Abstract: A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface, a sidewall substantially orthogonal to the first surface and the second surface; and a metallic layer surrounding and connected with the sidewall of the substrate, wherein the metallic layer includes an exposed surface substantially level with the first or second surface of the substrate. Further, a method of manufacturing the semiconductor structure is also disclosed.

Abstract: A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface, a sidewall substantially orthogonal to the first surface and the second surface; and a metallic layer surrounding and connected with the sidewall of the substrate, wherein the metallic layer includes an exposed surface substantially level with the first or second surface of the substrate. Further, a method of manufacturing the semiconductor structure is also disclosed.

Abstract: A semiconductor structure includes a substrate including a first surface and a second surface opposite to the first surface; a dielectric layer disposed over the second surface or below the first surface; a polymeric layer disposed over or below the dielectric layer; an isolation layer surrounding and contacted with the substrate, the dielectric layer and the polymeric layer; a die disposed over the polymeric layer; a first conductive bump disposed below the first surface of the substrate; and a second conductive bump disposed between the second surface of the substrate and the die.

Abstract: A semiconductor structure includes a substrate including a first surface and a second surface opposite to the first surface; a dielectric layer disposed over the second surface or below the first surface; a polymeric layer disposed over or below the dielectric layer; an isolation layer surrounding and contacted with the substrate, the dielectric layer and the polymeric layer; a die disposed over the polymeric layer; a first conductive bump disposed below the first surface of the substrate; and a second conductive bump disposed between the second surface of the substrate and the die.

Abstract: A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface, a first sidewall substantially orthogonal to the first surface and the second surface; an isolation layer surrounding and contacted with the first sidewall of the substrate; a die disposed over the second surface of the substrate; a first conductive bump disposed at the first surface of the substrate; and a second conductive bump disposed between the substrate and the die.

Abstract: A semiconductor structure includes a substrate including a first surface, a second surface opposite to the first surface, a first sidewall substantially orthogonal to the first surface and the second surface; an isolation layer surrounding and contacted with the first sidewall of the substrate; a die disposed over the second surface of the substrate; a first conductive bump disposed at the first surface of the substrate; and a second conductive bump disposed between the substrate and the die.

Abstract: A control system controlling the tilt actuator and the tray motor of a optical disk drive includes a control device including a control unit generating control signals and a selection unit outputting a selection signal. A signal amplifier coupled to the control unit amplifies signals from the control unit. A de-multiplexer has an input node coupled to the signal amplifier and a control node coupled to the selection unit. A tilt actuator coupled to the first node of the de-multiplexer controlling the tilt angle of a pick-up head and a tray motor coupled to the second node of the de-multiplexer.

Abstract: The present invention provides a method for adjusting the mechanical error of an optical disc reading device. The optical disc reading device consists of a driving device and an optical pickup. The driving device has a base plate for supporting and rotating an optical disc. The method consists of moving the optical pickup to surface of optical disc, the optical pickup emitting two tracking light spots onto the surface, and the optical pickup reciprocally moving relative to the surface. Next, the optical pickup reads reflected signal of two tracking light spots for generating a track crossing signal. By using the track crossing signal, the method adjusts position of optical pickup relative to the base plate.

Abstract: The present invention provides a method for adjusting the mechanical error of an optical disc reading device. The optical disc reading device consists of a driving device and an optical pickup. The driving device has a base plate for supporting and rotating an optical disc. The method consists of moving the optical pickup to surface of optical disc, the optical pickup emitting two tracking light spots onto the surface, and the optical pickup reciprocally moving relative to the surface. Next, the optical pickup reads reflected signal of two tracking light spots for generating a track crossing signal. By using the track crossing signal, the method adjusts position of optical pickup relative to the base plate.

Abstract: The present invention provides a method for adjusting the mechanical error of an optical disc reading device. The optical disc reading device consists of a driving device and an optical pickup. The driving device has a base plate for supporting and rotating an optical disc. The method consists of moving the optical pickup to surface of optical disc, the optical pickup emitting two tracking light spots onto the surface, and the optical pickup reciprocally moving relative to the surface. Next, the optical pickup reads reflected signal of two tracking light spots for generating a track crossing signal. By using the track crossing signal, the method adjusts position of optical pickup relative to the base plate.