Abstract: A nonvolatile memory device includes a substrate comprising a first word line formation area, a second word line formation area, and a support area interposed between the first and second word line formation areas; a first stacked structure disposed over the substrate of each of the first and second word line formation areas and having a plurality of interlayer dielectric layers and a plurality of conductive layers that are alternately stacked therein; a second stacked structure disposed over the substrate of the support area and having the plurality of interlayer dielectric layers and a plurality of spaces that are alternately stacked therein; a channel layer disposed in the first stacked structure; and a memory layer interposed between the channel layer and each of the plurality of conductive layers.

Abstract: The semiconductor memory device includes a memory cell array including a first plurality of normal memory cells and a second plurality of dummy memory cells in a stacked configuration over a substrate, a first plurality of normal word lines electrically coupled to the first plurality of normal memory cells, and a second plurality of dummy word lines electrically coupled to the second plurality of dummy memory cells, wherein the first plurality of normal memory cells includes at least one bad memory cell and each of the at least one bad memory cells are is replaced with a dummy memory cell from among the second plurality of dummy memory cells.

Abstract: A semiconductor memory device is operated by, inter alia, performing least significant bit programs for pages in a first page group, performing least significant bit programs for pages in a second page group, and performing most significant bit programs for the pages in the first page group. The distance between the second page group and the common source line is greater than that between the first page group and the common source line.

Abstract: An operating method includes biasing channel regions of unselected cell strings among the cell strings to an initial voltage while applying a first pass voltage to the plurality of word lines; floating the channel regions of the unselected cell strings; increasing the first pass voltage to a second pass voltage during the floating of the channel regions; and reading data from selected memory cells of selected cell strings among the cell strings.

Abstract: A nonvolatile memory device includes a substrate comprising a first word line formation area, a second word line formation area, and a support area interposed between the first and second word line formation areas; a first stacked structure disposed over the substrate of each of the first and second word line formation areas and having a plurality of interlayer dielectric layers and a plurality of conductive layers that are alternately stacked therein; a second stacked structure disposed over the substrate of the support area and having the plurality of interlayer dielectric layers and a plurality of spaces that are alternately stacked therein; a channel layer disposed in the first stacked structure; and a memory layer interposed between the channel layer and each of the plurality of conductive layers.

Abstract: A nonvolatile memory device includes a substrate comprising a first word line formation area, a second word line formation area, and a support area interposed between the first and second word line formation areas; a first stacked structure disposed over the substrate of each of the first and second word line formation areas and having a plurality of interlayer dielectric layers and a plurality of conductive layers that are alternately stacked therein; a second stacked structure disposed over the substrate of the support area and having the plurality of interlayer dielectric layers and a plurality of spaces that are alternately stacked therein; a channel layer disposed in the first stacked structure; and a memory layer interposed between the channel layer and each of the plurality of conductive layers.

Abstract: An operating method includes biasing channel regions of unselected cell strings among the cell strings to an initial voltage while applying a first pass voltage to the plurality of word lines; floating the channel regions of the unselected cell strings; increasing the first pass voltage to a second pass voltage during the floating of the channel regions; and reading data from selected memory cells of selected cell strings among the cell strings.

Abstract: A semiconductor memory device is operated by, inter alia, performing least significant bit programs for pages in a first page group, performing least significant bit programs for pages in a second page group, and performing most significant bit programs for the pages in the first page group. The distance between the second page group and the common source line is greater than that between the first page group and the common source line.

Abstract: A semiconductor memory device is operated by, inter alia, performing least significant bit programs for pages in a first page group, performing least significant bit programs for pages in a second page group, and performing most significant bit programs for the pages in the first page group. The distance between the second page group and the common source line is greater than that between the first page group and the common source line.

Abstract: The semiconductor memory device includes a memory cell array including a first plurality of normal memory cells and a second plurality of dummy memory cells in a stacked configuration over a substrate, a first plurality of normal word lines electrically coupled to the first plurality of normal memory cells, and a second plurality of dummy word lines electrically coupled to the second plurality of dummy memory cells, wherein the first plurality of normal memory cells includes at least one bad memory cell and each of the at least one bad memory cells are is replaced with a dummy memory cell from among the second plurality of dummy memory cells.

Abstract: A nonvolatile memory device includes a substrate comprising a first word line formation area, a second word line formation area, and a support area interposed between the first and second word line formation areas; a first stacked structure disposed over the substrate of each of the first and second word line formation areas and having a plurality of interlayer dielectric layers and a plurality of conductive layers that are alternately stacked therein; a second stacked structure disposed over the substrate of the support area and having the plurality of interlayer dielectric layers and a plurality of spaces that are alternately stacked therein; a channel layer disposed in the first stacked structure; and a memory layer interposed between the channel layer and each of the plurality of conductive layers.

