Patents by Inventor Jung-Wook Seo
Jung-Wook Seo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230186982Abstract: A semiconductor device includes an active area extending in a first direction, a first transistor including a first gate electrode and first source and drain areas disposed on the active area, the first source and drain areas being disposed at opposite sides of the first gate electrode, a second transistor including a second gate electrode and second source and drain areas disposed on the active area, the second source and drain areas being disposed at opposite sides of the second gate electrode, and a third transistor including a third gate electrode and third source and drain areas disposed on the active area, the third source and drain areas being disposed at opposite sides of the third gate electrode, and the first gate electrode, the second gate electrode, and the third gate electrode extending in a second direction different from the first direction. The second transistor is configured to turn on and off, based on an operation mode of the semiconductor device.Type: ApplicationFiled: February 3, 2023Publication date: June 15, 2023Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Sang-Yeop BAECK, Tae-Hyung KIM, Daeyoung MOON, Dong-Wook SEO, Inhak LEE, Hyunsu CHOI, Taejoong SONG, Jae-Seung CHOI, Jung-Myung Kang, Hoon KIM, Jisu YU, Sun-Yung JANG
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Patent number: 11655952Abstract: A vehicle grille includes: a grille panel; a lens panel disposed at a rear side of the grille panel, formed in a same shape as some or entire area of the grille panel, and, when a light is incident, configured to allow some of the light to propagate in the lens panel and emit some of the light to an outside of the lens panel; and a housing disposed on a rear surface of the lens panel, formed in a same shape as the lens panel, and including a coupling provision hole configured to allow a front surface of the lens panel to be coupled to a rear surface of the grille panel at a rear side of the lens panel, wherein the rear surface of the lens panel and a front surface of the housing are coupled at the front side of the lens panel.Type: GrantFiled: May 13, 2022Date of Patent: May 23, 2023Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, SL CorporationInventors: Byoung Suk Ahn, Jung Wook Lim, Ki Hong Lee, Seung Sik Han, Dong Hyun Go, Jung Hee Seo, Kyeong Jin Ahn
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Patent number: 11469038Abstract: A coil electronic component includes a magnetic body in which internal coil parts are embedded, and a metal shielding sheet disposed on at least one of an upper portion and a lower portion of the magnetic body in a thickness direction, in which permeability of the metal shielding sheet is 100 times or higher than permeability of magnetic metal powder contained in the magnetic body.Type: GrantFiled: September 20, 2018Date of Patent: October 11, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kang Ryong Choi, Il Jin Park, Jung Wook Seo, Jong Ok Jeon, Won Sik Chong, Woo Jin Lee, Jung Young Cho
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Patent number: 11367558Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 ?m to 28 ?m; the second magnetic metal particles have an average particle size of 1 ?m to 4.5 ?m; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.Type: GrantFiled: October 30, 2019Date of Patent: June 21, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Se Hyung Lee, Je Ik Moon, Jung Wook Seo, Jun Sung Lee, Woo Jin Lee, Kang Ryong Choi, Il Jin Park, Gwang Hwan Hwang
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Patent number: 11342110Abstract: An inductor includes a body including an internal coil having first and second end portions and an encapsulant encapsulating the internal coil and containing magnetic particles. First and second external electrodes are on external surfaces of the body and electrically connected to the internal coil. A first metal expansion portion encloses the first end portion while coming into direct contact with the first end portion of the internal coil, and may be between the body and the first external electrode. A second metal expansion portion encloses the second end portion while coming into direct contact with the second end portion of the internal coil, and may be between the body and the second external electrode.Type: GrantFiled: July 10, 2018Date of Patent: May 24, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Seon Woo Oh, Hyung Jin Jeon, Jung Wook Seo, Young Seuck Yoo, Byoung Hwa Lee, Kwang Sun Choi, Kun Ho Koo
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Patent number: 11342119Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.Type: GrantFiled: September 24, 2020Date of Patent: May 24, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
