Patents by Inventor JUNGMO GU

JUNGMO GU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10867775
    Abstract: The substrate treating apparatus includes a process chamber having a treatment space in the interior thereof, a support unit disposed in the process chamber to support a substrate, a gas supply unit configured to supply a process gas into the process chamber, and a plasma generating unit configured to generate plasma from the process gas. The plasma generating unit includes an upper electrode disposed on the substrate, a lower electrode disposed under the substrate to be vertically opposite to the upper electrode, and three high frequency power sources configured to apply high frequency power to the lower electrode. The three high frequency power sources include a first frequency power source and a second frequency power source having frequencies of 10 MHz or less, and a third frequency power source having a frequency of 10 MHz or more.
    Type: Grant
    Filed: July 26, 2017
    Date of Patent: December 15, 2020
    Assignee: SEMES CO., LTD.
    Inventors: Jamyung Gu, Shin-Woo Nam, Jong Hwan An, Saewon Na, Jun Ho Lee, Jungmo Gu
  • Publication number: 20190131115
    Abstract: The substrate treating apparatus includes a chamber having a treatment space in the interior thereof, a support unit configured to support a substrate, a gas supply unit configured to supply a gas into the treatment space, and a plasma source configured to generate plasma, wherein the support unit includes a support plate, on which the substrate is positioned, a ring assembly surrounding a circumference of the support plate and having a ring-shaped electrode, and a voltage applying unit configured to control an incident angle of the plasma onto the substrate by applying a voltage to the ring-shaped electrode, and wherein the voltage applying unit includes a base plate of a conductive material, a DC power source configured to apply a DC voltage to the base plate, and a plurality of connecting bodies connecting the base plate and the ring-shaped electrode, formed of a conductive material.
    Type: Application
    Filed: October 30, 2018
    Publication date: May 2, 2019
    Inventors: Jamyung Gu, Jungmo Gu, Jun Ho Lee, Jong Hwan An, Saewon Na
  • Publication number: 20180033594
    Abstract: The substrate treating apparatus includes a process chamber having a treatment space in the interior thereof, a support unit disposed in the process chamber to support a substrate, a gas supply unit configured to supply a process gas into the process chamber, and a plasma generating unit configured to generate plasma from the process gas. The plasma generating unit includes an upper electrode disposed on the substrate, a lower electrode disposed under the substrate to be vertically opposite to the upper electrode, and three high frequency power sources configured to apply high frequency power to the lower electrode. The three high frequency power sources include a first frequency power source and a second frequency power source having frequencies of 10 MHz or less, and a third frequency power source having a frequency of 10 MHz or more.
    Type: Application
    Filed: July 26, 2017
    Publication date: February 1, 2018
    Inventors: JAMYUNG GU, SHIN-WOO NAM, JONG HWAN AN, SAEWON NA, JUN HO LEE, JUNGMO GU