Abstract: A microelectromechanical system (MEMS) structure and method of forming the MEMS device, including forming a first metallization structure over a complementary metal-oxide-semiconductor (CMOS) wafer, where the first metallization structure includes a first sacrificial oxide layer and a first metal contact pad. A second metallization structure is formed over a MEMS wafer, where the second metallization structure includes a second sacrificial oxide layer and a second metal contact pad. The first metallization structure and second metallization structure are then bonded together. After the first metallization structure and second metallization structure are bonded together, patterning and etching the MEMS wafer to form a MEMS element over the second sacrificial oxide layer. After the MEMS element is formed, removing the first sacrificial oxide layer and second sacrificial oxide layer to allow the MEMS element to move freely about an axis.

Abstract: A golf club head fabrication method including the steps of i) preparing a rubber mixture and pre-warming it in a material tank of an injection molding machine; ii) preparing a club head casing having a front open chamber, a top filling hole and an inside flange within the front open chamber, then welding a face panel to the inside flange to close the front open chamber, and then filling a bonding agent through the filling hole into the front open chamber, and then pre-heating the club head casing; and iii) injecting the pre-warmed rubber mixture into the filling hole to mold a shock absorbing rubber layer in the front open chamber of the club head casing through a vulcanization process.