Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

Abstract: A chip resistance element includes a base substrate having a first surface and a second surface opposing each other, two sides connecting the first surface and the second surface to each other, and two end surfaces connecting the first surface and the second surface to each other; a resistive layer disposed on the second surface; and a first terminal, a second terminal, and a third terminal disposed to be respectively connected to the resistive layer and to be separated from each other on the second surface. The third terminal having a second surface portion disposed between the first terminal and the second terminal on the second surface and a side portion connected to and disposed on one of the two sides of the base substrate.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A resistor element includes a first terminal and a second terminal disposed on opposite end portions of a base substrate, respectively. A first resistance layer is connected to the first terminal and formed of a thick film resistor, and a second resistance layer is connected to the first resistance layer and the second terminal and is formed of a thin film resistor.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A chip resistance element includes a base substrate having a first surface and a second surface opposing each other, two sides connecting the first surface and the second surface to each other, and two end surfaces connecting the first surface and the second surface to each other; a resistive layer disposed on the second surface; and a first terminal, a second terminal, and a third terminal disposed to be respectively connected to the resistive layer and to be separated from each other on the second surface. The third terminal having a second surface portion disposed between the first terminal and the second terminal on the second surface and a side portion connected to and disposed on one of the two sides of the base substrate.

Abstract: A chip resistor includes a base substrate having a first surface and a second surface opposing each other, two side surfaces connecting the first surface and the second surface, and two end surfaces connecting the first surface and the second surface, a resistive layer disposed on the second surface of the base substrate, the resistive layer having a first surface in contact with the base substrate and a second surface opposing the first surface of the resistive layer, a first terminal and a second terminal spaced apart from each other and each being connected to the resistive layer on the second surface of the resistive layer, and a third terminal connected to the resistive layer on the second surface of the resistive layer, disposed between the first terminal and the second terminal, and extending to the first surface of the base substrate along the side surfaces.

Abstract: A resistor element includes a first terminal and a second terminal disposed on opposite end portions of a base substrate, respectively. A first resistance layer is connected to the first terminal and formed of a thick film resistor, and a second resistance layer is connected to the first resistance layer and the second terminal and is formed of a thin film resistor.

Abstract: A resistor element includes a first terminal and a second terminal disposed on opposite end portions of a base substrate, respectively. A first resistance layer is connected to the first terminal and formed of a thick film resistor, and a second resistance layer is connected to the first resistance layer and the second terminal and is formed of a thin film resistor.

Abstract: A versatile eco-friendly planting block includes: a block body in a form of a hexahedron; cut-off grooves formed at vertex parts of each surface of the block body in symmetrical to each other about a diagonal line of each surface of the block body; and a planting groove selectively formed in the cut-off groove so that vegetation is planted.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer and being thicker than each of the first electrode layer and the second electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A resistor includes: a base substrate; a resistance layer disposed on one surface of the base substrate; first and second electrode layers disposed to be spaced apart from each other and covering portions of the resistance layer; and a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the resistance layer.

Abstract: A multi-terminal electronic component includes: a base material; a resistance layer disposed on a surface of the base material; a first terminal and a second terminal disposed to be spaced apart from each other while covering portions of the resistance layer, respectively; and a third terminal disposed between the first terminal and the second terminal and covering a portion of the resistance layer, wherein first and second side surfaces of the base material opposing each other are exposed from the first through third terminals.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer to be spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer, a conductive resin electrode disposed on at least one end of the third electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A resistor element includes a base substrate, a resistor layer disposed on one surface of the base substrate, a first electrode layer and a second electrode layer disposed on the resistor layer spaced apart from each other, a third electrode layer disposed between the first electrode layer and the second electrode layer to be spaced apart from the first electrode layer and the second electrode layer and being thicker than each of the first electrode layer and the second electrode layer, and first to third plating layers disposed on the first to third electrode layers, respectively.

Abstract: A resistor includes: a base substrate; a resistance layer disposed on one surface of the base substrate; first and second electrode layers disposed to be spaced apart from each other and covering portions of the resistance layer; and a third electrode layer disposed between the first and second electrode layers to be spaced apart from the first and second electrode layers and covering a portion of the resistance layer.

Abstract: A multi-terminal electronic component includes: a base material; a resistance layer disposed on a surface of the base material; a first terminal and a second terminal disposed to be spaced apart from each other while covering portions of the resistance layer, respectively; and a third terminal disposed between the first terminal and the second terminal and covering a portion of the resistance layer, wherein first and second side surfaces of the base material opposing each other are exposed from the first through third terminals.

Abstract: A versatile eco-friendly planting block includes: a block body in a form of a hexahedron; cut-off grooves formed at vertex parts of each surface of the block body in symmetrical to each other about a diagonal line of each surface of the block body; and a planting groove selectively formed in the cut-off groove so that vegetation is planted.