Patents by Inventor Jung-Sung Shih

Jung-Sung Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7277285
    Abstract: The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.
    Type: Grant
    Filed: April 4, 2005
    Date of Patent: October 2, 2007
    Assignee: Delta Electronics, Inc.
    Inventors: Jung-Sung Shih, Wei-Fang Wu, Yu-Hung Huang, Chin-Ming Chen
  • Patent number: 7128134
    Abstract: A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.
    Type: Grant
    Filed: November 5, 2004
    Date of Patent: October 31, 2006
    Assignee: Delta Electronics, Inc.
    Inventors: Jung-Sung Shih, Wei-Fang Wu, Yu-Hung Huang, Chin-Ming Chen
  • Publication number: 20050225943
    Abstract: The invention discloses a heat dissipation module. The heat dissipation module includes two separate cases and a porous structure. The cases are U-shaped and correspondingly connect to each other to form a sealed chamber. The porous structure is formed on an inner surface of the chamber. The heat dissipation module further includes at least one heat conducting structure connected to an exterior surface of the sealed chamber. The heat conducting structure may be fins or heat conducting plates connected to the chamber by welding, locking, fitting, engaging, or adhering.
    Type: Application
    Filed: April 4, 2005
    Publication date: October 13, 2005
    Inventors: Jung-Sung Shih, Wei-Fang Wu, Yu-Hung Huang, Chin-Ming Chen
  • Publication number: 20050211419
    Abstract: A heat dissipation module is disclosed for providing good heat-dissipating efficiency. First and second cases correspond to each other, with a heat conducting structure connecting to an opening of the second case. The first and second cases and the heat conducting structure form a closed structure with a porous structure therein.
    Type: Application
    Filed: November 5, 2004
    Publication date: September 29, 2005
    Inventors: Jung-Sung Shih, Wei-Fang Wu, Yu-Hung Huang, Chin-Ming Chen