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Patent number: 11225720Abstract: A magnetic powder contains magnetic particles, a first coating layer disposed on surfaces of the magnetic particles and containing a first glass, and a second coating layer disposed on the first coating layer and containing a second glass different from the first glass. A method of manufacturing magnetic powder includes preparing magnetic particles, forming a first coating layer containing a first glass on surfaces of the magnetic particles, and forming a second coating layer containing a second glass different from the first glass on the first coating layer.Type: GrantFiled: September 24, 2018Date of Patent: January 18, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Sung Jae Lee, Jung Wook Seo, Hiroyuki Matsumoto, Chul Min Sim, Jong Sik Yoon, Jong Suk Jung
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Patent number: 11107614Abstract: A coil electronic component includes a body, a coil unit disposed in the body and having a multilayer structure. The coil unit includes a first coil pattern forming an upward turn with respect to a bottom surface of the body and a second coil pattern forming a downward turn with respect to the bottom surface of the body. The first and second coil patterns are disposed on at least two layers of the multilayer structure. The component additionally includes a first external electrode and a second external electrode disposed on the bottom surface of the body.Type: GrantFiled: August 30, 2018Date of Patent: August 31, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soon Kwang Kwon, Jung Ho Cho, Jung Wook Seo, Young Seuck Yoo, Joong Won Park
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Patent number: 11056275Abstract: A coil electronic component includes a body including ferrite, a coil portion embedded in the body, external electrodes electrically connected to the coil portion, and a magnetic permeability adjusting layer disposed in the body and including ferrite having a Curie temperature lower than that of the ferrite included in the body.Type: GrantFiled: June 11, 2018Date of Patent: July 6, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soon Kwang Kwon, Young Seuck Yoo, Joong Won Park, Jung Wook Seo
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Patent number: 10957475Abstract: A hybrid coil component in which a magnetic core generally included in a wire-wound type inductor and a core included in a multilayer type inductor are combined with each other. A winding coil may be wound around a magnetic core manufactured in advance and an encapsulant having a stacked structure of a plurality of magnetic sheets may encapsulate the winding coil wound around the magnetic core. In this case, a magnetic flux generated in the winding coil is arranged to be parallel to long axes of magnetic particles contained in the magnetic core and the encapsulant.Type: GrantFiled: November 7, 2017Date of Patent: March 23, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soon Kwang Kwon, Young Seuck Yoo, Jung Wook Seo
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Publication number: 20210005388Abstract: A multilayer capacitor and a method of manufacturing includes a conductive resin layer of an external electrode disposed on a first electrode layer. The conductive resin layer includes a conductive connecting part and an intermetallic compound contacting the first electrode layer and the conductive connecting part. The conductive connecting part contacts a plurality of metal particles and a second electrode layer, such that the 7 equivalent series resistance (ESR) of the multilayer capacitor is decreased and warpage strength of the multilayer capacitor is improved.Type: ApplicationFiled: September 24, 2020Publication date: January 7, 2021Inventors: Jung Min KIM, Bon Seok KOO, Jung Wook SEO, Yoon Hee LEE, Kun Hoi KOO
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Patent number: 10734790Abstract: A composite electronic component includes an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes first and second discharge electrodes having a gap formed therebetween, a discharge layer disposed between the first and second discharge electrodes and in the gap, and a multilayer insulating layer covering the discharge layer and including at least two insulating layers having different breakdown voltage (BDV) values.Type: GrantFiled: October 9, 2017Date of Patent: August 4, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Hun Park, Kwang Jik Lee, Ju Hwan Yang, Jung Wook Seo, Sang Moon Lee
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Patent number: 10707012Abstract: A chip electronic component includes a magnetic body including magnetic metal powder particles, an internal coil unit embedded in the magnetic body, and a cover unit disposed on at least one of upper and lower surfaces of the magnetic body and including a magnetic metal plate. The magnetic metal plate is cracked and includes a plurality of metal fragments.Type: GrantFiled: December 7, 2015Date of Patent: July 7, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jong Suk Jeong, Kang Heon Hur, Seong Jae Lee, Jung Wook Seo, Hiroyuki Matsumoto, Chul Min Sim, Jong Sik Yoon
