Abstract: The present disclosure relates to a portable printer including a main body in a portable form which is capable of accommodating a cartridge having a nozzle for delivering a printing material to a target having a soft or hard surface, a seating part which is provided to be exposed to an outside from a lower portion of the main body to face the surface of the target and at least partially surrounds the nozzle, a roller provided respectively at the front and rear of the nozzle at the lower portion of the main body with respect to a direction in which the main body moves along the surface of the target to deliver the printing material to the target, and a printing adjustment unit configured to adjust a height difference between the nozzle and the roller to adjust a height difference between the nozzle and the surface of the target.

Abstract: Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 ?m, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.

Abstract: Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 ?m, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.

Abstract: Provided is a carrier module for use in a handler for handling a packaged chip for a test, the carrier module including a body provided, a base plate where the packaged chips are placed, provided to the body, and at least one latch which holds the packaged chips in position in the base plate.

Abstract: A test handler includes a loading unit including a loading picker and a loading ascending/descending unit, an unloading unit including an unloading picker and an unloading ascending/descending unit, and a chamber system. A passage site connects the loading unit and the chamber system, and also connects the chamber system and the unloading unit. The arrangement of the handler reduces the time for the loading and unloading processes by performing the loading and unloading processes on separate test trays located at separate loading and unloading positions.

Abstract: A tray transferring apparatus for transferring a handling tray on which semiconductor devices are mounted prevents the semiconductor devices from being scattered or separated from the handling tray. The tray transferring apparatus includes a fixing means installed on a main frame for supporting a fixed tray, a correcting means installed on the main frame for correcting the position of the fixed tray, a gripping means installed on the main frame for gripping a handling tray, and at least one sensor for sensing gripper plates and the handling tray. A fixed tray is held by the fixing means, and right/left inclination of the fixed tray is corrected by the correcting means. An upper portion of a handling tray holding semiconductors is covered by the bottom of the fixed tray and is gripped by the gripping means.

Abstract: A handler for handling semiconductor chips during a testing process includes a loading position at which packaged chips are loaded into a test tray, and an unloading position at which the packaged chips are unloaded from the test tray. The test tray follows a path through the handler from the loading position to the unloading position, and from the unloading position to the loading position. By separately performing the loading and unloading operations at these different positions within the handler, malfunctions in loading and unloading pickers that load and unload the chips may be reduced. Further, a malfunction in one picker performing one operation may be prevented from influencing operations of the other picker performing another operation. Additionally, collision between the loading picker and the unloading picker may be prevented.

Abstract: A test handler includes a loading unit including a loading picker and a loading ascending/descending unit, an unloading unit including an unloading picker and an unloading ascending/descending unit, and a chamber system. A passage site connects the loading unit and the chamber system, and also connects the chamber system and the unloading unit. The arrangement of the handler reduces the time for the loading and unloading processes by performing the loading and unloading processes on separate test trays located at separate loading and unloading positions.

Abstract: A handler for handling semiconductor chips during a testing process includes a loading position at which packaged chips are loaded into a test tray, and an unloading position at which the packaged chips are unloaded from the test tray. The test tray follows a path through the handler from the loading position to the unloading position, and from the unloading position to the loading position. By separately performing the loading and unloading operations at these different positions within the handler, malfunctions in loading and unloading pickers that load and unload the chips may be reduced. Further, a malfunction in one picker performing one operation may be prevented from influencing operations of the other picker performing another operation. Additionally, collision between the loading picker and the unloading picker may be prevented.

Abstract: Provided is a carrier module for use in a handler for handling a packaged chip for a test, the carrier module including a body provided, a base plate where the packaged chips are placed, provided to the body, and at least one latch which holds the packaged chips in position in the base plate.

Abstract: Provided is a picker for transferring packaged chips, including a picker base, a base block fixably connected to the picker base, a plurality of nozzle assemblies, provided to the base block, each nozzle assembly being movable up and down, and having a nozzle which a packaged chip is held against or released from by air pressure, an air pressure supplying unit supplying negative or positive pressure by which the packaged chip is held against or released from the nozzle, a plurality of first mechanisms, through each of which the negative or positive pressure is supplied to the nozzle; and a plurality of second mechanisms, each of which moves up and down each of nozzle assemblies.

Abstract: Provided is a pushing block for use in a handle and a handler equipped with the pushing block. The pushing block includes pushing pins, provided under the test tray, each pushing the latch upwards from under the test tray to enable the latch to release the packaged chip, a first plate on which the pushing pins are provided, and an assembly changing horizontal motion into vertical motion to move the first plate vertically. Positioning of the pushing block under the test tray prevents interference between the pushing block and the picker during loading and unloading and makes it convenient to take corrective action when malfunction of the picker occurs.

Abstract: A handler is provided, including a chamber in which to-be-tested packaged chips contained in a test tray are connected to sockets of a test board, an exchanging unit exchanging the test trays with the chamber; a transferring unit transferring the test tray containing the to-be-tested packaged chips from the exchanging unit to the chamber, and transferring the test tray containing tested packaged chips from the chamber to the exchanging unit, a picker removing the tested packaged chips from the test tray staying in the exchanging unit and putting the to-be-tested packaged chips into the test tray staying in the exchanging unit; and an inserting unit including a pusher pushing the test tray to connect the to-be-tested packaged chips to the sockets of the test board, a pusher driving unit driving the pusher, a sensor sensing an amount of pressure applied by the pusher to the test tray; and a controller controlling the pusher driving unit to enable the pusher to apply a proper amount of pressure to the test tray.