Abstract: Disclosed is a miniaturized battery module in which a space except for a space of a battery cell is minimized and the number of components is reduced. The miniaturized battery module includes a cell assembly configured by assembling a plurality of battery cells, an upper frame inserted into an outer upper surface of the cell assembly, a lower frame inserted into an outer lower surface of the cell assembly and fastened to the upper frame, and first and second endplates fastened to two opposite ends of the cell assembly and configured to fix the plurality of battery cells. In this case, at least two or more of the plurality of the battery cells are arranged side by side, and the upper frame and the lower frame are fastened by welding.

Abstract: In a multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip, in the case where not only a logic circuit of a first chip but also a logic circuit of a second chip requires an input signal, the multi-chip packaged integrated circuit device transmits the input signal to one or both of the logic circuits of the first and second chips via a synchronizer. In a case where three or more chips are integrated into the multi-chip packaged integrated circuit device, the input signal can be selectively transmitted to one or more of the three or more chips via the synchronizer.

Abstract: Provided is an interposer pattern having a conductive material for forming a pad chain that can reduce a wafer test time. The interposer pattern includes one or more interposers and an external conductive material for the pad chain. Each of the interposers includes a plurality of pad pairs internally interconnected. The external conductive material is disposed at external sides of the interposers to interconnect the pad pairs of one of the interposers or to interconnect at least two of the interposers. The external conductive material can be disposed at scribe lanes of a wafer.

Abstract: A plurality of chip regions are defined over a surface of a semiconductor substrate and separated from one another by a scribe region. A plurality of main pads are disposed in the chip regions and a test element group is disposed at the scribe region. The test element group is electrically connected to the main pads through interconnections.

Abstract: Provided is an apparatus and method for a testing multi-stack integrated circuit package. The apparatus may include a vacuum pump and a socket. The socket may include a plurality of internal pins, a plurality of external pins, a socket body, and at least one first air inlet. The plurality of external pins may be electrically connected to the plurality of internal pins. The at least one first air inlet may communicate with the atmosphere between the plurality of internal pins. When the multi-stack integrated circuit package including a plurality of packages is tested, a plurality of package pins of the multi-stack integrated circuit package may be inserted (or placed) into the plurality of internal pins of the socket. The multi-stack integrated circuit package may be pulled (or positioned) by applying a vacuum through the first air inlet of the socket using the vacuum pump.

Abstract: A semiconductor device includes an integrated circuit and a pad coupled to the integrated circuit. The pad has a probing area and a bonding area, and a material of the pad has multiple heights from the probing area to the bonding area. Such heights allow for easy recognition for probing at the probing area, and any damage at the probing area does not degrade quality of wire bonding in the bonding area.

Abstract: In a multi-chip packaged integrated circuit device for transmitting signals from one chip to another chip, in the case where not only a logic circuit of a first chip but also a logic circuit of a second chip requires an input signal, the multi-chip packaged integrated circuit device transmits the input signal to one or both of the logic circuits of the first and second chips via a synchronizer. In a case where three or more chips are integrated into the multi-chip packaged integrated circuit device, the input signal can be selectively transmitted to one or more of the three or more chips via the synchronizer.

Abstract: A variety of pad arrangements are provided for semiconductor devices for reducing the likelihood of bonding failures, particularly those due to shorts, and/or for reducing the difference in length between bonding wires to decrease signal skew during operation of the semiconductor device and improve signal integrity.

Abstract: A variety of pad arrangements are provided for semiconductor devices for reducing the likelihood of bonding failures, particularly those due to shorts, and/or for reducing the difference in length between bonding wires to decrease signal skew during operation of the semiconductor device and improve signal integrity.

Abstract: An ESD (electrostatic discharge) circuit embedded in an SIP (system-in-package) chip using a plurality of power sources is provided. The SIP chip includes: a first chip having a first electrostatic discharge protecting circuit between a first power voltage and a first ground voltage; a second chip having a second ESD protecting circuit between a second power voltage and a second ground voltage; a first coupling diode unit having a plurality of diodes which are serially connected between the first power voltage and the second power voltage in a bidirectional manner; and a second coupling diode unit having a plurality of diodes which are serially connected between the first ground voltage and the second ground voltage in a bidirectional manner, so that the ESD stress applied to each chip can sink to the power source in the corresponding chip and the other power sources in the other chip by connecting different power sources in the SIP chip through the coupling diode unit.

Abstract: A plurality of chip regions are defined over a surface of a semiconductor substrate and separated from one another by a scribe region. A plurality of main pads are disposed in the chip regions and a test element group is disposed at the scribe region. The test element group is electrically connected to the main pads through interconnections.

Abstract: A variety of pad arrangements are provided for semiconductor devices for reducing the likelihood of bonding failures, particularly those due to shorts, and/or for reducing the difference in length between bonding wires to decrease signal skew during operation of the semiconductor device and improve signal integrity.