Patents by Inventor Jung-Wook Seo

Jung-Wook Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11469038
    Abstract: A coil electronic component includes a magnetic body in which internal coil parts are embedded, and a metal shielding sheet disposed on at least one of an upper portion and a lower portion of the magnetic body in a thickness direction, in which permeability of the metal shielding sheet is 100 times or higher than permeability of magnetic metal powder contained in the magnetic body.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: October 11, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kang Ryong Choi, Il Jin Park, Jung Wook Seo, Jong Ok Jeon, Won Sik Chong, Woo Jin Lee, Jung Young Cho
  • Patent number: 11367558
    Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 ?m to 28 ?m; the second magnetic metal particles have an average particle size of 1 ?m to 4.5 ?m; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.
    Type: Grant
    Filed: October 30, 2019
    Date of Patent: June 21, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Se Hyung Lee, Je Ik Moon, Jung Wook Seo, Jun Sung Lee, Woo Jin Lee, Kang Ryong Choi, Il Jin Park, Gwang Hwan Hwang
  • Patent number: 11342119
    Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.
    Type: Grant
    Filed: September 24, 2020
    Date of Patent: May 24, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
  • Patent number: 11342110
    Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.
    Type: Grant
    Filed: July 10, 2018
    Date of Patent: May 24, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seon Woo Oh, Hyung Jin Jeon, Jung Wook Seo, Young Seuck Yoo, Byoung Hwa Lee, Kwang Sun Choi, Kun Ho Koo
  • Patent number: 11225720
    Abstract: A magnetic powder contains magnetic particles, a first coating layer disposed on surfaces of the magnetic particles and containing a first glass, and a second coating layer disposed on the first coating layer and containing a second glass different from the first glass. A method of manufacturing magnetic powder includes preparing magnetic particles, forming a first coating layer containing a first glass on surfaces of the magnetic particles, and forming a second coating layer containing a second glass different from the first glass on the first coating layer.
    Type: Grant
    Filed: September 24, 2018
    Date of Patent: January 18, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Sung Jae Lee, Jung Wook Seo, Hiroyuki Matsumoto, Chul Min Sim, Jong Sik Yoon, Jong Suk Jung
  • Patent number: 11107614
    Abstract: A coil electronic component includes a body, a coil unit disposed in the body and having a multilayer structure. The coil unit includes a first coil pattern forming an upward turn with respect to a bottom surface of the body and a second coil pattern forming a downward turn with respect to the bottom surface of the body. The first and second coil patterns are disposed on at least two layers of the multilayer structure. The component additionally includes a first external electrode and a second external electrode disposed on the bottom surface of the body.
    Type: Grant
    Filed: August 30, 2018
    Date of Patent: August 31, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Jung Ho Cho, Jung Wook Seo, Young Seuck Yoo, Joong Won Park
  • Patent number: 11056275
    Abstract: A coil electronic component includes a body including ferrite, a coil portion embedded in the body, external electrodes electrically connected to the coil portion, and a magnetic permeability adjusting layer disposed in the body and including ferrite having a Curie temperature lower than that of the ferrite included in the body.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: July 6, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Young Seuck Yoo, Joong Won Park, Jung Wook Seo
  • Patent number: 10957475
    Abstract: A hybrid coil component in which a magnetic core generally included in a wire-wound type inductor and a core included in a multilayer type inductor are combined with each other. A winding coil may be wound around a magnetic core manufactured in advance and an encapsulant having a stacked structure of a plurality of magnetic sheets may encapsulate the winding coil wound around the magnetic core. In this case, a magnetic flux generated in the winding coil is arranged to be parallel to long axes of magnetic particles contained in the magnetic core and the encapsulant.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: March 23, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Young Seuck Yoo, Jung Wook Seo
  • Publication number: 20210005388
    Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.
