Patents by Inventor Jung Sell

Jung Sell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit packaging system with underfill and method of manufacture thereof
    Patent number: 8748233
    Abstract: A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a flip chip to the substrate; attaching a heat slug to the substrate and the flip chip; and forming a moldable underfill having a top underfill surface on the substrate, the flip chip, and the heat slug, the moldable underfill having a characteristic of being liquid at room temperature and the top underfill surface over the flip chip.
    Type: Grant
    Filed: June 21, 2011
    Date of Patent: June 10, 2014
    Assignee: Stats Chippac Ltd.
    Inventors: DaeSik Choi, Oh Han Kim, Jung Sell