Abstract: The present technology includes a semiconductor memory device and a method of manufacturing the same. The semiconductor device includes insulation patterns and cell word lines alternately stacked on a substrate. A cell channel layer is formed through the insulation patterns and the cell word lines. A select channel layer is connected to the cell channel layer, and the select channel layer has a resistance higher than a resistance of the cell channel layer. A select line surrounds the select channel layer.

Abstract: A three-dimensional (3-D) non-volatile memory device according to embodiment of the present invention includes a plurality of bit lines, at least one string row extending in a first direction coupled to the bit lines and including 2N strings, wherein the N includes a natural number, a common source selection line configured to control source selection transistors of the 2N strings included in a memory block, a first common drain selection line configured to control drain selection transistors of a first string and a 2N-th string among the 2N strings included in a memory block, and N?1 second common drain selection lines configured to control drain selection transistors of adjacent strings in the first direction among remaining strings other than the first string and the 2N-th string.

Abstract: The present technology includes a semiconductor memory device and a method of manufacturing the same. The semiconductor device includes insulation patterns and cell word lines alternately stacked on a substrate. A cell channel layer is formed through the insulation patterns and the cell word lines. A select channel layer is connected to the cell channel layer, and the select channel layer has a resistance higher than a resistance of the cell channel layer. A select line surrounds the select channel layer.

Abstract: A semiconductor memory device is operated by, inter alia, performing least significant bit programs for pages in a first page group, performing least significant bit programs for pages in a second page group, and performing most significant bit programs for the pages in the first page group. The distance between the second page group and the common source line is greater than that between the first page group and the common source line.

Abstract: A three-dimensional (3-D) non-volatile memory device according to embodiment of the present invention includes a plurality of bit lines, at least one string row extending in a first direction coupled to the bit lines and including 2N strings, wherein the N includes a natural number, a common source selection line configured to control source selection transistors of the 2N strings included in a memory block, a first common drain selection line configured to control drain selection transistors of a first string and a 2N-th string among the 2N strings included in a memory block, and N?1 second common drain selection lines configured to control drain selection transistors of adjacent strings in the first direction among remaining strings other than the first string and the 2N-th string.

Abstract: A sintered alloy composition for automotive engine valve seats, and a method for producing the same, are described. An iron base sintered alloy composition comprising vanadium carbide particles, Fe—Co—Ni—Mo alloy particles, and Cr—W—Co—C alloy particles in which the composition is dispersed in a structure of sorbite is particularly suitable for use as materials of valve seats for automotive engines which requires excellent wear resistance, high-performance, high-rotation-speed, and low-fuel-consumption.

Abstract: A sintered alloy having an improved wear resistance and a workability for a valve seat. The alloy contains iron as a main component, carbon, silicon, chromium, molybdenum, cobalt, maganese, lead, vanadium, advantageously boron nitride, and tungsten. The strength, wear resistance, and material properties are improved by a sub-zero treatment. Sintered alloy with wear resistance used for a valve seat comprises Fe as a main component, C of 1.2 to 1.7 wt %, Cr of 3.5 to 5.0 wt %, Mo of 2.0 to 4.0 wt %, V of 3.0 to 5.0 wt %, W of 7.0 to 10.0 wt %, Co of 2.0 to 3.5 wt %, boron nitride of 0.1 to 1.0 wt %, S of 0.2 to 0.4 wt %, Mn of 0.2 to 0.5 wt %, advantageously 0.2 to 0.6% Si, and Pb of 10.0 to 15.0 wt %. Sintered alloy for an valve seat is manufactured by a sub-zero treatment so that the amount of metallic particles separated from a base matrix decreases and a size of the separated metallic particle becomes small.

Abstract: A sintered alloy composition for automotive engine valve seats, and a method for producing the same, are described. An iron base sintered alloy composition comprising vanadium carbide particles, Fe—Co—Ni—Mo alloy particles, and Cr—W—Co—C alloy particles in which the composition is dispersed in a structure of sorbite is particularly suitable for use as materials of valve seats for automotive engines which requires excellent wear resistance, high-performance, high-rotation-speed, and low-fuel-consumption.

Abstract: A synchronizer ring of the transmission of an automobile comprising an inner ring made of the powder of sintered ferroalloy, and an outer ring made of the brass-sintered alloy, the inner ring and the outer ring are integrally united by the brazing. The synchronizer ring is manufactured by method comprising step for pressurizing the powder of the sintered ferroalloy with the pressure 6˜7 ton/cm2 and forming the body of the outer ring under the reducing atmosphere at the temperature of 1,140±20° C., step for forming the inner ring with the brass-sintered alloy and plating the outer ring with nickel, step for spreading the brazing powder on the surface of the inner ring; and step for brazing the inner ring and the outer ring and integrally uniting each other under the reducing atmosphere at the temperature of 900˜920° C. for 20˜40 minutes.