Patents by Inventor JUNGSUK GOH

JUNGSUK GOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Die bonding apparatus and method and substrate bonding apparatus and method
    Patent number: 11600593
    Abstract: Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: March 7, 2023
    Assignee: SEMES CO., LTD.
    Inventors: Hanglim Lee, Jungsuk Goh, Kwangsup Kim, Doyeon Kim, Minyoung Kim, Jihoon Park, Yungi Kim, Do Heon Kim, Choonghyun Lee, Hyo Seok Lee, Soo Ill Jang
  • METHOD AND APPARATUS FOR TREATING SUBSTRATE
    Publication number: 20230044888
    Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.
    Type: Application
    Filed: October 14, 2022
    Publication date: February 9, 2023
    Applicant: SEMES CO., LTD.
    Inventors: Yong-Jun SEO, Hyun YOON, Jungsuk GOH, Byeong Geun KIM, Yoonki SA, Doyeon KIM, Yerim YEON, Choonghyun LEE, Pil Kyun HEO, Youngje UM, Jaeseong LEE, Dongok AHN
  • METHOD AND APPARATUS FOR TREATING SUBSTRATE
    Publication number: 20210050210
    Abstract: The inventive concept provides a method for treating a substrate. In an embodiment, the substrate treating method includes a treatment step of treating a residue on the substrate with a first fluid in a supercritical state and a second fluid in a supercritical state in a process space of a chamber, and the first fluid in the supercritical state and the second fluid in the supercritical state have different densities.
    Type: Application
    Filed: August 14, 2020
    Publication date: February 18, 2021
    Applicant: SEMES CO., LTD.
    Inventors: Yong-Jun SEO, Hyun YOON, Jungsuk GOH, Byeong Geun KIM, Yoonki SA, Doyeon KIM, Yerim YEON, Choonghyun LEE, Pil Kyun HEO, Youngje UM, Jaeseong LEE, Dongok AHN
  • DIE BONDING APPARATUS AND MEHOD AND SUBSTRATE BONDING APPARATUS AND MEHOD
    Publication number: 20200126948
    Abstract: Disclosed are a die bonding apparatus, a substrate bonding apparatus, a die bonding method, and a substrate bonding method that are capable of bonding a die to a substrate or bonding substrates together without using a bonding medium such as an adhesion film and a solder bump. The die bonding method includes hydrophilizing a bonding surface of the die, by plasma processing, forming a liquid film on a bonding area of the substrate, by supplying a liquid including water to the bonding area of the substrate, pre-bonding the die to the substrate by bringing the die into contact with the liquid film, and post-bonding one or more dies to the substrate at the same time, by performing heat treatment in a state in which the one or more dies are pre-bonded to the substrate.
    Type: Application
    Filed: October 21, 2019
    Publication date: April 23, 2020
    Inventors: HANGLIM LEE, JUNGSUK GOH, KWANGSUP KIM, DOYEON KIM, MINYOUNG KIM, JIHOON PARK, YUNGI KIM, DO HEON KIM, CHOONGHYUN LEE, HYO SEOK LEE, SOO ILL JANG