Abstract: A semiconductor device includes: a substrate includes an active area; a first landing pad connected to the active area and disposed on the substrate; a second landing pad connected to the active area, and spaced apart from the first landing pad, wherein the second landing pad is disposed on the substrate; a first lower electrode disposed on the first landing pad and extending in a direction substantially perpendicular to the substrate; a second lower electrode disposed on the second landing pad and extending in the direction substantially perpendicular to the substrate; a dielectric layer extending along the first lower electrode and the second lower electrode; and an upper electrode disposed on the dielectric layer, wherein a first upper surface of the first landing pad is disposed below a second upper surface of the second landing pad with respect to a lower surface of the substrate.

Abstract: A peridynamic method having an added mirroring node according to embodiments of the present invention includes: a first step of calculating a shape tensor of a first node; a second step of calculating force state vectors of the first node and each of a plurality of second nodes by using the shape tensor; and a third step of calculating a peridynamic motion equation of the first node by using the force state vectors. The first node is a node located on a boundary of a structure and has a predetermined size horizon region, the plurality of second nodes is nodes in the horizon region, the plurality of second nodes includes one or more third nodes, and the third node is a second node having no node at a point which is origin-symmetrical based on the first node among the plurality of second nodes. In the first step, the shape tensor is calculated by using a position value in which the third node is origin-symmetrical based on the first node.

Abstract: A 3D printer with fine hole processing function in accordance with an embodiment of the present invention, comprises: a build plate, a first laser unit, and a second laser unit. The build plate is disposed in a photocurable liquid resin contained in a water tank. The first laser unit is disposed on the water tank and the photocurable liquid resin, and irradiates a first beam to the photocurable liquid resin on the build plate to cure and laminate the photocurable liquid resin one layer by one layer on the build plate thereby forming a structure. The second laser unit is disposed to be spaced apart from the first laser unit by a predetermined distance, and irradiates a second beam to the structure where the photocurable liquid resin is cured and deposited on the build plate thereby forming a fine hole. The first beam is an ultraviolet laser beam for curing, and the second beam is an ultraviolet solid laser beam having a laser drilling function.

Abstract: A peridynamic method having an added mirroring node according to embodiments of the present invention includes: a first step of calculating a shape tensor of a first node; a second step of calculating force state vectors of the first node and each of a plurality of second nodes by using the shape tensor; and a third step of calculating a peridynamic motion equation of the first node by using the force state vectors. The first node is a node located on a boundary of a structure and has a predetermined size horizon region, the plurality of second nodes is nodes in the horizon region, the plurality of second nodes includes one or more third nodes, and the third node is a second node having no node at a point which is origin-symmetrical based on the first node among the plurality of second nodes. In the first step, the shape tensor is calculated by using a position value in which the third node is origin-symmetrical based on the first node.

Abstract: A hard panel of wall and floor structures for reducing floor impact sound according to example embodiments includes patterned layer having different density and elastic modulus form a base layer. A transmission path of an acoustic wave may be changed in a lateral direction by passing the patterned layer and the sound energy is dissipated by the refection, refraction, and cancellation of the acoustic wave. Thus, a noise is reduced. The hard panel of the wall and floor structures according to example embodiments is effectively reduces the light and heavy impact sounds. In addition, the hard panel is formed by at least one patterned layer to refract and reflect the acoustic wave such that the floor noise may be effectively dissipated. The hard panel is further includes the sound absorbing material to absorb the noise passing through the hard panel such that the floor noise can be effectively reduced.

Abstract: A hard panel of wall and floor structures for reducing floor impact sound according to example embodiments includes patterned layer having different density and elastic modulus form a base layer. A transmission path of an acoustic wave may be changed in a lateral direction by passing the patterned layer and the sound energy is dissipated by the refection, refraction, and cancellation of the acoustic wave. Thus, a noise is reduced. The hard panel of the wall and floor structures according to example embodiments is effectively reduces the light and heavy impact sounds. In addition, the hard panel is formed by at least one patterned layer to refract and reflect the acoustic wave such that the floor noise may be effectively dissipated. The hard panel is further includes the sound absorbing material to absorb the noise passing through the hard panel such that the floor noise can be effectively reduced.