    Type: Application
    Filed: September 24, 2020
    Publication date: January 7, 2021
    Inventors: Jung Min KIM, Bon Seok KOO, Jung Wook SEO, Yoon Hee LEE, Kun Hoi KOO
  • Patent number: 10734790
    Abstract: A composite electronic component includes an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes first and second discharge electrodes having a gap formed therebetween, a discharge layer disposed between the first and second discharge electrodes and in the gap, and a multilayer insulating layer covering the discharge layer and including at least two insulating layers having different breakdown voltage (BDV) values.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: August 4, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Hun Park, Kwang Jik Lee, Ju Hwan Yang, Jung Wook Seo, Sang Moon Lee
  • Patent number: 10707012
    Abstract: A chip electronic component includes a magnetic body including magnetic metal powder particles, an internal coil unit embedded in the magnetic body, and a cover unit disposed on at least one of upper and lower surfaces of the magnetic body and including a magnetic metal plate. The magnetic metal plate is cracked and includes a plurality of metal fragments.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Suk Jeong, Kang Heon Hur, Seong Jae Lee, Jung Wook Seo, Hiroyuki Matsumoto, Chul Min Sim, Jong Sik Yoon
  • Patent number: 10658116
    Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
  • Patent number: 10658117
    Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.
    Type: Grant
    Filed: February 8, 2019
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
  • Patent number: 10595450
    Abstract: A magnetic sheet for a communications module includes a magnetic material. The magnetic sheet includes crushed cracks in a first region and a second region disposed adjacent to the first region. Degrees of crushed cracks are different in the first region and the second region.
    Type: Grant
    Filed: April 20, 2016
    Date of Patent: March 17, 2020
    Assignee: WITS Co., Ltd.
    Inventors: Seung Min Lee, Jung Young Cho, Jung Wook Seo, Doo Ho Park
  • Publication number: 20200066437
    Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 ?m to 28 ?m; the second magnetic metal particles have an average particle size of 1 ?m to 4.5 ?m; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.
    Type: Application
    Filed: October 30, 2019
    Publication date: February 27, 2020
    Inventors: Se Hyung LEE, Je Ik MOON, Jung Wook SEO, Jun Sung LEE, Woo Jin LEE, Kang Ryong CHOI, Il Jin PARK, Gwang Hwan HWANG
  • Patent number: 10568194
    Abstract: A common mode filter includes a body including a filter portion and an electrostatic protection portion, first to fourth external electrodes disposed on an external surface of the body, a ground electrode disposed on the external surface of the body, a first coil included in the filter portion and electrically connected to the first and second external electrodes, and a second coil included in the filter portion and electrically connected to the third and fourth external electrodes. The electrostatic protection portion includes discharge electrodes electrically connected to at least one of the first to fourth external electrodes and the ground electrode, a discharge part including conductive particles, a first organic-inorganic composite insulating layer disposed on the discharge electrodes and the discharge part, a magnetic cover layer disposed on the first organic-inorganic composite insulating layer, and a first inorganic insulating layer.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: February 18, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Jik Lee, Sang Moon Lee, Hye Hun Park, Ju Hwan Yang, Jung Wook Seo
  • Patent number: 10559414
    Abstract: A wire-wound type inductor includes a core containing magnetic powder flakes and including a central portion and an outside portion, and a winding coil disposed in the core and wound around the central portion of the core, wherein the core has a coupling structure including first and second bodies, and the first and second bodies contain magnetic powder flakes having shape magnetic anisotropy, and long axes of the magnetic powder flakes are arranged in parallel with a direction in which a magnetic field of the winding coil is formed.
    Type: Grant
    Filed: August 16, 2017
    Date of Patent: February 11, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Soon Kwang Kwon, Young Seuck Yoo, Jung Wook Seo
  • Patent number: 10553344
    Abstract: A method of manufacturing a coil device and the coil device includes a base layer and a coil pattern formed on a surface of the base layer. The method of manufacturing a coil device includes forming a seed layer of a coil by bonding a copper foil to a base layer, etching to remove a portion of the copper foil, and plating a plating layer on the seed layer.
    Type: Grant
    Filed: October 5, 2016
    Date of Patent: February 4, 2020
    Assignee: WITS Co., Ltd.
    Inventors: Han Kim, Kang Heon Hur, Sang Jong Lee, Jung Wook Seo
  • Patent number: 10497505
    Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 ?m to 28 ?m; the second magnetic metal particles have an average particle size of 1 ?m to 4.5 ?m; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.
    Type: Grant
    Filed: March 28, 2017
    Date of Patent: December 3, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Se Hyung Lee, Je Ik Moon, Jung Wook Seo, Jun Sung Lee, Woo Jin Lee, Kang Ryong Choi, Il Jin Park, Gwang Hwan Hwang
  • Patent number: 10446320
    Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: October 15, 2019
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo