Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first source/drain epitaxial feature formed over a substrate, a second source/drain epitaxial feature formed over the substrate, two or more semiconductor layers disposed between the first source/drain epitaxial feature and the second source/drain epitaxial feature, a gate electrode layer surrounding a portion of one of the two or more semiconductor layers, a first dielectric region disposed in the substrate and in contact with a first side of the first source/drain epitaxial feature, and a second dielectric region disposed in the substrate and in contact with a first side of the second source/drain epitaxial feature, the second dielectric region being separated from the first dielectric region by a substrate.

Abstract: A laser device is provided. The laser device includes a stack of epitaxial layers, a first conductive layer, an intermediate layer, and a first electrode. The stack of epitaxial layers has a central region and an edge region. The stack of epitaxial layers includes a first reflective structure, an active region disposed on the first reflective structure, a second reflective structure disposed on the active region. The first conductive layer disposes on the stack of epitaxial layers and covers the central region and at least a part of the edge region. The intermediate layer has a first opening that corresponding to the central region of the stack of epitaxial layers, wherein the intermediate layer comprises insulating material or metal. The first electrode disposes on the first conductive layer.

Abstract: A method includes depositing a first passivation layer over a conductive feature, wherein the first passivation layer has a first dielectric constant, forming a capacitor over the first passivation layer, and depositing a second passivation layer over the capacitor, wherein the second passivation layer has a second dielectric constant greater than the first dielectric constant. The method further includes forming a redistribution line over and electrically connecting to the capacitor, depositing a third passivation layer over the redistribution line, and forming an Under-Bump-Metallurgy (UBM) penetrating through the third passivation layer to electrically connect to the redistribution line.

Abstract: A golf club includes a head, a removable assembly and a shaft. The head has a body, a striking panel and a sleeve. The body is coupled with the striking panel. The sleeve is sandwiched between the body and the striking panel. The sleeve includes a neck and an assembling portion. The neck protrudes from a combined structure of the body and the striking panel, and the assembling portion is sandwiched between and enclosed by the body and the striking panel. The neck has an assembling hole. The assembling portion has at least one engaging hole extending from a surface of the assembling portion to a circumferential wall of the assembling hole. At least one engaging medium is placed in the engaging hole. The removable assembly is disposed in the assembling hole and coupled with the engaging medium. The shaft has one end inserted into the removable assembly.

Abstract: A golf club including a head, a removable assembly and a shaft is disclosed. The head has a body, a striking panel and a sleeve. The body is coupled with the striking panel. The sleeve is sandwiched between the body and the striking panel. The sleeve comprises a neck and an assembling portion. The neck protrudes from a combined structure of the body and the striking panel, and the assembling portion is sandwiched between and enclosed by the body and the striking panel. The neck has an assembling hole. The assembling portion has at least one engaging hole extending from a surface of the assembling portion to a circumferential wall of the assembling hole. At least one engaging medium is placed in the engaging hole. The removable assembly is disposed in the assembling hole and coupled with the engaging medium. The shaft has one end inserted into the removable assembly.