Abstract: Provided is a compound selected from a compound of chemical formula 1 having lysine-specific demethylase-1 (LSD1) inhibitory activity, and a tautomer, a stereoisomer, and a solvate thereof, and pharmaceutically acceptable salts of the aforementioned components. The compound is effective in the prevention or treatment of diseases caused by abnormal activation of LSD1. Also disclosed is a composition containing the compound as an active ingredient and its uses in preventing and/or treating diseases caused by abnormal activation of LSD1.

Abstract: A semiconductor device includes a substrate including an active region having an isolated shape and a field region. A gate insulation layer is provided on an upper surface of the active region of the substrate. A gate electrode is provided on the gate insulation layer and spaced apart from the boundary of the active region to cover the middle portion of the active region. An impurity region is provided under a surface of the active region that is exposed by the gate electrode.

Abstract: A semiconductor device includes a substrate including an active region having an isolated shape and a field region. A gate insulation layer is provided on an upper surface of the active region of the substrate. A gate electrode is provided on the gate insulation layer and spaced apart from the boundary of the active region to cover the middle portion of the active region. An impurity region is provided under a surface of the active region that is exposed by the gate electrode.

Abstract: Provided are an alignment mark with a higher rate of recognition, a semiconductor chip including the alignment mark, a semiconductor package including the semiconductor chip, and methods of fabricating the alignment mark, the semiconductor chip, and the semiconductor package. The alignment mark may include an align metal pad on a substrate and may be electrically isolated. A protective film may be on the align metal pad and may include an aperture exposing a part of the align metal pad. A metal alignment bump may be on the align metal pad exposed in the aperture such that the metal alignment bump protrudes above the protective film.