Abstract: The present application relates to a strain and a microorganism for producing high concentration L-glutamic acid and a method of use thereof.

Abstract: An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (?*) of 5000 Pa·s to 107 Pa·s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

Abstract: The present disclosure relates to a strain for producing L-glutamic acid and a method of use thereof.

Abstract: The present invention provides a composition containing acid hydrochloride, the composition comprising 5-aminolevulinic acid hydrochloride, fermented Codonopsis lanceolata extract, a Cordyceps militaris extract, krill oil, polydeoxyribonucleotide sodium, propylene glycol, hyaluronidase, L-carnitine, caffeine, Origanum vulgare leaf oil, ascorbic acid (vitamin C), allantoin, cetyl alcohol and mineral water.

Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment of the present application comprises: forming a structure comprising a transparent base, a bonding layer provided on the transparent base, and a metal foil provided on the bonding layer; forming a metal foil pattern by patterning the metal foil; heat-treating the structure comprising the metal foil pattern at a temperature of 70° C. to 100° C.; and completely curing the bonding layer.

Abstract: Provided is a method for automatically generating a banner image for a promotion, performed by a computing device comprising a processor and a memory. The method comprises the steps of: acquiring information about any concept classification to which a product or service to be promoted corresponds from among a plurality of predefined concept classifications; determining a setting value for a foundation that is a minimum unit constituting the design of a banner image, on the basis of the concept classification to which the product or service to be promoted belongs; determining at least one component included in the banner image, on the basis of the setting value for the foundation; and generating at least one banner template including component arrangement information that is information about the location and size of which of the at least one component.

Abstract: The present invention provides an eco-friendly smart photosensitizer comprising a conjugate of hydroxypropyl methylcellulose and porfimer sodium photosensitizer, and a photo-stem cell therapy product comprising the photosensitizer. The photosensitizer of the present invention can be advantageously used in various fields including anticancer therapy, stem cell therapy, and the like, without side effects.

Abstract: The present invention provides an eco-friendly smart photosensitizer comprising a conjugate of hydroxypropyl methylcellulose and porfimer sodium photosensitizer, and a photo-stem cell therapy product comprising the photosensitizer. The photosensitizer of the present invention can be advantageously used in various fields including anticancer therapy, stem cell therapy, and the like, without side effects.

Abstract: The present application relates to an encapsulation film, a method for producing the same, an organic electronic device comprising the same, and a method for preparing an organic electronic device using the same, which allows forming a structure capable of blocking moisture or oxygen introduced into an organic electronic device from the outside, and can prevent occurrence of bright spots of the organic electronic device.

Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment of the present application comprises: forming a structure comprising a transparent base, a bonding layer provided on the transparent base, and a metal foil provided on the bonding layer; forming a metal foil pattern by patterning the metal foil; heat-treating the structure comprising the metal foil pattern at a temperature of 70° C. to 100° C.; and completely curing the bonding layer.

Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment includes: a) forming a structure including a transparent base, a bonding layer on a surface of the transparent base, and a metal foil on a surface of the bonding layer opposite the transparent base; b) forming a metal foil pattern by patterning the metal foil; c) heat-treating the structure resulting from b) at a temperature of 70° C. to 100° C.; and d) completely curing the bonding layer. Also, a transparent electrode substrate is disclosed.

Abstract: Provided are an encapsulation film, a product for encapsulating an organic electronic device (OED) using the same, and a method of encapsulating an OED. The encapsulation film may effectively block moisture or oxygen permeating into the OED from an external environment, provide high reliability due to increases in a lifespan and durability of the OED, and minimize align errors in a process of attaching the film to a substrate.

Abstract: An encapsulation film, an organic electronic device comprising the same, and a method for manufacturing the organic electronic device using the same, and the encapsulation film which forms a structure capable of blocking moisture or oxygen penetrating from the outside into the organic electronic device, effectively releases the heat accumulated in the organic electronic device, realizes endurance reliability under severe conditions of high temperature and high humidity, and prevents deterioration of the organic electronic device.

Abstract: An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (?*) of 5000 Pa·s to 107 Pa·s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.

Abstract: A method of manufacturing a transparent electrode substrate according to an exemplary embodiment includes: a) forming a structure including a transparent base, a bonding layer on a surface of the transparent base, and a metal foil on a surface of the bonding layer opposite the transparent base; b) forming a metal foil pattern by patterning the metal foil; c) heat-treating the structure resulting from b) at a temperature of 70° C. to 100° C.; and d) completely curing the bonding layer. Also, a transparent electrode substrate is disclosed.

Abstract: The present application relates to an encapsulation film, a method of manufacturing the same, an organic electronic device including the same, and a method of manufacturing the organic electronic device using the same. The present application provides an encapsulation film which can be formed to have a structure in which moisture or oxygen flowing from the outside into an organic electronic device can be effectively blocked, has excellent handling properties and processability, and also has excellent bonding properties with an organic electronic element and durability.

Abstract: The present application relates to an encapsulation film, a method for manufacturing the same, a method for manufacturing an organic electronic device using the same, and an organic electronic device comprising the same, and provides an encapsulation film which allows forming a structure capable of effectively blocking moisture or oxygen introduced into the organic electronic device from the outside, and has excellent handleability and processability, and excellent bonding property between the encapsulation layer and the panel of the organic electronic device and endurance reliability.

Abstract: The present invention relates to a thermosensitive recording material and, specifically, to a thermosensitive recording material comprising: a colorless or light-colored leuco dye; a compound of chemical formula (1) containing a non-phenolic sulfonyl urea group as a developer; at least one of general formulas II-1, II-2, and II-3 as a sensitizer; a binder; and other fillers. The thermosensitive recording material of the present invention improves the background blurring of a color-developed image by using a non-phenolic developer and exhibits excellent effects in view of color development sensitivity, water resistance, oil resistance, plasticizer resistance, and the like.

Abstract: The present application relates to an encapsulating film, a reliability assessment therefor, an organic electronic apparatus comprising the encapsulating film, and a method for producing an organic electronic apparatus which has used the encapsulating film, and provides: a reliability assessment method which can predict the reliability of the encapsulating film before same is applied to the organic electronic apparatus, the encapsulating film blocking moisture or oxygen from the outside entering the organic electronic apparatus; and the encapsulating film which can block moisture with high reliability.