Patents by Inventor Jung Ug KWAK

Jung Ug KWAK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Metal core solder ball and heat dissipation structure for semiconductor device using the same
    Patent number: 10661394
    Abstract: Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 ?m, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.
    Type: Grant
    Filed: November 18, 2013
    Date of Patent: May 26, 2020
    Assignee: DUKSAN HI-METAL CO., LTD.
    Inventors: Yong Cheol Chu, Hyun Kyu Lee, Jung Ug Kwak, Seung Jin Lee, Sang Ho Jeon, Yong Sik Choi
  • METAL CORE SOLDER BALL AND HEAT DISSIPATION STRUCTURE FOR SEMICONDUCTOR DEVICE USING THE SAME
    Publication number: 20140183733
    Abstract: Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40˜600 ?m, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.
    Type: Application
    Filed: November 18, 2013
    Publication date: July 3, 2014
    Applicant: DUKSAN HI-METAL CO., LTD
    Inventors: Yong Cheol CHU, Hyun Kyu LEE, Jung Ug KWAK, Seung Jin LEE, Sang Ho JEON, Yong Sik CHOI