cells, a module housing accommodating the cell stack, and a structural reinforcement beam disposed in parallel with the battery cells and between adjacent unit cell stacks, upper and lower end portions of the structural reinforcement beam being partially inserted into and fixedly coupled to an upper surface and a lower surface of the module housing respectively such that the unit cell stacks are spatially spaced apart from each other.

Abstract: A battery module includes a cell stack structure formed as a plurality of battery cells stacked and accommodated in a module case. The module case includes at least one hole forming plate having a plurality of resin injection holes formed therein for receiving an adhesive resin therethrough, and the plurality of resin injection holes are distributed on both a left side and a right side of a center of the hole forming plate in a longitudinal direction thereof, such that the resin injection holes on the left side and the right side are spaced apart from each other by a predetermined distance from the center of the hole forming plate in the longitudinal dimension.

Abstract: A battery module according to an embodiment of the present disclosure includes a plurality of battery cells, a module case accommodating the plurality of battery cells therein, a busbar frame assembly slidably inserted into the module case to support the plurality of battery cells, the busbar frame assembly including a plurality of busbars electrically connected to electrode leads of the plurality of battery cells, and a fuse unit connected to at least one pair of busbars of the plurality of busbars, the fuse unit being provided between the at least one pair of busbars.

Abstract: A battery module according to an embodiment of the present disclosure includes a plurality of battery cells, a busbar frame assembly supporting the plurality of battery cells and including a plurality of busbars electrically connected to electrode leads of the plurality of battery cells, and a plurality of fixing jig holes provided in top and bottom surfaces of the busbar frame assembly, and into which welding jigs for fixing the busbar frame assembly are configured to be inserted in a welding process for electrically connecting the electrode leads of the plurality of battery cells to the plurality of busbars.