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Patent number: 10658116Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.Type: GrantFiled: February 1, 2019Date of Patent: May 19, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
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Patent number: 10658117Abstract: A multilayer ceramic capacitor comprises a body including dielectric layers and internal electrodes; and external electrodes disposed on external surfaces of the body, respectively, wherein each of the external electrodes includes a first electrode layer disposed on the one surface of the body and contacting the internal electrodes; a conductive resin layer disposed on the first electrode layer and including a plurality of metal particles, a conductive connecting part surrounding the plurality of metal particles, a base resin, and an intermetallic compound contacting the first electrode layer and the conductive connecting part; and a second electrode layer disposed on the conductive resin layer and contacting the conductive connecting part.Type: GrantFiled: February 8, 2019Date of Patent: May 19, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Jung Min Kim, Bon Seok Koo, Jung Wook Seo, Yoon Hee Lee, Kun Hoi Koo
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Patent number: 10595450Abstract: A magnetic sheet for a communications module includes a magnetic material. The magnetic sheet includes crushed cracks in a first region and a second region disposed adjacent to the first region. Degrees of crushed cracks are different in the first region and the second region.Type: GrantFiled: April 20, 2016Date of Patent: March 17, 2020Assignee: WITS Co., Ltd.Inventors: Seung Min Lee, Jung Young Cho, Jung Wook Seo, Doo Ho Park
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Publication number: 20200066437Abstract: A magnetic composition includes first, second, and third magnetic metal particles. The first magnetic metal particles have an average particle size of 10 ?m to 28 ?m; the second magnetic metal particles have an average particle size of 1 ?m to 4.5 ?m; and the third magnetic metal particles include insulating layers disposed on surfaces thereof and have a particle size of 300 nm or less. Therefore, eddy current loss of an inductor having a body formed of the magnetic composition may be improved, and high efficiency and inductance of the inductor may be secured.Type: ApplicationFiled: October 30, 2019Publication date: February 27, 2020Inventors: Se Hyung LEE, Je Ik MOON, Jung Wook SEO, Jun Sung LEE, Woo Jin LEE, Kang Ryong CHOI, Il Jin PARK, Gwang Hwan HWANG
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Patent number: 10568194Abstract: A common mode filter includes a body including a filter portion and an electrostatic protection portion, first to fourth external electrodes disposed on an external surface of the body, a ground electrode disposed on the external surface of the body, a first coil included in the filter portion and electrically connected to the first and second external electrodes, and a second coil included in the filter portion and electrically connected to the third and fourth external electrodes. The electrostatic protection portion includes discharge electrodes electrically connected to at least one of the first to fourth external electrodes and the ground electrode, a discharge part including conductive particles, a first organic-inorganic composite insulating layer disposed on the discharge electrodes and the discharge part, a magnetic cover layer disposed on the first organic-inorganic composite insulating layer, and a first inorganic insulating layer.Type: GrantFiled: October 24, 2017Date of Patent: February 18, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Kwang Jik Lee, Sang Moon Lee, Hye Hun Park, Ju Hwan Yang, Jung Wook Seo
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Patent number: 10559414Abstract: A wire-wound type inductor includes a core containing magnetic powder flakes and including a central portion and an outside portion, and a winding coil disposed in the core and wound around the central portion of the core, wherein the core has a coupling structure including first and second bodies, and the first and second bodies contain magnetic powder flakes having shape magnetic anisotropy, and long axes of the magnetic powder flakes are arranged in parallel with a direction in which a magnetic field of the winding coil is formed.Type: GrantFiled: August 16, 2017Date of Patent: February 11, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Soon Kwang Kwon, Young Seuck Yoo, Jung Wook Seo
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Patent number: 10553344Abstract: A method of manufacturing a coil device and the coil device includes a base layer and a coil pattern formed on a surface of the base layer. The method of manufacturing a coil device includes forming a seed layer of a coil by bonding a copper foil to a base layer, etching to remove a portion of the copper foil, and plating a plating layer on the seed layer.Type: GrantFiled: October 5, 2016Date of Patent: February 4, 2020Assignee: WITS Co., Ltd.Inventors: Han Kim, Kang Heon Hur, Sang Jong Lee, Jung Wook Seo