Abstract: The present invention relates to a non-oriented electrical steel sheet adhesive coating composition including the constituent elements below, a non-oriented electrical steel sheet product, and a manufacturing method thereof. The non-oriented electrical steel sheet adhesive coating composition includes: a first component including an organic/inorganic composite; and a second component including a composite metal phosphate, wherein the organic/inorganic composite is formed by having inorganic nanoparticles chemically substituted with some functional groups in an organic resin, the organic resin is one, or two or more, selected from an epoxy-based resin, an ester-based resin, an acrylic resin, a styrene-based resin, a urethane-based resin, and an ethylene-based resin, and the inorganic nanoparticles are one, or two or more, selected from SiO2, Al2O3, TiO2, MgO, ZnO, and ZrO2.

Abstract: Disclosed is a memory controller comprising: a memory unit including tables, in which various segments are stored; a calculator configured to update a parity for the segments stored in each of the tables whenever the table is updated when a segment is currently inputted, detect an error in the table based on a previously updated parity and a currently updated parity corresponding to the table; and a bit inverter configured to correct the detected error, and an operating method therefor.

Abstract: A robot using multi-color code cards having a starting color portion, at least one of middle color portions, and a base color portion. The starting color portion indicates a start of each multi-color code card, the at least one of middle color portions has colors different from one another and from the color of the starting color portion, the base color portion has a color different from the starting color portion and different from the adjacent one of the middle color portions, codes corresponding to combined colors of the at least one of middle color portions and the base color portion are allotted, and when pushing the starting color portion below a single-color sensor, operations corresponding to the codes of combined colors of the at least one of middle color portions and the base color portion recognized by the robot are stored.

Abstract: A camera module comprises a lens barrel, a lens driving device including a focusing unit moving a lens barrel in an optical axis direction and a movement correction unit moving the lens barrel in a direction perpendicular to the optical axis direction, and a housing accommodating the lens barrel and the lens driving device. A focus sensing portion of the focusing unit is disposed in an area not including a planar surface on which a focusing magnet and a focusing coil are mounted.

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.

Abstract: An electronic device according to an example embodiment includes: a substrate; and a connector including a plurality of terminals disposed on a first area of the substrate, wherein the substrate includes: a first layer including signal lines connected to the plurality of terminals and a dielectric material disposed between the signal lines; a second layer disposed on the first layer, and including a first ground electrically connected with the connector and a second ground physically isolated from the first ground; a third conductive layer disposed on the second layer, and electrically connected with the second ground; and a fourth layer having a nonconductive material disposed on an area corresponding to the first area between the second layer and the third conductive layer.

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.

Abstract: A system, apparatus, and method are provided for securing data using a graphics processor. Included is a central processor in communication with a graphics processor. The graphics processor is configured to generate a plurality of key streams utilizing a counter mode of operation. Further, the central processor is configured to perform an XOR operation on the plurality of key streams and data.

Abstract: An electronic device for detecting a position of an object is disclosed, The electronic device includes an optical source configured to emit light to a detection area, a light concentrator configured to concentrate light reflected by a target object located in a detection area, a light receiver configured to receive through photodiodes the reflected light concentrated by the light concentrator and to output a light quantity pattern of the reflected light, and a processor configured to determine the position of the target object based on the light quantity pattern of the reflected light.

Abstract: The present application relates to a negative type photosensitive resin composition including a compound of Chemical Formula 1, an alkali soluble resin binder, a polyfunctional monomer, a colorant, a photoinitiator, and a solvent, and a display apparatus including a black bank formed by using the same.

Abstract: Provided is an image sensor having a hybrid pixel structure in which pixels that sense visible light and pixels that sense ultraviolet light or infrared light are arranged together. For example, the image sensor includes a plurality of first pixels and a plurality of second pixels that are different in size. A width of each of the plurality of second pixels in a horizontal direction is a first integer multiple of a width of each of the plurality of first pixels in the horizontal direction, and a width of each of the plurality of second pixels in a vertical direction is a second integer multiple of a width of each of the plurality of first pixels in the vertical direction. The image sensor enables the pixels sensing ultraviolet light or infrared light, which have different sizes from the pixels sensing visible light, to be efficiently arranged together with the pixels sensing visible light, on the same substrate.

