Abstract: Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.

Abstract: Embodiments of the invention provide a method of manufacturing an embedded printed circuit board, which includes the following operations in the order presented: a first operation of forming a first cavity and a third cavity, disposing a first device in the first cavity and disposing a third device in the third cavity; a second operation of forming a second cavity and a fourth cavity, disposing a second device in the second cavity; a third operation of providing an insulating member; a fourth operation of disposing a first base substrate and a second base substrate and pressure laminating the first base substrate, the second base substrate, and the insulating member together; and a fifth operation of forming a first copper clad laminate and forming a second copper clad laminate.

Abstract: A chip-embedded printed circuit board (PCB), a semiconductor package using the PCB, and a manufacturing method of the chip-embedded PCB. The semiconductor package using a chip-embedded printed circuit board (PCB) includes upper and lower semiconductor packages having a package on package (PoP) structure, wherein the lower semiconductor package includes a base substrate including predetermined circuit patterns formed therein; an electronic component electrically connected to the circuit pattern and embedded in the base substrate such that one surface thereof is exposed to an upper surface of the base substrate; and a heat dissipation member installed on an exposed surface of the electronic component to dissipate heat generated from the electronic component to the outside.

Abstract: The present invention relates to an environmental load assessment system, which is capable of efficiently and simply assessing an environmental load of a building in all stages (e.g., a planning stage, a design stage, a construction stage, and a use stage after construction) in doing executing a business by subdividing an assessment process, such as simple assessment in the design stage, detailed assessment in the start stage, and site assessment in the construction stage according to the progress of a construction project.

Abstract: An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.

Abstract: Disclosed herein is a semiconductor package including an electrical device having a first lateral surface; and a core substrate including a cavity in which the electrical device is positioned, wherein the core substrate is inclined in a thickness direction of the core substrate and has a second lateral surface that defines the cavity.

Abstract: The present invention relates to an environmental load assessment system, which is capable of efficiently and simply assessing an environmental load of a building in all stages (e.g., a planning stage, a design stage, a construction stage, and a use stage after construction) in doing executing a business by subdividing an assessment process, such as simple assessment in the design stage, detailed assessment in the start stage, and site assessment in the construction stage according to the progress of a construction project.

Abstract: Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

Abstract: Disclosed is a printed circuit board having an embedded electronic component, including a metal substrate having a first cavity formed in a thickness direction and a support plate integrated with one side of the metal substrate and formed in the first cavity. Thereby, a method of manufacturing such a printed circuit board is also provided. When manufacturing the printed circuit board having an embedded electronic component, there is no need for an additional member including support tape to seat the electronic component, thus simplifying the manufacturing process and reducing lead time, thereby improving productivity.

Abstract: Disclosed herein is a printed circuit board having electronic components embedded therein. The printed circuit board having electronic components embedded therein includes: a metal core layer connected to a ground terminal of an external power supply to be grounded and having a cavity or a groove part formed thereon; an electronic component accommodated in the cavity and having a plurality of terminals, a ground terminal included in the plurality of terminals being connected to the metal core layer; an internal insulating layer stacked on both sides of the metal core layer; and circuit patterns formed on an external surface of the internal insulating layer.

Abstract: Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

Abstract: Disclosed is an embedded printed circuit board, in which electronic devices having different thicknesses can be embedded together, thus achieving highly dense electronic devices, and when electronic devices having considerably different thicknesses are embedded, two electronic devices which are comparatively thinner can be embedded in a perpendicular direction, thus reducing an embedding area and suppressing warping of the printed circuit board, and an insulating member the thickness of which is variably adjusted is interposed between base substrates, so that spaces between the electronic devices are completely filled therewith, thus solving the problem of void defects, resulting in reliable printed circuit boards, and, when a base substrate includes a core made of metal, the printed circuit board can less warp. Also a method of manufacturing the embedded printed circuit board is provided.

Abstract: A method of manufacturing a printed circuit board including an electronic component embedded therein, including: preparing a core substrate, which has a cavity formed therein and which includes internal circuit layers formed thereon; attaching a tape to one side of the core substrate; attaching an electronic component on the tape such that the cavity receives the electronic component therein; forming a first insulating layer on another side of the core substrate such that the first insulating layer infiltrates into the cavity; removing the tape attached to the one side of the core substrate, and forming connecting parts for electrically connecting electrode terminals of the electronic component to the internal circuit layer formed on the one side of the core substrate; and forming a second insulating layer on the one side of the core substrate from which the tape is removed

Abstract: An electronic component embedded printed circuit board is disclosed. In accordance with an embodiment of the present invention, the electronic component embedded printed circuit board is a printed circuit board in which an electronic component is embedded in a core board, and the electronic component includes a silicon layer and a passivation layer, which is formed on one surface of the silicon layer. Here, a center line of the silicon layer and a center line of the core board are placed on a same line.

Abstract: The present invention relates to a printed circuit board including an electronic component embedded therein and a method of manufacturing the board, which electrically connect electrode terminals of the electronic component to the internal circuit layers using connecting parts, thus the circuit density is dispersed