Abstract: An X-ray apparatus includes an X-ray radiator configured to radiate an X-ray, and a controller acquiring orientation information of the X-ray radiator and orientation information of at least one X-ray detector, selecting the at least one X-ray detector based on the orientation information of the X-ray radiator and the orientation information of the at least one X-ray detector, and determining a power mode of the selected X-ray detector to be a power consumption mode and a power mode of an X-ray detector that is not selected, to be a power save mode.

Abstract: Provided are a chip-on-film (COF) semiconductor package capable of improving connection characteristics and a display apparatus including the package. The COF semiconductor package includes a film substrate, a conductive interconnection located on at least one surface of the film substrate and an output pin connected to the conductive interconnection and located at one edge on a first surface of the film substrate, a semiconductor chip connected to the conductive interconnection and mounted on the first surface of the film substrate, a solder resist layer on the first surface of the film substrate to cover at least a portion of the conductive interconnection, and at least one barrier dam on the solder resist layer between the semiconductor chip and the output pin.

Abstract: Provided is a refrigerator including: a body; a first storage compartment and a second storage compartment; a cold air generating unit; and a duct unit installed in front of the evaporator in the first storage compartment and including a first flow path on which the cold air is moved into the first storage compartment, a second flow path on which the cold air is moved into the second storage compartment, a first blower fan sending the cold air to the first flow path, a second blower fan sending the cold air to the second flow path, and a guide duct that partitions off the second flow path, wherein at least one cold air flowing portion is formed in the guide duct so that the first flow path and the second flow path are in communication with each other through the at least one cold air flowing portion.

Abstract: A film-type semiconductor package includes a metal lead portion arranged on a film substrate, a semiconductor chip including a pad, and a bump connecting the metal lead portion to the pad of the semiconductor chip. The bump includes a metal pillar arranged on the pad and including a first metal and a soldering portion arranged on an entire surface of the metal pillar, bonded to the metal lead portion, and including the first metal and a second metal that is different from the first metal.

Abstract: In one preferred embodiment, polymers are provided that comprise a structure of the following Formula (I): Photoresists that comprises such polymers also are provided.

Abstract: Manufacturing a glazing agent bread or pastry products maintaining intrinsic tastes and flavors without destroying unique layered shape or collapsing the products. First prepare solution A by mixing 3 to 4 parts weight refined sugar and 0.5 to 1.5 parts weight amidated pectin, add 27 to 28 parts weight purified water, and dissolve at 80 to 85° C. for 20 to 25 minutes, second prepare solution B by mixing 0.2 to 0.3 parts by weight citric acid, 46 to 48 parts by weight starch syrup and 0.02 to 0.05 parts by weight black rice flavoring, adding 20 to 21 parts by weight purified water, heating at 60 to 65° C. for 10 to 15 minutes to dissolve, and third gelling the solution A and solution B by heating at 90 to 95° C. for 20 to 25 minutes to gel, and cooling the resulting mixture to room temperature.

Abstract: Provided is a monitoring device that comprises; a port connected to a network interconnecting a plurality of units of an X-ray apparatus, and configured to transmit or receive data to or from each of the plurality of units; and a controller configured to control the port to perform communication with each of the plurality of units, and to monitor operational states of the plurality of units, based on the data.

Abstract: At least some example embodiments provide a fingerprint sensor, a fingerprint sensor package, and a fingerprint sensing system using light sources of a display panel. The fingerprint sensor includes an image sensor including a plurality of sensor pixels, the sensor pixels configured to sense light reflected by a fingerprint and generate image information corresponding to the fingerprint and a pinhole mask defining a plurality of pinholes, wherein each of the pinholes forms a focus for transmitting the light reflected by the fingerprint to the image sensor, wherein light is emitted from a plurality of organic light-emitting diodes (OLEDs) and is reflected by the fingerprint.